High currents in safe paths

Transcription

1 High currents in safe paths Webinar November 3 rd 2015 Speaker: Andreas Schilpp

2 topics Flex-rigid technology with thick copper layers Update Design Rules Wirelaid Update UL-Listing Wirelaid 3D high current around the corner without connectors Design Rules of classic thick copper Seite 2

3 Flex-rigid technology with thick copper layers Application: high reliability, miniaturizised mainborads, i.e. in aerospace Seite 3

4 introduction The basics have already been covered in detail by several webinars. Please find them in our Webinar Archive or at page 4

5 power path with WIRELAID customer s requirement : 20K (35µm base copper) 0,63mm² 8,9mm 4,5mm 1,9mm with WIRELAID reduction of 78,7% width WIRELAID cross sectional area - wire track over wire (35µm base copper) combination of power & logic on same layer width Standard track (35µm base copper) Reduction Routing area F14 0,5mm² 1,9mm 8,9mm 78,7% page 5

6 Frequently asked questions from our customers FAQ of WIRELAID-Technique from experience 1. Wirelaid pcbs how to assemble and solder them? 2. Do we need a special EDA tool for the design? Are there special design rules? page 6

7 Standard Processing Partiall High Current Technology WIRELAID The pcbs could be designed, produced, assembled, soldered, tested and transported / stored as used to. Seite 7

8 Wirelaid stack-ups itegraded in Zuken CADstar Standard stack-ups 4 layers 6 layers 8 layers Seite 8

9 Design Guide Amendment Lessons learned from many projects old: simplified rules for wire design new: design rule distance wire - drills calculation of covering track Seite 9

10 Power feeding through power elements Press-Fit Powerelements: general statement in the past: wires must not be drilled! page 10

11 Design Guide Amendment Distance wire - drill: Parameter A3 A3 = 1,2mm + half final drill diameter Seite 11

12 Design Guide Amendment X-ray pictures: Seite 12

13 Design Guide Amendment Width of the welding pad, Width of a covering track with same potential Seite 13

14 Design Guide Amendment Marking of fixed welding points 1. Generally all production related welding points are defined by the producer: start and end points as well as intermediate points 2. If there is need for fixed welding points due to i.e. connection of components, this has to be defined by the design on a separate helping layer: fixed welding point on separate gerber layer! Symbol 1mm Seite 14

15 Example of fixed welding point Fixed welding point have to be defined i.e. for connecting components Seite 15

16 Design Guide Poster NEW available soon on our website in english language Seite 16

17 High Current around the corner embedded wires crossing the bending and breaking area (indicated in red) assembly soldering testing forming Option for miniaturisation saving of high current connectors and cables Seite 17

18 News from UL UL: Kategorie ZPMV2/8 Full Recognition according UL796 Standard FR4: 94 V-0, hightg FR4: 94 V-1 MOT 130 C CTI 2 Standard DSR ALL Seite 18

19 Applications with busbars high expenditure very high ampacity special customer processes needed pcb thickness and weight rising seriously partiall high current technology could be a reasonable alternative, especially if there is a need for size and weight reduction. Seite 19

20 Thick copper: Design on inner layers preferably high copper filling rate ( > 85%) fill in copper into free areas symmetrical stack-up is important corners and sharp edges in the copper layout should be replace by radii (>1,5mm) 6oz (205,7µm) copper: line spacing 0,45mm regard minimal copper thickness for 6oz according to IPC-6012/IPC-4562: 179µm (10% tolerance, -6µm for processing) Seite 20

21 Thick copper: Design on outer layers symmetrical stack-up uniformly copper distribution (>40%) avoid solitary conductors multiple coating with soldermask avoid prints like legend print option of thick copper inside: cuplayer immersion solder services regard minimal copper thickness for 6oz according to IPC-6012/IPC-4562: 206µm (10% tolerance, 25µm plating class 3, -4µm for processing) 6oz (205,7µm) copper: line spacing 0,65mm Seite 21

22 summary flex-rigid with 2oz copper on flex material partially thick copper enabling high current at the same layer with logic circuitry enabling thin copper layers and thus combination with HDI Technique could be combined with Semiflex enables excellent heat dissipation extending life span of thermally critical components we also offer this copper up to 6oz - please ask us! page 22

23 Thank you very much for your attention!