CAPABILITIES OF SYNERGISE PCB INC

Transcription

1 CAPABILITIES OF SYNERGISE PCB INC 2 Surface Treatment Surface Treatment Selective Surface Treatment HASL, L/F HASL, ENIG, Immersion Silver, Hard Gold(Plated gold), Flash Gold, Immersion Tin/Silver, OSP ENIG+OSP, ENIG+Gold Finger, Flash Gold+HASL, Flash Gold+Gold Finger, Immersion Silver+Gold Finger, Immersion Sn 十 Gold Finger Layer Count Layer -70L for Prototype production, -2L for Amount production 4 Bow and Twist % 0.7( 0.5 needs process review) 5 Min Finished Size mm 0*0 6 Max Finished Size(Single,2L) mm 50*60( 2 x25 ) 7 Max Finished Size(2L+) mm 500*600( 20 x24") 9 Basic Multi-press for Blind/Buried Vias / Multi-press Cycle times(needs review for 2 cycles pressing) 0 Basic Finished Board Thickness mm ( 0.2mm need review), 0.4mm for HASL Tolerance For Finished Board Thickness(Board Thickness.0mm) mm ±0. 2 Tolerance For Finished Board Thickness(Board Thickness>.0mm) % ±0% Unspcified Finished Board Thickness Tolerance(no stack up requirements) mm Multilayer: 0.2mm can ±0.mm; 2.0mm-.0mm can ±0.5mm;.0mm can ±0.2mm; 2L:±0% 4 Peel Strength N/cm Flammability 94V-0 6 Reliable Test Ionic Contamination ug/cm2 7 Min Dielectric Thickness mm 0.075(only for HOZ Base Copper)/OZ if copper groud area>80% 8 Impedance Tolerance % ±5Ω(<50Ω); ±0%( 50Ω); 50Ω, ±5% needs review

2 No. Item High Tg Material 2 4 Base Material Material Type Prepreg Type Impedance Control Material RCC Material 5 Copper Foil Copper Foil FR-4 Prepreg LD-080(HDI) Scrubbing 2 Laminator,Exposer Etching Line Unit Others need review Needs Review um Capability Shengyi High Tg 70 & ITEQ High Tg 80 FR-4, FR-4 High Tg Series Copper foil thickness 2um, Dielectric Thickness 65,80,00um(After Pressing 55,70,90um) (Use 70um base copper, after plating 05um) mm, min 9*9inch mm, min 8*8inch, max 24*24inch mm, min 7*7inch Min Inner Line Width(8um copper foil, before compensation) Min Inner Line Spacing(8um copper foil,after compensation) Min Inner Line Width(5um copper foil, before compensation) Min Inner Line Spacing(5um copper foil,after compensation) Min Inner Line Width(70um copper foil, before compensation) Min Inner Line Spacing(70um copper foil,after compensation) Inner&Outer Min Inner Line Width(05um copper foil, before compensation) 6.0 Layer Image Min Inner Line Spacing(05um copper foil,after compensation).5 Transfer Inner Layer 2 Min Inner Line Width(40um copper foil, before compensation) 7.0 Min Inner Line Spacing(40um copper foil,after compensation) 8( 7s needs review) 4 Min Spacing from hole edge to conductive 6L 8(partial can 7) 8L 0 (partial can 9) 20L 2 (partial can ) 5 Min Inner Layer Annular Ring 4( 8,5um partial can.5) 6( 70um) 8( 05um) 6 Min Inner layer Isolation Clearance Couductive to Conductive 0min(partial can 8) Min Spacing from board edge to Conductive Min Gap width between copper groud Different Copper Thickness for Inner Core Max Finished Copper Thickness 8(except for blind vias) 0( blind vias) 5(5um base copper) 2pcs( 70um needs revies) 8/5 5/70(needs review) 5OZ(75um) OZ needs review

3 2 Min Outer Line Width(6-2um base copper, before compensation) (achieve copper thickness 0um-5um) 22 Min Outer Line Width(6-2um base copper,afte compensation) Min Outer Line Width(8um base copper, before compensation) 4(achieve copper thickness 5um-40um) 24 Min Outer Line Width(8um base copper,after compensation).0 25 Min Outer Line Width(8um base copper, before compensation) Min Outer Line Width(8um base copper,after compensation) Min Outer Line Width(70um base copper, before compensation) Outer Layer Min Outer Line Width(70um base copper,after compensation) Spacing from Line to Pad, pad to pad(after compensation).5( 2um), 4.0( 8um 5um), 5.5( 70um), 6.5( 05 40um) 0 Inner&Outer Min Outer Line Width(05um base copper, before compensation) 7.0 Layer Image Transfer Min Outer Line Spacing(05um base copper, after compensation) Min Outer Line Width(40um base copper, before compensation) 8.0 Min Outer Line Spacing(40um base copper, after compensation) Min Grid Line Width 5( 2 8 5um), 0( 70um) 5 Min Grid Line Spacing 5( 2 8 5um), 8( 70um) 6 Min Hole Pad Diameter 2( 0.0mm mechanical or Laser Drill) 7 Max size for slot tenting 5mm*mm; the tent land should >0 8 Max diameter for tenting hole Min tent land width Capablility Min annular ring(after compensation, except for blind vias) 4( 2 8um) partial.5, 4.5( 5um), 6( 70um), 8( 05um), 0( 40um) 4 Min BGA diameter 0( Flash Gold 8)

4 Orbotech SK-75 AOI / Board Thickness mm, Dimension: max2.5*2.5inch AOI 2 Orbotech Ves / Board Thickness mm, Dimension: max2.5*2.5inch can process 2nd MT-CNC2600 Drill mm, max8.5*26inch 0.20mm drill drill 2 Min Muti-hit drill bit size mm 0.55 Max Aspect Ratio for board thickness vs drill bit size / 0:( except for 0.2mm drill bit) 4 Hole location tolerance(compare with CAD data) ± 5 Counterbore Hole PTH&NPTH, Top Angle 0, Top Diameter <6.mm 6 Min spacing from hole edge to conductive(except for blind vias) 6( 8L) 7( 0L) 8( 4L) 2( 26L) 7 Drill Bit size mm max6.5mm, min0.5mm( mechanical drill bit) 8 Max board thickness for 0.20mm drill bit size mm 2.5 Drilling 9 Min multi-hit slot width mm Capability Hole size tolerance for press fit ±2 Min PTH slot dimension tolerance mm ±0.5 2 Min NPTH slot dimension tolerance mm ±2( min+0, or +0.05, -0) Min spacing from hole edge to conductive(blinded&buried board) 9 ( cycle pressing); 0 (2 cycle pressing); 2 ( cycle pressing); 4 Max board thickness for 0.5mm mechanical drill mm.20( 8L) needs review 5 Min hole size for laser drill mm 0.0( Depth 55um), 0.( Depth 80um), 0.5( Depth 00um) 6 Countersink hole angle&diameter Top 82, 90,20 degree, diameter 0um needs review

5 Panel&Pattern plating line board thickness mm, dimension max24*0inch 2 Deburring board thickness mm, dimension max8*8inch can process 2nd Desmear Line board thickness mm, dimension max24*2inch desmear 4 Tin Plating Line board thickness mm, dimension max24*0inch 5 Min hole wall coppper thickness um average 25, min 20 6 Finished copper thickness(2um base copper) 8 Wet 7 Finished copper thickness(8um base copper) um 5 (nominal thickness 52um or.5oz) 8 Finished copper thickness(5um base copper) um 50 (nominal thickness 65um) 9 Capability Finished copper thickness(70um base copper) um 85 0 Min Line width for ectching marking 8( 2 8um), 0( 5um), 2( 70um) Max Finished Copper Thickness for Inner&Outer layers / Outer Layer 6oz, Inner Layer 4oz 2 Different copper thickness / 8/5 5/70 8/5 5/70(needs review)

6 Scrubbing / Thickness mm, Demension min9*9inch 2 Exposer / Thickness mm, Demension min25*2inch Develop / Thickness mm, Demension min4*5inch 4 / Gree,Yellow, Black, Blue, White, Matte Green Color 5 Silk Screen Color / White, Yellow, Black 6 Min Solder Mask Opening(Clearance)(After compensation) 2( partial.5 for Flash Gold, others can partial ) only for 8um and 5um 7 Max plugged vias size mm 8(min 7) 8 Min width for line coverage by S/M 2 per side, only apply to 8um and 5um base copper 9 Min solder mask legends width 8(min 7) 0 Min S/M thickness um 0.0 Solder Mask Min S/M thickness for via tenting um Min carbon oil line 0.0 Solder Mask Min carbon oil line space Capability Min tracer of carbon Min carbon oil line trace Min spacing from carbon pattern to pads 0 70um base copper 2 7 Min width for peelable mask cover line/pads Min solder mask bridge width Base copper OZ, Black,white&matte ink are 6s, other inks are 4s. Base copper 2-4OZ, min bridge width is 6 s 9 Solder mask hardness H 6

7 Min spacing from peelable mask pattern to pads Peelable Max diameter for peelable mask tent hole(by screen printing) mm 2.0 Mask Capability Max diameter for peelable mask tent hole(by Aluminum printing) mm Component Peelable mask thickness mm Mark Min Component Mark line width and height(2 8um base copper) / Line width 4.5; Height: 2 6 Component Min Component Mark line width and height(5um base copper) / Line width 5; Height: 27 7 Mark Capability Min Component Mark line width and height( 70um base copper) / Line width 6s; Height: 45(State double printing on Lot Card) 8 Min Spacing from legends to pads 7.0 Max Gold Finger Length inch Nickel Thickness for ENIG um -5um Gold Thickness for ENIG um Nickel Thickness for Gold Finger um -5um 5 Gold Thickness for Gold Finger um Min Tin Thickness for HASL um 0.4(Copper Groud) can process 2nd 7 HASL Board Thickness mm; Dimention min5*5inch, max20*25inch Surface HASL Surface 8 Treatment Treatment Gold Finger surface treatment Flash Gold/ENIG; Flash Gold/Hard Gold Capability 9 Plating Au u'' -5( normal u'') 0 Plating Nickel u'' ( normal 20u'') Min ENIG&OSP pad space Immersion Gold Board Thickness mm; Dimension min6*6inch, max2*27inch Immersion Tin Thickness um Immersion Silver Thickness um OSP Thickness um

8 Flying Probe Tester Board Thickness mm, Dimention max9.6*2.5inch 2 Min Spacing from test pad to board edge mm 0.5 Min Conductive Resistance Ω Max Insulation Resistance MΩ Electronic 5 Test Max Test Voltage V Min Test Pad Diameter Min Test Pad to Pad Spacing Max Test Current MA Profiling Type / NC-Routing, V-CUT, Slot Tabs, Stamp Hole 2 NC Routing can process 2nd Routing Board Thickness mm; Dimention max25.5*2.5inch <0.8mm for one V-CUT Board Thickness mm, Max board width for V-CUT: 8inch side only 4 Min Routing Bit Diameter mm Outline Tolerance(Line to Line) ±4(Complicated outline, slot need review) 6 V-CUT Angle Type 20, 0, 45, 60 7 V-CUT Angle Tolerance ±5 8 Profiling V-CUT Registration Tolerance ±4 9 V-CUT Web Thickness Tolerance ±2 0 Min Gold Finger Spacing(After Compensation) 6.0 Min Spacing to avoid gold finger tab bevelled mm 7(For Auto-Bevelling) Capability 2 Bevelling Angle Tolerance / ±5 Bevelling Remain Thickness Tolerance ±5 4 Min Inner Radius mm Min Spacing from Conductive to Outline Countersink or Counterbore Depth Tolerance mm ±0.0

9 Thank You