Technical Capabilities Non Standard Technologies. CML pcbs from just around the corner

Transcription

1 Technical Capabilities Non Standard Technologies PAGE 1

2 Capabilities Rigid Layer Count 1-12 layer (above 12 layer see HDI) mm (> 3.2 mm on request) Finished Board Thickness Tolerance: +/-10% Core thickness min mm for inner layer Max. Production Panel Size 520 mm x 620 mm Max. PCB size 450 mm x 600mm Bow & Twist 0.7% Min. Line Width/ Line Space 0.075mm Min. Hole Size (Finished) Mechanical Laser Laminate Main Brands: Shengyi, Kjngboard, Ventec, ITEQ, Doosan Solder Mask Color Main brands: Tamura, Taiyo, OTC, Huntsman Surface Finish Profiling Additional Technology 0.2mm 0.1 mm CEM-1 CEM-3 CTI 600 FR-4 Maximum Tg 170 Anti CAF Halogen free Green (glossy semi-matte matte) Blue Black HAL (leadfree) Immersion Nickel Gold Galvanic Nickel Gold Immersion Tin Immersion Silver Routing Depth Routing Tolerance: Punching V-scoring Jump V-scoring BT epoxy PTFE Ceramic High frequency materials Aluminum substrate Copper substrate White Red OSP Peelable solder mask Gold Finger Carbon Ink Print HDI boards (micro via, blind via, buried via) Resin plugging of via holes, copper plugging of micro via Silver Through Hole Press-fit hole PAGE 2

3 Base Material Type Description Application CEM 1 CEM 3 FR4 FR5 Aluminum Substrate Copper Substrate Hard paper core and epoxy resin / glass fiber Single -layer PCB Epoxy resin / non woven glass epoxy resin / glass fiber Epoxy resin / glass fiber FR5 = FR4 with high Tg PCB with Aluminum Substrate PCB with Copper Substrate Single-layer and double layer PCB Plated through holes Double-layer and Multilayer PCB Single layer PCB with improved heat dissipation Single -, Double and Multilayer PCB with improved heat dissipation Possible FR4 characteristics Tg ( C): 130 / 150 / 170 Low CTE Halogen free CAF Resistent CTI: >100 >600 Tg: Glass Transition Temperature CTE: Coefficient of thermal expansion CAF: Conductive Anodic Filament CTI: Comparative Tracking Index PAGE 3

4 Copper Thickness in accordance IPC-A600 Double Side (DS) and Multilayer (ML) outer layer Weight (Oz) µm Copper Thickness nominal Cu min. IPC 4562 (raw material) "base copper" Absolut copper min. (less 10% reduction) Plus minimum plating +20µm (equivalent to IPC class 1 and 2) Plus minimum plating +25µm (equivalent IPC class 3) Maximum variable processing allowance reduction Minimum surface conductor thickness after processing (DS and ML outer layer) "final thickness" equivalent to IPC class 1 und 2 equivalent to IPC class 3 1/8 6 5,10 µm 4,59 µm 24,59 µm 29,59 µm 1,50 µm 23,1 µm 28,1 µm 1/4 9 8,50 µm 7,65 µm 27,65 µm 32,65 µm 1,50 µm 26,2 µm 31,2 µm 3/ ,00 µm 10,80 µm 30,80 µm 35,80 µm 1,50 µm 29,3 µm 34,3 µm 1/ ,10 µm 15,39 µm 35,39 µm 40,39 µm 2,00 µm 33,4 µm 38,4 µm ,30 µm 30,87 µm 50,87 µm 55,87 µm 3,00 µm 47,9 µm 52,9 µm ,60 µm 61,74 µm 81,74 µm 86,74 µm 3,00 µm 78,7 µm 83,7 µm ,90 µm 92,61 µm 112,61 µm 117,61 µm 4,00 µm 108,6 µm 113,6 µm ,20 µm 123,48 µm 143,48 µm 148,48 µm 4,00 µm 139,5 µm 144,5 µm Single Side (SS) and Multilayer (ML) inner layer Hole copper thickness Weight (Oz) µm nominal Cu according IPC 4562 (raw material) Absolut copper min. (less 10% reduction) Maximum variable processing allowance reduction Minimum final finish after processing (SS + ML inner layer) 1/8 6 5,10 µm 4,59 µm 1,50 µm 3,1 µm 1/4 9 8,50 µm 7,65 µm 1,50 µm 6,2 µm 3/ ,00 µm 10,80 µm 1,50 µm 9,3 µm 1/ ,10 µm 15,39 µm 4,00 µm 11,4 µm ,30 µm 30,87 µm 6,00 µm 24,9 µm ,60 µm 61,74 µm 6,00 µm 55,7 µm ,90 µm 92,61 µm 6,00 µm 86,6 µm ,20 µm 123,48 µm 6,00 µm 117,5 µm copper - average Thin areas (minimum) Class 1 Class 2 Class 3 20 µm average 20 µm average We suggest specifying the nominal copper thickness + min. plating. The final thickness will be the result optional to the plating thickness. 25 µm average min. 18 µm min. 18 µm min. 20 µm PAGE 4

5 Copper Thickness Copper thickness in PTH: 25µm (IPC-6012B Class 3) 20µm (IPC-6012B Class 2) Base Copper Line width Inner layer Line space Final copper Class 2 Final copper Class 3 Line width Outer layer Line space ½ oz (18µm) 80µm 80µm 33,4µm 38,4µm 100µm 100µm 1oz (35µm) 100µm 100µm 47,9µm 52,9µm 120µm 120µm 2oz (70µm) 150µm 150µm 78,7µm 83,7µm 180µm 180µm 3oz (105µm) 200µm 200µm 108,6µm 113,6µm 250µm 250µm Inner layer: Base copper is nominal thickness, the min. thickness after processing is Base copper minus 10% minus 3µ Outer layer: Final copper is the min. thickness after plating according to IPC 6012 Class 2 PAGE 5

6 Drilling K I A D H Aspect ratio (A:T) 1:8 if T<2mm B C F G 1:6.5 if T>2mm with T=LP thickness No. Description Specification A Plated hole diameter Diameter: mm Tolerance: +0.08/ -0.07mm B Non plated hole diameter Diameter: mm Tolerance: +/-0.05mm CD Distance hole to hole Tolerance: +/-0.08mm Tolerance second drill: +/-0.125mm FH Drilled slot width Width: 0.6mm min. FG Plated slot size Tolerance: +/-0.08mm (F) +/-0.1mm (G) HI Non plated slot size Tolerance: +(-0.05mm (H) +/-0.08 (I) K Hole to circuitry Tolerance: +/-0.1mm PAGE 6

7 Routing/ Scoring C D A L G E H F B J K I No. Description Specification A Routing bit Diameter: min 0.8mm Standard routing path 2mm or more B Distance edge to edge routing Tolerance: +/-0.10mm I Distance edge to edge scoring Tolerance: +/-0.1mm CD Distance hole to edge Tolerance: +/-0.10mm JK Distance hole to edge scoring Tolerance: +/-0.15mm EG Milled slot width Width: 0.8mm min. EF Plated slot size Tolerance: +/-0.13mm GH Non plated slot size Tolerance: +/-0.10mm L Edge to circuitry Tolerance: +/-0.15mm PAGE 7

8 Finish Surface Finish Surface thickness Solderability OSP No direct thickness measurement 6 months HAL / HAL LF 1-40µm 12 months Chem. Ni/Au Ni 3.5-6µm / Au µm 12 months Electrolytic Ni/Au Ni >3µm Flash gold µm Hard gold µm 12 months Chem. Sn Min. 1µm 9 months Chem. Ag µm 6 months PAGE 8

9 Impact of finishing on assembly HASL (SnPb) HASL (lead free) ENIG OSP Immersion Ag Immersion Sn Electrolytic (hard) Au RoHs Compliant No Yes Yes Yes Yes Yes Yes Fabrication costs + Standard Shelf life 12 month 12 month 12 month 6 month 6 month 9 month 12 month Assembly Cycles Multiple Multiple Multiple Multiple Multiple Multiple No soldering Rework Yes Yes No Yes No Yes No Co- Planarity Poor Poor Excellent Excellent Excellent Excellent Excellent Solder Joint Integrity Final surface finishing Low resistance/ high speed Excellent Good Good Good Excellent Good No soldering Yes Yes Yes No No No Yes No No No N/A Yes No No PAGE 9

10 Solder mask C A B No. Description Standard Special request A Solder mask bridge 100µm On request B Solder mask opening 100µm (annular) 50µm (annular) C Solder mask offset 100µm 50µm Based on green solder mask and surface HAL LF. In case of other solder mask colors / surfaces, the values could be different. PAGE 10

11 Via plugging IPC4761 III a: Covered with UV cured solder mask after surface finishing. Advantages: surface finishing in the vias; no chemical residue in the vias Disadvantages: higher risk of residue on surface (depends on distance via to pad) IPC4761IV: Plugged one side with solder mask wet in wet (filling rate min. 70%) and covered with solder mask both sides. Advantages: common process; no price impact Disadvantages: restricted hole diameter (ideal 0.4mm) CML: IPC4761 V/ VI: Plugged with resin (filling rate 100%). Type VI covered with solder mask/ V without. Advantages: no restricted hole diameter Disadvantages: cost impact IPC4761 VII: Plugged with resin and capped with copper Advantages: no restricted hole diameter; via in pad application possible Disadvantages: cost impact PAGE 11

12 Process Flow Multilayer Clean the core Laminate with photoresist Expose the photoresist Develop the photoresist Laminate the panel Cut the edges of the panel X-Ray drilling of location holes Strip the photoresist Punch the inner layer Oxidize the inner layer Etch the copper Drilling Laser drilling Clean the holes (desmear) Chemical Cu + Panel Plating Clean the outer layer Laminate, expose and develop the photoresist Clean the outer layer Print the Solder mask, dry, expose, develop and cure it Surface finishing, routing, cleaning, packaging Strip the photoresist Etch the copper and strip the tin Pattern Plating (Cu + Sn) PAGE 12

13 Process Flow Multilayer Incoming Quality Audit Pattern Plating Outgoing Inner D/F D/F Stripping D/F Packing Inner etching QC checking Etching FQC Stripping D/F Panel Plating Tin-Lead stripping Entek/ Imm. Tin Inner AOI PTH QC checking E-Test Oxide QC checking Redrilling Outline Lamination Drillimg Solder mask Surface PAGE 13

14 List of common abbreviations A/C Automatic Controlled G/F Gold Finger Plating PPE Pre-production Engineering AOI Automatic Optical Inspection HAL Hot Air Leveling Press Pressing A/W Art Work IDF Inner Dry Film PROD Production Department BC Board Cut IE Inner Etching PSM Peelable Solder mask BO Black Oxidation IPA In-process Audit PTH Plating Trough Holes Che.Lab Chemistry Laboratory IPQA In-process Quality Audit PUN Punching CLE Clearing IPQC In-process Quality Check Purch Purchase Department C/M Component Mark IQC Incoming Quality Control QA Quality Assurance C/NK Carbon Ink Printing M/C Manual Controlled QC Quality Control DEBUR Deburring ME Manufacturing Engineering ROUT Routing DEAM Desmear MKT Market Department SLOT Key Slotting D/F Dry Film MRB Material Review Board S/M Solder Mask DFS Dry Film Stripping P&A Personal & Admin Department TLS Tin Lead Stripping DRI Drilling PACK Packing V-CUT V-Cutting EM Equipment Maintenance PHY Physical laboratory W/F Wet Film Solder Mask ETCH Etching PLA Pattern Plate 2DRI 2 nd Drill E-T E-Test PLUG Solder mask Plug Hole F/E-T Final E-Test PMC Production Material Control FQA Final Quality Audit PP Panel Plate FQC Final Quality Check PPC Production Plan Control PAGE 14

15 Non Standard Technology PAGE 15

16 Agenda Non standard Technology HDI Thermal Management Bendable board Flex/ Rigid-Flex PAGE 16

17 Non standard Technology HDI Technology PAGE 17

18 HDI overview PAGE 18

19 Capabilities HDI Layer Count 58 layer Finished Board Thickness Min. 0.5mm/ max. 10mm Material FR4, high Tg FR4, Halogen free, Rogers, BT, PTFE, mixed materials, etc. Min. Finished Hole Size Min. Line Width / Spacing 0.2mm (mechanical drilling) 0.075mm (laser drilling) Inner layer: 0.075/ 0.075mm Outer layer: 0.10 / 0.10mm Max. Copper thickness 6oz / 210µm (UL certificated) Max. panel size 2 layer: 1400mm x 610mm Multilayer: 1100mm x 610mm Max. Aspect Ratio Through hole 15:1 (advanced 18:1) Micro via 0.8:1 (advanced 1:1) Surface Finish HAL (lead-free) Immersion Nickel Gold Galvanic Nickel Gold Immersion Tin Immersion Silver OSP Selective OSP Special Technology Resin Plug; capped vias (via in pad); SBU (sequential build-up); Stacked micro vias; PAGE 19

20 Non standard Technology Thermal Management PAGE 20

21 Thermal Management Metal Substrate PCB Aluminum substrate Copper substrate PAGE 21

22 Thermal Management Special solutions to improve heat dissipation of power components per technology Metal Substrate PCB Request: High thermal conductivity and in the same time best electrical insulation Aluminum substrate SS board Not all surfaces possible Copper substrate Better physical characteristics Better thermal conductivity as Alu (70%) Lower expansion coefficient as Alu (30%) Compatible with all PCB processes SS, DS and Multilayer All surfaces possible PAGE 22

23 Thermal Management Base Material Circuitry Layer Dielectric Layer Base Layer (Aluminum/ Copper substrate) Aluminum substrate Ventec VT 4B5 Thermal conductivity 4.2 W/ mk Ventec VT 4B3 Thermal conductivity 3.0 W/ mk Ventec VT 4A2 Thermal conductivity 2.2 W/ mk Totking QB-AL Thermal conductivity 1 to 5 W/ mk depends on type Copper substrate Doosan DST 7000-HC Thermal conductivity 1.3 W/ mk Ventec VT 4B3 Thermal conductivity 3.0 W/mK S1000-H / copper plate C1100P + Prepreg S1000HB PAGE 23

24 Thermal Management CML advanced layer-stack-up copper substrate Final thickness: 1,1mm +/-10% Finishing Solder mask: edge min 5µm/ copper 10µm Base copper: 18µm + plating 25µm Pre-preg: 80µm Copper substrate: 1mm Finishing Thermal Laser via non filled copper filled PAGE 24

25 Thermal Management Capabilities - Metal Substrate PCB Layer Count Aluminum 1 layer, Copper >1layer Finished Board Thickness on request Max. PCB size Depending from used material type Bow & Twist 0.7% Min. Line Width/ Line Space 0.1mm Laminate Solder Mask Color Main brands: Tamura, Taiyo, OTC, Huntsman Surface Finish Main brands: Shengyi, Ventec, Totking, Doosan Green (glossy semi-matte matte) Blue Black HAL (leadfree) Immersion Nickel Gold Immersion Tin Immersion Silver White Red OSP Peelable solder mask Profiling Routing Depth Routing Tolerance: Punching V-scoring Jump V-scoring (copper substrate on request) PAGE 25

26 Thermal Management Punching Metal Substrate PCB Note: use the correct routing path in case of punching for serial production. Routing and drilling tolerances are same as for standard technologies. Description Specification Distance edge to edge Tolerance: +/-0.1mm Distance hole to edge Tolerance: +/-0.10mm Punched slot width Width: min. 0.8mm Plated slot size (copper substrate) Tolerance: +/-0.13mm Non plated slot size Tolerance: +/-0.10mm Edge to circuitry Tolerance: +/-0.15mm PAGE 26

27 Thermal Management Finish surface Metal Substrate PCB Finish Surface OSP* No direct thickness measurement 6 months HAL / HAL LF* 1-40µm 12 months Chem. Ni/Au** Ni 3.5-6µm / Au µm 12 months Electrolytic Ni/Au** Ni >3µm Flash gold µm Hard gold µm 12 months Chem. Sn** Min. 1µm 9 months Chem. Ag** µm 6 months Note: * We recommend OSP and HAL LF for aluminium substrate. **aluminium from the outline edge and holes will contaminate the surface chemistry. Solution depends on design and factory. PAGE 27

28 Non standard Technology Bendable Board PAGE 28

29 Bendable Board A: Overlap Flex coating on Solder Resist B: Angle inside the depth routing slot C: Depth routing slot width D: Spacing Depth routing slot and copper E: Remaining thickness Bending cycles Bending Angle 0,1mm 45 Customer request, depends on bending angle 0,7mm Customer request, as min. 1 x Prepreg + Copper + Solder Mask 1 x bend in shape Depends on depth routing slot width PAGE 29

30 Bendable Board CML developing projects PAGE 30

31 Bendable Board CML test lab equipment PAGE 31

32 Non standard Technology Flex and Rigid-Flex PAGE 32

33 Capabilities Flex and Rigid-Flex Lot Size Prototypes up to Mass Production Layer Count Finished Board Thickness Rigid-Flex: 2 10 Layer Flex: 1 8 Layer Rigid-Flex: mm Flex: mm Max. Production Panel Size Laminate Main Brands: Aplus, Innox (Flex), Shengyi (Rigid) Solder Mask Color Main Brands: Taiyo 250mm x 1000mm (2L) 250mm x 500 mm (ML) Rigid FR-4 Green Yellow Amber Flex CCL (PI and PET) Coverlay (PI and PET) Copper (RA and ED) Blue Black White Surface Finish HAL HAL LF Immersion Nickel Gold Galvanic Nickel Gold Immersion Tin OSP Immersion Silver Profiling Lead Time Punching (Mass Production) Laser Cutting (Sample Production) Routing (Sample Production) Express service: 4 days (FCA HK) Mass Production: 4-5 weeks (FCA HK) Stiffener PSA (pressure sensitive adhesive) TSA (thermal sensitive adhesive) Materials: FR-4, Aluminum, PI, PET, 3M Tape PAGE 33

34 Flex and Rigid-Flex Flex PCB - Special materials Substrate: PI (polyimide film) 12.5 / 25µm Conductor: Cu (Roll-Annealed or Electro-Deposit copper foil) 12/18/35µm Adhesive: AD (epoxy or acrylic adhesive) 10 to 40µm Bond Sheet: BOND (epoxy or acrylic sheet) 25 to 50µm Coverlay: PI-AD (polyimide film-adhesive-release paper) Stiffener: PI, FR4, Stainless Steel, Aluminum Solder mask: Flexible solder mask Copper Clad Laminate (CCL): Single-sided CCL: Cu-AD-PI Single-sided adhesive less CCL: Cu-PI Double-sided CCL: Cu-AD-PI-AD-Cu Double-sided adhesive less CCL: Cu-PI-Cu PAGE 34

35 Flex and Rigid-Flex Flex PCB special process roll to roll production Laminate of photoresist on flexible laminate Automatic exposure PAGE 35

36 Flex and Rigid-Flex Flex PCB Examples/ stack up 1 layer: Layer 1 2 layers: Plated hole Layer 1 Layer 2 PAGE 36

37 Flex and Rigid-Flex Rigid-Flex PCB Examples/ stack up PAGE 37

38 Flex and Rigid-Flex LAY ER 4 Layer ITEM SPECIFICATION 두께 Rigid Flexible Rigid PSR INK 30.0 μm Cu Plating 17.0 μm L1 CCL Copper Foil 18.0 μm L2/L 3 COVE RLAY FCCL COVE RLAY PREPREG 80.0 μm PREPREG 80.0 μm Polyimide 12.5 μm 12.5 Adhesive 25.0 μm 25 Cu Plating 11.0 μm Copper 18.0 μm Polyimide 25.0 μm Copper 18.0 μm Cu Plating 11.0 μm Polyimide 12.5 μm 12.5 Adhesive 25.0 μm 25 PREPREG 80.0 μm PREPREG 80.0 μm L4 CCL Copper Foil 18.0 μm Cu Plating 17.0 μm PSR INK 30.0 μm TOTAL THICKNESS THICKNESS Tolerance 0.5T±10% 0.5T±10% 4L Type Flow Process L2/L3FCCL (double side Base) Roll Cutting Inner Layer Drill Black Hole Electro Copper Plating Surface Pretreatment Inner Layer Lamination inner Layer Development Etch / Stripping 2-3L Cover Lay Attachment Shape 2-3L Cover lay hot press 1 st Guide Punching Plasma Treatment Out Layer Total Hot Press Laser Drill Drill Desmear Direct Metallization Electro Copper Plating Surface Pretreatment Dry Film Lamination Out Layer Exposure Out Layer Development Etch / Stripping AOI Guide Punching Surface Pretreatment PSR Stipper & Cover Lay Attachment Hot Press ENIG EMI shield Attachment Total Hot Press EMI Shield releasing paper removal Marking Ink Printing 1st Outline Press SUS Stiffener Attachment Hot Press BBT 2nd Outline Press inspection PAGE 38

39 pcbs from just around the corner PAGE 39