"All in one Package The Packaging Solution of the Future?

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2 "All in one Package The Packaging Solution of the Future? Rainbow Yuan, AT&S SIP China 2017 AT&S (China) Company Limited 奥特斯 ( 中国 ) 有限公司 No.5000 Jin Du Road Xinzhuang Industry Park Shanghai P.R. China Tel info@cn.ats.net

3 Outline Company Overview What is Driving System Integration? Road to All in One Package System Integration Concepts Embedding in Laminate AT&S solution for Integration Summary 1

4 Outline Company Overview What is Driving System Integration? Road to All in One Package System Integration Concepts Embedding in Laminate AT&S solution for Integration Summary 2

5 AT&S a world leading high-tech PCB and IC substrates company High-end interconnect solutions for Mobile Devices, Automotive, Industrial, Medical Applications and Semiconductor Industry Continuously outperforming market growth # 3 in high-end technology worldwide 9,526 employees 814.9m revenue in FY 2016/17 # 1 manufacturer in Europe Cost-competitive production footprint with 6 plants in Europe and Asia 3

6 Global footprint ensures proximity to supply chain & cost efficiency European production facilities: high mix/low volume Asian production facilities: high volume/low mix Sales network spanning three continents 9,526 employees* AT&S plants AT&S sales offices Plant Leoben, Austria Headquarters Staff: 977* Plant Fehring, Austria Staff: 372* Plant Nanjangud, India Staff: 1,134* Plant Chongqing, China In ramp phase Staff: 2,083* Plant Shanghai, China Staff: 4,583* Plant Ansan, Korea Staff: 300* * Average, FTE, FY 2016/17; 77 employees in other locations 4

7 AT&S Business Unit MS Digital Still Cameras, Smart Watches, Wearables, Action Cams, Gaming Devices Mobile Devices & Substrates Tablets Server, Notebook, Desktop, Ultrabook Smart Phones 5

8 AT&S Business Unit AIM Control, Instrumentation and Sensors Automotive, Industrial & Medical Medical Aviation & Security Automotive 6

9 AT&S Business Unit AP Battery Management Systems MEMS Optical Transceiver Audio Codec Wireless Modules Power Modules Solid State Drives ECP Embedded Component Packaging 7

10 Outline Company Overview What is Driving System Integration? Road to All in One Package System Integration Concepts Embedding in Laminate AT&S solution for Integration Summary 8

11 GLOBALIZATION NEW WORK MOBILITY INDIVIDUALIZATION URBANIZATION NEO-ECOLOGY Megatrends towards 2030 SILVER SOCIETY NEW LEARNING CONNECTIVITY AT&S (China) Company Limited 奥特斯 ( 中国 ) 有限公司 No.5000 Jin Du Road Xinzhuang Industry Park Shanghai P.R. China Tel info@cn.ats.net

12 2030: 59% of global population will live in cities GLOBALISATION NEW WORK MOBILITY Healthy living: Health is not only contrast of sickness URBANISATION Megatrends towards 2030 NEO-ECOLOGY INDIVIDUALIZATION SILVER SOCIETY 2030: Population 8,3 Billion CONNECTIVITY 2020: 50 Billion things connected to the internet NEW LEARNING Autonomous Driving Energy Efficiency HEALTH AT&S (China) Company Limited 奥特斯 ( 中国 ) 有限公司 No.5000 Jin Du Road Xinzhuang Industry Park Shanghai P.R. China Tel info@cn.ats.net

13 Getting ready for Beyond Moore!

14 Electrical Interconnection Technology Evolution Miniaturization FO WLP 2/2 μml/s IC Substrate 7/7 μml/s Over the last decades PCB and Substrate technology was mainly driven by reduction of feature size ECP / SAP 25/25 μml/s Next gen. Anylayer+ Substrate like PCB 30/30 μml/s Interposer 40/40 μml/s Anylayer 40/40 μml/s Microvia/HDI 60/60 μml/s Mulitlayer 100/100 μm L/S PTH 250/250 μm L/S Electrical Interconnection Miniaturization Roadmap Miniaturisation Functional Modules: System-in-board (SiB) System-in-package (SiP)

15 Electrical Interconnection Technology Evolution Miniaturization FO WLP 2/2 μml/s IC Substrate 7/7 μml/s ECP / SAP 25/25 μml/s Next gen. Anylayer+ Substrate like PCB 30/30 μml/s Interposer 40/40 μml/s Electrical Interconnection Miniaturization Roadmap Anylayer 40/40 μml/s Microvia/HDI 60/60 μml/s Mulitlayer 100/100 μm L/S PTH 250/250 μm L/S Functionality Functional Modules: System-in-board (SiB) System-in-package (SiP) Rigid Cavity Rigid- Thermal HF Passives Sensors Power Energy Flex Management Actives MEMS Supply Harvester Functionality was an add on Components have been developed independently Casing 3D PCB Diversification: Additional Functionalities

16 Electrical Interconnection Technology Evolution Miniaturization FO WLP 2/2 μml/s IC Substrate 7/7 μml/s ECP / SAP 25/25 μml/s Future: all-in-one-package Next gen. Anylayer+ Substrate like PCB 30/30 μml/s Interposer 40/40 μml/s Electrical Interconnection Miniaturization Roadmap Anylayer 40/40 μml/s Microvia/HDI 60/60 μml/s Mulitlayer 100/100 μm L/S PTH 250/250 μm L/S Functional Modules: System-in-board (SiB) System-in-package (SiP) Rigid Cavity Rigid- Thermal HF Passives Sensors Power Energy Flex Management Actives MEMS Supply Harvester Casing 3D PCB Diversification: Additional Functionalities

17 Future positioning as a leading high-end interconnection solutions provider New interconnection solutions supporting miniaturization and modularisation New and existing Application Areas NEW TECHNOLOGIES IC-Substrates Advanced Packaging Substrate-like PCBs High-end Toolbox e- IC-Substrate Advanced Packaging / (SiP) e- Interposer Mobile Devices INTERNET of THINGS Industrial Medical EXISTING TECHNOLOGIES Multilayer PCBs HDI Anylayer PCBs Embedding Flexible PCBs With a new, diversified, high-end toolbox AT&S will position itself as a leading, More comprehensive high-end interconnection solutions provider 凭借全新多元和高端的工具箱, 奥特斯成为了领先的高端互连方案供应商 positioning in the value chain CORE BUSINESS Multilayer PCBs, HDI Anylayer PCBS, Embedding, Flexible Automotive New and existing customers Semiconductors Packaging companies (OSATS) Original Electronic Manufacturers (OEMs) Tier 1 suppliers 315

18 Outline Company Overview What is Driving System Integration? Road to All in One Package System Integration Concepts Embedding in Laminate AT&S solution for Integration Summary 16

19 Many concepts are available however no Industry Standard! 17

20 Integration Technologies Source: Yole Developpment 18

21 Outline Company Overview What is Driving System Integration? Road to All in One Package System Integration Concepts Embedding in Laminate AT&S solution for Integration Summary 19

22 History of Embedded AT&S AT&S chronology to high volume manufacturing Embedded silicon Printed capacitor Discrete capacitor Printed resistor Discrete resistor Embedded Chip 1970 Concepts Research Development Projects Industrialization Serial Production Hiding Dies 20

23 Players in different segments Source: Yole Developpment 21

24 What is ECP Process flow Standard ECP ECP (Embedded Component Packaging) uses the space in an organic, laminatesubstrate(printedcircuit Board) for active and/or passive components Copper foil overlay marking Adhesive printing Assembly Curing Picture: AT&S Cavity Prepreg preparation(fr4 = yellow) Layup Pressing Laser drilling(connection to component) Mechanical drilling(pth) Plating and structuring Component assembly Lamination Structuring 22

25 What is ECP Process flow Center Core ECP Core Structuring Cavity Cutting Tape Lamination Component Assembly Resin fill Tape Removal Lamination Laser drilling Structuring E-Test Component assembly Lamination Structuring AT&S Confidential - NDA Restrictions Apply 23

26 ECP Pictures X-section of embedded devices Surface mount CSP PCB with embedded IC Embedded IC 24

27 ECP Keyfacts Active and/or passive components Coppersurfaceon IO s Thickness 100µm -350µm Laser drilled microvias Galvanic copper plating HDI PCB processes PCB material and processes Various combination of stack-ups possible Miniaturization Reliable interconnection Performance-short signal loop/heat disspation Protection of components 25

28 Miniaturization Integration of electronic devices in every day life Tight-fitting electronic devices Integration of high end functions in every-day life Invisibility of daily aids Where ECP is being used Connecting various devices Portable electronics (wearables) Modules for wireless connections Medical products (hearing aids, ) Identification Fan out for fine-pitch ICs Picture: AT&S NFC tag: 200µm thick Flex to install Picture: AT&S 26

29 Embedding-Heat disspation & more 2kW Power Inverter by AT&S and tech college Kapfenberg 6L board 32 embedded GaN-on-Si transistors embedded on 2 layers Box size: 7,5 x 3,8 x 4,5 cm 27

30 Embedding system in package System in package Application we can t share Embedded: 256 pin µcontroler and several passives 4layerfanout (12 layeranylayerpcb) 28

31 Outline Company Overview What is Driving System Integration? Road to All in One Package System Integration Concepts Embedding in Laminate AT&S solution for Integration Summary 29

32 Where do we come from 30

33 Preparing ourselves for the future SHA Advanced HDI (msap) Organic Interposer Embedding CHQ1 AP Future: All-in-one-Package IC Substrate/ SLP Advanced Embedding Design Testing Product Mgmt

34 The best way to predict the future is to create it! -- Peter Drucker 32

35 AT&S - Well Positioned for the Future

36 AT&S first choice for advanced applications AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0) info@ats.net

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