Webinar. Project planning & EDA demonstration.

Transcription

1 Webinar Project planning & EDA demonstration

2 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Jürgen Wolf Würth Elektronik GmbH & Co. KG Product Manager Embedding Technology Page 2

3 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 3

4 Embedding Technology ET Solder: Embedded SMD components ET Solder process flow Core with footprint for soldering combined solder resist solder solder outer inner thin core layer resist nd bottom assembled top cut surface 2 prepreg copper prepregs and copper core and core foil foil structuring assembly frames core adhesion solder surface promoter Assembly (SMD lead free solder reflow) Multilayer pressing Remaining PCB processes Technology Embedding Webinar March 2017 Würth Elektronik GmbH & Co. KG Page 4

5 ET Solder: Embedded SMD components Embedding of standard SMD components Page 5

6 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 6

7 ET Microvia: Embedded active and passive devices ET Microvia process flow Assembly (gluing / sintering / soldering) Multilayer pressing Drilling of vias and microvias Plating and structuring Page 7

8 Existing Solutions ET Microvia vs. ET Solder ET Microvia ET Solder Page 8

9 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 9

10 ET Flip-Chip: Embedded active devices ET Flip-Chip process flow Core with footprint for Flip-Chip Assembly (Flip-Chip ACA) Multilayer pressing Remaining PCB processes Page 10

11 Customer-specific solutions robust RFID-Tags Customer-specific RFID-Tags Assembly of RFID chip (anisotropic conductive adhesive ACA) on inner layers Extremely robust build-up by the use of FR4-materials Customized configuration by altering the outer geometries and the antenna structures even beyond several layers Page 11

12 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 12

13 Procedures for PCB projects with embedded components Needed Documents and Data for a first implementation planning Inner layer assembly data set BOM (Bill-of-Materials) of components to be embedded Including all mechanical dimensions (X, Y and Z-axis) Including all mechanical dimension tolerances Pick & Place file (if already exists) Planned/desired assembly drawings on inner layer (including the real component edges in combination with Gull-Wing and J-Leads Designator Valu nhib, RST ANT PROG R1, R2, R3, R4, R6, R8, R9, R10, R11, R13, R14 100k R12, R15, R16, R18, R19 N.C. R17, R20 10 R5, R7 10k T1, T2 N.C. U2 L1, L3 2.2uH L2 1uH AUX N.C. J1, J2, J3 FL1 U1 C1, C6, C7, C9, C10, C15, C16, C21, C22, C23, C27 100n C12 1uF C13, C14 22uF C18, C19, C20 4.7uF C2, C3 6.2pF C24, C25 100u C4, C5, C26 10pF C8, C11, C17 10uF XT2 XT Embedding Technology Webinar March 2017 Würth Elektronik GmbH & Co. KG Page 13

14 Procedures for PCB projects with embedded components Needed Documents and Data for a first implementation planning PCB data set (preferred Extended Gerber or ODB++) and documents Board outline (including PCB array design if required) Layout files (if already available) Required number of layers and the necessary Cu thicknesses Required layer connections Predefined spacing between layers (e.g.for impedances or insulation requirements) Embedding Technology Webinar March 2017 Würth Elektronik GmbH & Co. KG Page 14

15 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 15

16 Design and layout? EDA-Tools for Embedding Technology: The latest versions of these tools: Allegro PCB Designer Miniaturization Option Further tools possible, but with limitations Page 16

17 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 17

18 Design and layout Part Library? EDA-Tools for Embedding Technology: Main differences between these tools Embedding Technology capable tools: Central part libraries, footprints may be moved to any layer of the layout schematic stack-up Altium 3D description resistor 0402 top layer resistor 0402 layer 2 resistor 0402 layer 3 flipped resistor 0402 layer 4 resistor 0402 layer 5 flipped Page 18

19 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 19

20 Design and layout Solder Resist on Inner Layers? Intricacies of EDA-Tools for Embedding Technology: ET Solder inner layer solder mask So far, most EDA tools do not support inner layer solder mask layers Additional mechanical layer(s) needed for solder mask on inner layers Page 20

21 Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects EDA Live Demonstration (Altium) Part Library Solder Resist for Inner Layers Part Outline Page 21

22 Design and layout Part Outline? Additional mechanical layer needed for part outline Needed for calculation of cut-outs in prepregs Rule of thumb: Components shell be grouped so that every point within the cut-out must be reachable in less then 5 mm from the edge of the cut-out due to resin flow Embedding Technology Webinar March 2017 Würth Elektronik GmbH & Co. KG Page 22

23 Design Rules Embedding Technology Design Rules Design Guide with description, hints and rules available, either printed or online All PCBs with embedded components are based on these Design Guides: Basic Design Guide, HDI Design Guide, Flex-Rigid Design Guide and Thermal Management Design Guide depending on the used technologies Available as download: Page 23

24 Thank you for your attention! Merci de votre attention! Köszönöm a fig yelmüket! Grazie per la vostra attenzione! Takk for oppmer ksomheten! Gracias por su atención! Tak for deres opmær ksomhed! Kiitos mielenkiinnosta! Tack för er uppmär ksamhet! Děkuji Vám za pozor nost! Dziękuję za uwa gę! Dank u voor uw aandacht! Vielen Dank für Ihre Aufmer ksamkeit! Contact details: Product Management Embedding Technology Würth Elektronik GmbH & Co. KG Circuit Board Technology Rudolf-Diesel-Straße Rot am See Germany Tel.: embedding@we-online.com Page 24