Innovative pcb solutions used in medical and other devices Made in Switzerland

Transcription

1 Innovative pcb solutions used in medical and other devices Made in Switzerland Chocolate Watches Money.PCB`s

2 innovative pcb`s... Customer = innovation driver Need to add more parts and I/O make smaller/thinner reduce costs make more reliable be stylish and easy to use to go anywhere to have heat management to be better than others

3 Presence -> Future Miniaturization Have to go Down to12.5µ (0.5mil) thick dielectric/adhesive layers for fine lines and spacing - 25µ (1mil) via size 50µ (2mil) 150µ (6mil) capture pad size 3-, 4- and 5-layer flex boards

4 Key Factors Thin dielectrics Thin base cu-layers Laser machining Advanced cu-plating processes Newest photo-resist technology Laser direct imaging LDI Accurate etching Universal final surface finish - ENEPIG Thin dielectrics Thin materials are needed for advanced laser machining and plating features Polyimide materials 12.5µ (0.5mil) thickadhesivless Single-/double side cladded with copper Acrylic adhesives 12.5µ (0.5mil) thick Thin FR4 based laminates/prepregs Handling problems (pcb manufacturing /assembly)

5 2-layer flex cu-filled via 2-layer flex cu-filled via

6 Thin base cu-layers We are using panel plating process => not pattern plating. We add the plated-cu also on the panel surface For accurate etching we need to have lowest culayer thickness (base-cu + plated-cu) as possible 5µ, 9µ and 12µ base cu-thickness is available on standard adhesiveless materials <5µ vapor-deposited-cu materials can be used as well. 8-layer rigid-flex

7 8-layer rigid-flex Laser machining UV-Laser type (cut different materials, small features) Accurate control of laser beam positioning and x-y table movement. Optical alignment system incl. stretch/shrink Drilling and cutting application

8 3-layer flex complex contour 3-layer flex complex contour

9 Advanced copper-plating processes Blind-via filling with cu (modified cu-plating line) old new Cu-via filling processes Two processes available Process 1: cu-via filling of pcb s containing only blind vias Process 2: cu-via filling of pcb s containing blind and through vias. Pros and cons.

10 Applications Saving space Applications Reliability (plating, assembly and final surface finish)

11 Applications Heat management issues s 25µ (1mil) thick 2-layer flex pcb`s Dielectric thickness: 25µ (1mil) Blind via diameter: 50µ (2mil) Base cu thickness: 5µ Plated cu thickness: 13-15µ Fill grade: 85% Final cu thickness 18-20µ (~0.8mil)

12 4-layer flex cu-filled via 4-layer flex cu-filled via

13 6-layer rigid high Tg-FR4 cu-filled via 6-layer rigid high Tg-FR4 cu-filled via

14 Heat management / chip packaging Heat management / chip packaging

15 Newest photo-resist technology Liquid photo resist Dry-film photo resist customized Very thin resist layer thickness Excellent adhesion on cu-surfaces Suitable for thin laminate application 25µ (1mil) line/space innerlayer / 3-layer flex-pcb

16 Laser direct imaging - LDI Orbotech Paragon 8800 Optical allignment incl. stretch/shrink Capability of doing 25µ (1mil) line/space Individual marking of delivery panels or single pcb`s for better tracking Soldermask can be processed Automatic loading/unloading Soldermask registration in Flip-Chip area

17 Accurate etching process Optimized CuCl2 acid solution for accurate etching automatic controlled Machine designed for thin laminate transportation Spray nozzles design to make sure that top and bottom etching is corresponding Approved process flow to garantee reliable results 40µ line / space smart card application

18 Universal final surface finish - ENEPIG Suitable for soldering, aluminum and gold wire bonding Replacement of electro-plated Au no plating bars necessary Complete covering of tracks including track side-walls Typical layer thicknesses: -Ni: 3-5µ -Pd: 0.2µ - 0.5µ -Flash-Au: 0.015µ µ Over 10 years experience in process control Optical signal converter

19 Summary - Outlook in the future Improved etching process Improved handling systems Improved resists technology Improved laser capabilities Improved laser direct imaging Improved plating processes..