AG302-86PCB. Product Features. Product Description. Functional Diagram. Applications. Typical Performance (1) Specifications (1)
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1 AG-6 Product Features DC 6 MHz. db 9 MHz +. dbm 9 MHz +6 dbm OIP@ 9 MHz Single Voltage Supply Internally matched to Ω Robust V ESD, Class C Lead-free/green/RoHS-compliant SOT-6 package Applications Mobile Infrastructure CATV / FTTX WLAN / ISM RFID WiMAX / WiBro Product Description The AG-6 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 9 MHz, the AG-6 typically provides. db gain, +6 dbm OIP, and +. dbm PdB. The device combines dependable performance with consistent quality to maintain MTTF values exceeding years at mounting temperatures of + C and is housed in a leadfree/green/rohs-compliant SOT-6 (micro-x) industrystandard SMT package. The AG-6 consists of a Darlington-pair amplifier using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG-6 will work for other various applications within the DC to 6 GHz frequency range such as CATV and WiMAX. Functional Diagram RF In GND GND Function Pin No. Input Output/Bias Ground, RF Out Specifications () Parameter Units Min Typ Max Operational Bandwidth MHz DC 6 Test Frequency MHz 9 Gain db.6 Input Return Loss db Output Return Loss db Output PdB dbm +. Output IP () dbm +.9 Output IP dbm +7 Noise Figure db. Test Frequency MHz 9 Gain db... Output PdB dbm +. Output IP () dbm + Device Voltage V. Device Current ma Typical Performance () Parameter Units Typical Frequency MHz 9 9 S db..6.. S db S db Output PdB dbm Output IP dbm Noise Figure db..... Test conditions: ºC, Supply Voltage = + V, Rbias =. Ω, Ω System.. OIP measured with two tones at an output power of - dbm/tone separated by MHz. The suppression on the largest IM product is used to calculate the OIP using a : rule. Absolute Maximum Rating Parameter Rating Storage Temperature - to + C DC Voltage + V RF Input Power (continuous) + dbm Thermal Resistance, Rth C/W Junction Temperature +77 C Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. AG-6G AG-6PCB Description Standard tape / reel size = pieces on a reel (lead-free/green/rohs-compliant SOT-6 Package) 7 MHz Fully Assembled Eval. Board WJ Communications, Inc Phone --WJ- FAX: sales@wj.com Web site: Page of March
2 AG-6 Typical Device RF Performance Supply Bias = + V, R bias =. Ω, I cc = ma Frequency MHz 9 9 S db S db S db Output PdB dbm Output IP dbm Noise Figure db Test conditions: T = º C, Supply Voltage = + V, Device Voltage =. V, Rbias =. Ω, Icc = ma typical, Ω System.. OIP measured with two tones at an output power of - dbm/tone separated by MHz. The suppression on the largest IM product is used to calculate the OIP using a : rule.. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Return Loss 6 I-V Curve S, S (db) S S - 6 Device Current (ma) Optimal operating point.... Device Voltage (V) Output IP vs. Frequency Output IP vs. Frequency OIP (dbm)... OIP (dbm) -c +c +c 6... PdB vs. Frequency Output Power / Gain vs. Input Power frequency = 9 MHz Output Power / Gain vs. Input Power frequency = MHz PdB (dbm) Gain Output Power Input Power (dbm) - Output Power (dbm) 6 Gain Output Power Input Power (dbm) - Output Power (dbm) WJ Communications, Inc Phone --WJ- FAX: sales@wj.com Web site: Page of March
3 AG-6 Typical Device RF Performance (cont d) Supply Bias = +6 V, R bias = Ω, I cc = ma Output IP vs. Frequency Output IP vs. Frequency OIP (dbm)... OIP (dbm) -c +c +c 6 PdB vs. Frequency PdB (dbm) Typical Device RF Performance Supply Bias = + V, R bias = Ω, I cc = ma Output IP vs. Frequency Output IP vs. Frequency OIP (dbm)... OIP (dbm) -c +c +c 6 PdB vs. Frequency PdB (dbm) WJ Communications, Inc Phone --WJ- FAX: sales@wj.com Web site: Page of March
4 AG-6 Vcc Icc = ma Application Circuit R Bias Resistor C Bypass C. µf RF IN C Blocking AG-6 L RF Choke C Blocking RF OUT Recommended Component Values Reference Designator 9 9 L nh nh 6 nh 7 nh nh nh nh C, C, C. µf pf pf 6 pf 6 pf 6 pf 9 pf. The proper values for the components are dependent upon the intended frequency of operation.. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. Value / Type Size L 9 nh wirewound inductor 6 C, C 6 pf chip capacitor 6 C. µf chip capacitor 6 C Do Not Place R. Ω % tolerance 6 Typical Device Data Recommended Bias Resistor Values Supply R value Size Voltage V. ohms 6 6 V ohms 7 V ohms 6 V ohms 9 V 7 ohms V 6 ohms V ohms The proper value for R is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of + V. A % tolerance resistor is recommended. S-Parameters (V device = +. V, I CC = ma, T = C, calibrated to device leads) Freq (MHz) S (db) S (ang) S (db) S (ang) S (db) S (ang) S (db) S (ang) Device S-parameters are available for download from the website at: WJ Communications, Inc Phone --WJ- FAX: sales@wj.com Web site: Page of March
5 AG-6 AG-6G (Green / Lead-free Sot-6 Package) Mechanical Information This package is lead-free/green/rohs-compliant. It is compatible with both lead-free (maximum 6 C reflow temperature) and leaded (maximum C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Outline Drawing Product Marking The component will be marked with an W designator followed by a two-digit numeric lot code on the top surface of the package. The obsolete tin-lead package is marked with a D designator followed by a two-digit numeric lot code. Tape and reel specifications for this part are located on the website in the Application Notes section. MSL / ESD Rating Land Pattern ESD Rating: Class C Value: Passes V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD-A ESD Rating: Class IV Value: Passes V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD-C MSL Rating: Level at +6 C convection reflow Standard: JEDEC Standard J-STD- Mounting Config. Notes. Ground / thermal vias are critical for the proper performance of this device. Vias should use a.mm (# /. ) diameter drill and have a final plated thru diameter of. mm (. ).. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink.. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.. RF trace width depends upon the PC board material and construction. 6. Use oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. WJ Communications, Inc Phone --WJ- FAX: sales@wj.com Web site: Page of March
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