Sunstone Circuits DFMplus Summary Report
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1 Job Name DFM081-wireless_controller_v0 Part Number Wireless_Controller Customer Name Contact Name Job Class IPC Class 2 Job View Creation Time :55:31 Revision V0 Operator Name lyndap Contact New/Repeat Order New Job Buildup Top View Bottom View Comments Validation between gerber data and IPC-D-356 net list found discrepancies. Unable to verify findings. Discrepancies may delay order processing. Bottom side silkscreen file is empty. Submitting an empty file may cause delay in order processing. Please confirm. DFM findings mil space top and bottom layers (1 place) at R5. PCB designs with spaces < 5mil require a custom quote. This will add to the cost of manufacturing the PCB. If the PCB design can be adjusted in this one location to a 6mil space, your PCB can be quoted/ manfuctured using Sunstone's PCBExpress Quickturn or PCBpro Full Feature services.
2 Validation Status: Validation Errors Validation Report: 2 Shorts 5 Brokens 0 Possible Short 0 Possible Broken 0 Missings 0 Extras Job Info Part Size (X,Y) inch 4.4 x 2.4 Copper Layers 2 Soldermask Side Both Silkscreen Side Top Gold Thickness 0 mil Thickness 62 mil Drill Layer 1 Soldermask Color Green Silkscreen Color White Material FR4 I/L Weight 0 Oz Rout Length 13.6 inch NC Layer Info Soldermask Type Undefined Impedance Tolerance 0% Finish Type HAL O/L Weight 1 Oz Board Bow And Twist Percentage 0% Drill Type Number Of Bits Number Of Holes Min Hole Size Max Hole Size PTH NPTH 0 0 Via 0 0 Laser 0 0 Total: Total stacked holes count: 0 Top SMD Pads 61 Top BGA Pads 1 Top SMD Min Width Has Top Drilled SMD/BGA Yes Gold Area Top 0 inch² Gold Finger Count Top 1 Top Gold Fingers Typ Width Top Line to BGA Spacing Top SMD Min Pitch Top BGA Min Pitch Top BGA Min Width Top Test Point Count 181 Expose Area Top inch² Top Gold Fingers Typ Length Outer Layer Info Bottom SMD Pads 1 Bottom BGA Pads 0 Bottom SMD Min Width 60 mil Has Bottom Drilled SMD/BGA Yes Gold Area Bottom 0 inch² Gold Finger Count Bottom 0 Bottom Gold Fingers Typ Width Bot Line to BGA Spacing Bottom SMD Min Pitch 0 mil Bottom BGA Min Pitch Bottom BGA Min Width Bottom Test Point Count 88 Expose Area Bottom inch² Bottom Gold Fingers Typ Length
3 Layer Minimal Spacing Typical Spacing Sunstone Circuits DFM Analysis Minimal AR Typical AR Minimal Line Width Typical Line Width copper-top 4.3 (# 1 ) 6 (# 259 ) 5.4 (# 46 ) 5.5 (# 46 ) 5.4 (# 1 ) 8 (# 53 ) copper-bot 4.3 (# 1 ) 6 (# 298 ) 5.5 (# 42 ) 5.5 (# 42 ) 8 (# 80 ) 8 (# 80 ) Summary Layer Min PTH To Cu Typ PTH To Cu copper-top 5.4 (# 1 ) 17.5 (# 40 ) copper-bot 9.8 (# 2 ) 11.5 (# 42 )
4 Copper Layer Info Layer Copper Area ( inch²) Copper Usage (%) Copper Weight [Base] Copper Thickness [Final] copper-top Oz 0 mil copper-bot Oz 0 mil
5 DFM Report Legend: copper-top Below standard processing Slight Modification necessary Meets standard processing Lines 1) 8 mil 2) 8 mil 3) 8 mil 4) 8 mil 5) 8 mil (3.3,1.734) inch (3.31,1.234) inch (3.31,1.234) inch Spacing (3.31,1.611) inch (3.418,1.42) inch 1) mil 2) 6 mil 3) 6 mil 4) 6 mil 5) 6 mil (3.33,1.228) inch (0.214,0.649) inch (0.195,0.63) inch Annular Ring (0.191,0.152) inch (1.128,0.813) inch 1) 2) 5.5 mil 3) 5.5 mil 4) 5.5 mil 5) 5.5 mil (4.075,0.325) inch 1) mil (2.085,2.3) inch (1.21,2.1) inch (0.985,2.075) inch PTH To Copper (0.885,1.9) inch (3.327,1.227) inch SMD Pads 1) 18 x 20 mil 2) 18 x 20 mil 3) 18 x 20 mil 4) 18 x 20 mil 5) 18 x 20 mil (3.3,1.778) inch (3.3,1.742) inch (1.138,0.8) inch (1.102,0.8) inch (3.384,1.74) inch
6 copper-bot Lines 1) 8 mil 2) 8 mil 3) 8 mil 4) 8 mil 5) 8 mil (2.82,0.43) inch (2.825,0.519) inch (3.2,0.515) inch Spacing (3.64,0.515) inch (2.735,0.635) inch 1) mil 2) 6 mil 3) 6 mil 4) 6 mil 5) 6 mil (3.33,1.228) inch (0.489,0.651) inch (0.253,0.1) inch Annular Ring (0.453,0.1) inch (0.591,0.152) inch 1) 5.5 mil 2) 5.5 mil 3) 5.5 mil 4) 5.5 mil 5) 5.5 mil (2.087,2.292) inch (1.21,2.1) inch (0.985,2.075) inch PTH To Copper (0.892,1.913) inch (0.717,1.813) inch 1) mil 2) mil 3) 11.5 mil 4) 11.5 mil 5) 11.5 mil (3.327,1.227) inch 1) 60 x 60 mil (3.333,1.228) inch (2.082,2.3) inch (1.217,2.117) inch SMD Pads (0.992,2.092) inch (1.42,2.2) inch
7 Attached files: 1 Attachments Layer Type Polarity Input File Name solder_paste-top solder_paste Positive wireless controller v0.toppaste silk_screen-top silk_screen Positive wireless controller v0.slk solder_mask-top solder_mask Positive wireless controller v0.smt copper-top power_ground Positive wireless controller v0.top copper-bot power_ground Positive wireless controller v0.bot solder_mask-bot solder_mask Positive wireless controller v0.smb silk_screen-bot silk_screen Positive wireless controller v0.bsk plated01-02 drill Positive wireless controller v0.dri oln document Positive wireless controller v0.oln top_asb document Positive wireless controller v0.topassembly
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Application Note 5026
Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction This document outlines the design and assembly guidelines for surface laminar circuitry
In this pdf file, you can see the most common 7 kinds of multilayer PCB configurations.
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TQP7M W High Linearity Amplifier. Applications. Ordering Information. Part No. Description
Applications Repeaters BTS Transceivers BTS High Power Amplifiers CDMA / WCDMA / LTE General Purpose Wireless 3-pin SOT-89 Package Product Features Functional Block Diagram 4-4 MHz +29.5 dbm P1dB +45 dbm
Matrix BGA Socket Assembly Instructions
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