Optimalisation of the PCB design and PCB production to control cost
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1 Optimalisation of the PCB design and PCB production to control cost Edward Snelleman 1
2 Introduction Q.P.I. Group 1988 started to be active in the field of PCB supply/development and PCB Design 2015 member of the FineLine Global Group FineLine Global is world wide active Q.P.I. active in Belgium, Netherlands, Luxemburg and Poland, Czech republik, Slovakia, Hungary and Romania Q.P.I. has a well equiped laboratory for PCB investigations in the Netherlands Rigid, Flex, Flex rigid, Stretch, Metalcore 2
3 Lower prices! Optimize the design in a early phase is far smarter to control the cost and quality than endless negotiations at the end 3
4 Introduction cost optimized PCBs Know the process of PCB manufacturing PCB Design responsible for good circuitry design, BUT also for good PCB manufacturability IPC standards are great support for the process Which PCB embodiment, ultimately result in which cost 4
5 Is it simple? Many IPC standards Interaction processes Lots of choices Many manufacturing options 5
6 Steps in the chain creating electronics Development Design PCB Manu facturing PCB Assembly Application 6
7 Cost optimized PCB PCB manufacturing cost items 7
8 Manufacturing cost items PCB process cost considerations The control of the cost of PCB production starts at the early phase of the PCB Design. In some cases even at the circuitry development. (pe. Impact on the materials, dimensions of the PCB) The basis is information laid down in standards like IPC-2220 IPC-2226 The cost factors can be divided in three groups 1. Group 1, Very important 2. Group 2, Important 3. Group 3, Less important 8
9 Cost factors group 1, very important The size of the PCB Material usage, panel usage, yield Number of layers Complexity of the PCB The base material choice 9
10 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa The size of the PCB The rule is simple The bigger the PCB, the higher the cost for manufacturing 10
11 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Material usage, panel usage, yield The panel usage indicates the part of the production panel really used for PCBs. Usage good Usage low 11
12 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Material usage, panel usage, yield 77,8% = 12
13 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Material usage, panel usage, yield 58% = 13
14 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Number of layers Cost relation is simple: increase of the layer count increase the cost of the PCB 2 Layer 8 Layer 14
15 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Number of layers Layer cost difference depends on the manufacturer Among others due to the production equipment and capabilities Change 1L in 2L: increase about: 2L in 4L: 4L in 6L: 6L in 8L: 8L in 10L: 10L in 12L: 35 40% 30 40% 30 35% 30 35% 20 30% 20 30% Typical cost goes up linear with number of layers 15
16 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Material usage, panel usage, yield Design Phase Relation to production quantities is important! Prototypes Large quantities Usage panel Layer Material Important factor Depends, pe layer Less impact 16
17 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Complexity of a PCB The impact of some minor design changes 75/75 µm structure Buried Vias drilled 0,3 mm Buried Vias annular ring 150 µm PTH Via drilled 0,3 mm PTH Via annular ring 150 µm Microvia drilled 0,1 mm Microvia annular ring 75 µm Copper in PTH Via 20 µm PCB thickness 1,2 mm Design change 75/75 µm structure Buried Vias drilled 0,2 mm Buried Via Restring 120 µm PTH Via drilled 0,2 mm PTH Via Restring 120 µm Microvia drilled 0,1 mm Microvia Restring 60 µm Copper in PTH Via 20µm PCB thickness 1,2 mm Cost 100% Cost 113% Source: AT&S 17
18 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Complexity of a PCB The field of PCB technology is so broad, that a simple overview of the technical possibilities and features in this framework is impossible However, to provide an orientation we have created a: "Technology basic cost index" In chapter 4 it will be explained in more detail 18
19 Cost factors group 1, very important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Base material choice Material choice more critical with increase of frequency Material Type Material-supplier Cost factor Phenolic FR4 ITEQ FR4 range 0,9-1,3 High Speed / Mid Low Loss Nelco EP 1,2 High Speed / Low Loss Nelco EPSI 3x High Speed / Low Loss Panasonic Megtron 6 4x Polyimide Nelco N x High Frequency Arlon 25N 4x High Frequency Rogers 4350B, RO4003 5x BT Packaging Substrate Nelco N x PTFE Based Microwave Materials Rogers 3000, 5000, x - 50x 19
20 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Cost factors Group 2 Track lay-out - geometry etc. Controlled impedance Minimal drill diameter and the quantity of drilldia. Copper thickness Gold thickness Additional mechanical tolerances For group 1 cost impact logical, For Group 2 and 3 cost impact per manufacturer is much higher. Typical Group 2 and 3 depends very much on the available equipment. 20
21 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Track layout Avionics sample Digital broadband receiver Signal layer with micro via Differences in track layout: this difference has significant impact on the production and therefore cost 21
22 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Controlled impedance Additional process steps and space on the panel for the test coupons result in extra, in case of impedance controlled lines Stack-up of a testcoupon 22
23 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Drill diameter and the number of holes The simple formula Smaller drill hole More drills More diameters The more the cost increases less important Dimensions Drill of 0,3mm, 300µm 2. Human hair 70 µm 3. Micro via 50 µm 23
24 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Copper thickness Shortage issues for copper foils due to increase demand for electrical cars cost went up Copper inner layer topography compensation needs additional prepreg Raw copper price development USD 24
25 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Gold thickness Connector / hard gold finish Gold in trough hole vias can equal outer layer surface gold Gold price from 2000 onwards, cost per once in USD 25
26 Cost factors group 2, important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Additional mechanical tolerances Again, the variance between the manufacturers is very large. Any deviation from the standard causes costs! 26
27 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Cost factors Group 3, impact less Different type of finish PCB Thickness Contour PCB, routing Soldermask Legend Performance Class: IPC Class 2/3 etc. 27
28 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Cost comparison surface finishes Costly: NiPdAu and hard gold/connector Impact of finish cost goes down by number of layers 28
29 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa PCB Thickness Standard thickness 1,6mm Thinner: >= 0,8mm same cost sometimes lower, but also higher cost is possible, depends on the manufacturer Thinner than 0,8mm limited manufacturers can do, cost will be higher A thickness more than 1,6mm will always be more expensive Important! The aspect ratio of the vias for cost and manufacturability 29
30 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa PCB Thickness Example dimensions: Aspect ratio 1:10 Drill 0,2 Ø mm 2 mm thickness max. Finished Ø 0,15mm Aspect ratio 1:16 alternative manufacturer could be required 30
31 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Contour of the PCB, routing Routing cost varies between manufacturers substantially Among others equipment has impact on cost Z-Axis, controlled depth routing, is cost sensitive. Substantial variation capability manufacturers Significant cost variation between various manufacturers can be seen 31
32 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Solder mask Additional cost in case of tight tolerances Par example, application of soldermask with LDI 32
33 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Legend Legend is not a real cost factor Serialisation is at extra cost 33
34 Cost factors group 3, less important Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Performance Class: IPC Class 2-3 The technical requirements between Class 2 and 3 are rather small. Of 105 in the IPC-6012B described properties only 12 properties do differ between the two classes. Higher cost for conform Class 3 manufactured PCB is mainly caused by a much higher test effort and the additional material for test coupons. 34
35 Cost optimized PCB Determine the PCB process cost 35
36 Determine the PCB process cost Using a 12-layer PCB, the following examples show how different variants and features affect the complexity of the circuit board manufacturing process cost To keep the overview we determine the: Technology basic cost index for HDI PCBs We restrict ourselves to 7 cost-intensive processing steps. There are many more additional processing steps, but with this 80% - 20% rule a good starting point is defined 36
37 Important cost-intensive factors 1. Inner-layer process 2. Copper plating process 3. Multi-layer pressing 4. Mechanical drilling 5. Laser drilling 6. Vias copper capped 7. Vias copper filled A few samples, more samples are in the download presentation! 37
38 Cost index for PCB manufacturing 12 Layer PCB with through hole via Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 0 Vias copper capped 0 Vias copper filled 0 Cost index total 8 Innerlayer process does change with layer count Cost index total 10L = 7 Cost index total 14L = 9 38
39 Cost index for PCB manufacturing 12 Layer PCB with through hole via; Blind via 1:6 Inner layer process 4 Copper plating process 2 Multi-layer pressing 3 Mechanical drilling 2 Laser drilling 0 Vias copper capped 0 Vias copper filled 0 Cost index total 11 39
40 Cost index for PCB manufacturing 12 Layer PCB with through hole via; Blind via 1:6; 7:12 Inner layer process 4 Copper plating process 3 Multi-layer pressing 2 Mechanical drilling 3 Laser drilling 0 Vias copper capped 0 Vias copper filled 0 Cost index total 12 40
41 Cost index for PCB manufacturing 12 Layer PCB with through hole via; Blind via 1:4; 9:12; buried via 5:8 Inner layer process 3 Copper plating process 4 Multi-layer pressing 4 Mechanical drilling 4 Laser drilling 0 Vias copper capped 0 Vias copper filled 0 Cost index total 15 41
42 Cost index for PCB manufacturing 12 Layer PCB with through hole via; via in pad Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 0 Vias copper capped 1 Vias copper filled 0 Cost index total 9 42
43 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and blind via 1:6; via in pad Inner layer process 4 Copper plating process 2 Multi-layer pressing 3 Mechanical drilling 2 Laser drilling 0 Vias copper capped 2 Vias copper filled 0 Cost index total 13 43
44 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and blind via 1:4; 1:8; via in pad Inner layer process 3 Copper plating process 3 Multi-layer pressing 4 Mechanical drilling 3 Laser drilling 0 Vias copper capped 3 Vias copper filled 0 Cost index total 16 44
45 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2 Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 1 Vias copper capped 0 Vias copper filled 0 Cost index total 9 45
46 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 12:11 Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 2 Vias copper capped 0 Vias copper filled 0 Cost index total 10 46
47 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 12:11; copper filled and capped Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 1 Vias copper capped 1 Vias copper filled 1 Cost index total 11 47
48 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 12:11; 11:10 staggerd vias Inner layer process 4 Copper plating process 2 Multi-layer pressing 2 Mechanical drilling 1 Laser drilling 4 Vias copper capped 0 Vias copper filled 0 Cost index total 13 Quelle: TTM / Fineline 48
49 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 12:11; 11:10 stacked vias Inner layer process 4 Copper plating process 2 Multi-layer pressing 2 Mechanical drilling 1 Laser drilling 4 Vias copper capped 2 Vias copper filled 2 Cost index total 17 Quelle: TTM / Fineline 49
50 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 12:11; buried via 2:11 Inner layer process 4 Copper plating process 2 Multi-layer pressing 2 Mechanical drilling 2 Laser drilling 2 Vias copper capped 0 Vias copper filled 0 Cost index total 12 50
51 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 12:11; stacked buried via 2:11; copper capped Inner layer process 4 Copper plating process 2 Multi-layer pressing 2 Mechanical drilling 2 Laser drilling 2 Vias copper capped 1 Vias copper filled 0 Cost index total 13 51
52 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 12:11; copper filled and capped; stacked buried via 2:12; copper filled and capped Inner layer process 4 Copper plating process 2 Multi-layer pressing 2 Mechanical drilling 2 Laser drilling 2 Vias copper capped 1 Vias copper filled 1 Cost index total 14 52
53 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 12:11; 11:10; stacked, copper filled and capped; Buried Via 2:11 Inner layer process 4 Copper plating process 2 Multi-layer pressing 2 Mechanical drilling 2 Laser drilling 4 Vias copper capped 2 Vias copper filled 2 Cost index total 18 53
54 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 12:11; 11:10; stacked, copper filled and capped; Buried Via 3:10 Inner layer process 3 Copper plating process 3 Multi-layer pressing 3 Mechanical drilling 2 Laser drilling 4 Vias copper capped 2 Vias copper filled 2 Cost index total 19 54
55 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 3:4; 12:11; 11:10; 10:9; stacked, copper filled and capped; Buried Via 3:10 Inner layer process 3 Copper plating process 3 Multi-layer pressing 3 Mechanical drilling 2 Laser drilling 6 Vias copper capped 3 Vias copper filled 3 Cost index total 23 55
56 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 3:4; 12:11; 11:10; 10:9; stacked, copper filled and capped; Blind Via 1:2; 2:3 + Buried Via 3:10; stacked Inner layer process 3 Copper plating process 3 Multi-layer pressing 3 Mechanical drilling 2 Laser drilling 6 Vias copper capped 3 Vias copper filled 3 Cost index total 23 56
57 Cost index for PCB manufacturing 12 Layer PCB with through hole via Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 0 Vias copper capped 0 Vias copper filled 0 Cost index total 8 Innerlayer process does change with layer count Cost index total 10L = 7 Cost index total 14L = 9 57
58 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 12:11; copper filled and capped Inner layer process 5 Copper plating process 1 Multi-layer pressing 1 Mechanical drilling 1 Laser drilling 1 Vias copper capped 1 Vias copper filled 1 Cost index total 11 58
59 Cost index for PCB manufacturing 12 Layer PCB with through hole via; and micro vias 1:2; 2:3; 3:4; 12:11; 11:10; 10:9; stacked, copper filled and capped; Buried Via 3:10 Inner layer process 3 Copper plating process 3 Multi-layer pressing 3 Mechanical drilling 2 Laser drilling 6 Vias copper capped 3 Vias copper filled 3 Cost index total 23 59
60 Cost Total Care - Ontzorging - Rundum-Versorgung Kompleksowa obsługa Relative cost HDI 1x Pressing 100% % Laser Drill 1 to 3 120% Microvias Inner layer Staggered Vias 2x Pressing 140% 1 + 6b + 1 Buried Vias Mechan. Drilling 150% 2 + 4(6b) + 2 Microvias innerlayer Staggered + Buried Vias 2 to 7 Complexity 3x Pressing 175% 2 + 4b + 2 Microvias Innerlayer Staggered + Buried Vias 3 to 6 Source: Fineline Global 60
61 Remark and Conclusion What counts is the equation A higher manufacturing cost index, but less material usage could still be a more cost effective solution Larger PCB surface but better component placing can result in lower overall cost Repair an option? Is it possible? Creating the option for repair could result in lesser total owner cost Design hours savings per PCB X PCB produced For optimal result, the PCB cost control must start as early as possible, if possible at the conception of a new product At the PCB design moment the cost of PCBs can be really influenced 61
62 Thanks for your attention Q.P.I. Group B.V. Schootense Dreef HZ Helmond Netherlands Tel.:
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