TARIF IFTEC DES NORMES IPC (TOUS LES PRIX SONT SUSCEPTIBLES D'ÉVOLUER EN FONCTION DE LA PARITÉ EURO/DOLLAR)

Transcription

1 TARIF IFTEC ES NORMES IPC (TOUS LES SONT SUSCEPTIBLES 'ÉVOLUER EN FONCTION E LA PARITÉ EURO/OLLAR) MAJ : 3/10/2017 Validité : 06/11/17 IFTEC : 33 rue Ravon BOURG-LA-REINE - France Tel : Fax : Mail : iftec@iftec.fr Site : SAS CAPITAL RCS Nanterre Id. TVA FR

2 Colissimo Expert France : poids < 2 kg 18 poids > 2kg < 4 kg 24 poids > 4kg < 6 kg 30 poids > 6kg < 8 kg 36 poids > 8kg < 10 kg B A A B 2221B-FR 2222A 2222A-FR LIV = Livre version papier C = licence individuelle, PF sur C = licence individuelle, PF téléchargeable Coût transport / emballage Colissimo Expert étranger : 35 poids < 3 kg 69 poids > 3kg < 6 kg 78 poids > 6kg < 10 kg 103 poids > 10kg < 15 kg 129 poids > 15kg < 20 kg LIV IPC-1071B C IPC-1071B(E) IPC-1071()1 LIV IPC C IPC-1072(E) IPC-1072()1 LIV IPC-1601A C IPC-1601A(E) Printed Board Handling and Storage Guidelines IPC-1601A()1 LIV IPC LIV IPC-1782()1 IPC-2141A()1 IPC-2152()1 IPC-2220-FAM (SERIE 2221B A ) LIV IPC-2221B IPC 2220 Family of esign ocuments C IPC-2221B(E) Generic Standard on Printed Board esign IPC-2221B()1 LIV IPC-2221B-FR C IPC-2221B-FR(E) IPC-2221B-FR()1 LIV IPC-2222A IPC-2222A()1 LIV IPC-2222A-FR C IPC-2222A-FR(E) IPC-2222A-FR()1 LIV IPC C IPC-2223(E) IPC-2223()1 IPC-2225()1 IPC-2226()1 TARIF IFTEC NORMES IPC AU 3 OCTOBRE 2017 Intellectual Property Protection in Printed Board Manufacturing Intellectual Property Protection in Electronic Assembly Manufacturing Standard for Manufacturing and Supply Chain Traceability of Electronic Products esign Guide for High-Speed Controlled Impedance Circuit Boards Standard for etermining Current Carrying Capacity in Printed Board esign Norme Générique de Conception du Circuit Imprimé (French Language) Sectional esign Standard for Rigid Organic Printed Boards Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides (French Language) Sectional esign Standard for Flexible Printed Boards Sectional esign Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies Sectional esign Standard for High ensity Interconnect (HI) Boards

3 IPC-2251()1 LIV IPC C IPC-2291(E) esign Guideline for Printed Electronics IPC-2291()1 IPC-2611()1 esign Guide for the Packaging of High Speed Electronic Circuits Generic Requirements for Electronic Product ocumentation 2612 IPC-2612()1 Sectional Requirements for Electronic iaamming ocumentation (Schematic and Logic escriptions) IPC ()1 Sectional Requirements for Electronic iaamming Symbol Generation Methodology 2614 IPC-2614()1 Sectional Requirements for Board Fabrication ocumentation 2615 IPC-2615()1 Printed Board imensions and Tolerences 4101E 4103A-WAM1 4202B 4203A 4204A-WAM1 4412B 4552-WAM A A-WAM1 LIV IPC-4101E IPC-4101E()1 LIV IPC-4103A-WAM C IPC-4103A-WAM1(E) IPC-4103A-WAM1()1 LIV IPC-4202B IPC-4202B()1 LIV IPC-4203A C IPC-4203A(E) IPC-4203A()1 LIV IPC-4204A-WAM C IPC-4204A-WAM1(E) IPC-4204A-WAM1()1 LIV IPC-4412B C IPC-4412B(E) IPC-4412B()1 LIV IPC-4552-WAM C IPC-4552-WAM1-2(E) IPC-4552-WAM1-2()1 IPC-4553A()1 IPC-4554()1 LIV IPC C IPC-4556(E) IPC-4556()1 LIV IPC-4562A-WAM C IPC-4562A-WAM1(E) Metal Foil for Printed Board Applications IPC-4562A-WAM1()1 Specification for Base Materials for Rigid and Multilayer Printed Boards Specification for Base Materials for High Speed / High Frequency Applications Flexible Base ielectrics for Use in Flexible Printed Circuitry Cover and Bonding Material for Flexible Printed Circuitry Flexible Metal-Clad ielectrics for Use in Fabrication of Flexible Printed Circuitry - With Amendment 1 Specification for Finished Fabric Woven from "E" Glass for Printed Boards Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Specification for Immersion Silver Plating for Printed Boards Specification for Immersion Tin Plating for Printed Circuit Boards - includes Amendment 1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

4 FR LIV IPC-5704()1 IPC-6010-FAM (SERIE C C) IPC-6011() LIV IPC C IPC-6012(E) IPC-6012()1 LIV IPC-6012-FR C IPC-6012-FR(E) IPC-6012-FR()1 Cleanlisness Requirements for Unpopulated Printed Board IPC-6010 Family of Board Performance ocuments Generic Performance Specification for Printed Boards Qualification and Performance Specification for Rigid Printed Boards Spécification de la Qualification et des Performances des Circuits Imprimés Rigides 6012A LIV IPC-6012A C IPC-6012A(E) Automotive Applications Addendum to IPC-6012 IPC-6012A()1 6012S-FR LIV IPC-6012S-FR C IPC-6012S-FR(E) IPC-6012S-FR()1 Avenant pour les Applications Spatiales et Aéronautiques Militaires de l'ipc LIV IPC IPC-6013()1 IPC-6015()1 IPC-6016() IPC-6017()1 6018C LIV IPC-6018C C IPC-6018C(E) IPC-6018C()1 Qualification and Performance Specification for Flexible Printed Boards Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures Qualification & Performance Specification for High ensity Interconnect (HI) Layers or Boards Qualification and Performance Specification for Printed Boards Containing Embedded Passive evices Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7090 LIV IPC-7090-FAM (SERIE C) IPC-7090 Packages for PCBs and Assemblies C LIV IPC IPC-7091()1 LIV IPC C IPC-7092(E) IPC-7092()1 IPC-7093()1 IPC-7094()1 LIV IPC-7095C C IPC-7095C(E) IPC-7095C()1 esign and Assembly Process Implementation of 3 Components esign and Assembly Process Implementation for Embedded Components esign and Assembly Process Implementation for Bottom Termination Components esign and Assembly Process Implementation for Flip Chip and ie Size Components esign and Assembly Process Implementation for BGAs 7351B LIV IPC-7351B IPC-7351B()1 Generic Requirements for Surface Mount esign and Land Pattern Standard

5 7525B IPC-7525B()1 Stencil esign Guidelines LIV IPC C IPC-7527(E) Requirements for Solder Paste Printing 7530A 7711/21C 7711/21B-FR IPC-7527()1 LIV IPC-7530A IPC-7530A()1 LIV IPC-7711/21C C IPC-7711/21C(E) IPC-7711/21C()1 LIV IPC-7711/21B-FR C IPC-7711/21B-FR(E) LIV IPC C IPC-9121(E) Troubleshooting for PCB Fabrication Processes IPC-9121()1 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) Rework, Modification and Repair of Electronic Assemblies Reprise, modification et réparation des assemblages électroniques 9201A IPC-9201A()1 Surface Insulation Resistance Handbook 9202 IPC-9202() B B 9701A 9704A 9709 A-600J LIV IPC C IPC-9203(E) IPC-9203()1 LIV IPC-9252B C IPC-9252B(E) IPC-9252B()1 LIV IPC C IPC-9641(E) High Temperature Printed Board Flatness Guideline IPC-9641()1 LIV IPC-9691B C IPC-9691B(E) IPC-9691B()1 IPC-9701A()1 LIV IPC-9704A C IPC-9704A(E) IPC-9704A()1 LIV IPC C IPC-9709(E) IPC-9709()1 LIV IPC-A-600J C IPC-A-600J(E) Acceptability of Printed Boards IPC-A-600J()1 Material and Process Characterization / Qualification Test Protocol for Assessing Electrochemical Performance Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle Requirements for Electrical Testing of Unpopulated Printed Boards User Guide for the IPC-TM-650, Method , Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Miation Testing) Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Printed Circuit Assembly Strain Gage Test Guideline Test Guidelines for Acoustic Emission Measurements during Mechanical Testing

6 A-600J-FR A-610F-WAM1 A-610F-FR A-620C A-620C-FR A-630 LIV IPC-A-600J-FR C IPC-A-600J-FR(E) IPC-A-600J-FR()1 LIV IPC-A-610F-WAM C IPC-A-610F-WAM1(E) IPC-A-610F-WAM1()1 LIV IPC-A-610F-FR C IPC-A-610F-FR(E) IPC-A-610F-FR()1 LIV IPC-A-620C C IPC-A-620C(E) IPC-A-620C()1 LIV IPC/WHMA-A-620C-FR IPC/WHMA-A-620C-FR()1 LIV IPC-A C IPC-A-630(E) IPC-A-630()1 Acceptabilité des Circuits Imprimés (French language) Acceptability of Electronic Assemblies - with Amendment 1 Acceptabilité des assemblages électroniques (French Language) Requirements and Acceptance for Cable and Wire Harness Assemblies Exigences et Critères d'acceptabilité pour l'interconnexion des Faisceaux de Fils et de Câbles (French Language) Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures AJ-820A LIV IPC-AJ-820A C IPC-AJ-820A(E) Assembly & Joining Handbook CC-830B- WAM1 CH-65B -620-K IPC-AJ-820A()1 IPC-CC-830B-WAM1()1 IPC-CH-65B()1 LIV IPC--620-K C IPC--620(E) IPC--620()1 RM-18H LIV IPC-RM-18H RM-PTH-F LIV IPC-RM-PTH-F RM-SMT-F LIV IPC-RM-SMT-F Component Identification Training and Reference Guide Through-Hole SolderJoint Evaluation Training & Reference Guide Surface Mount Solder Joint Evaluation Training & Reference Guide RM-WHA-B LIV IPC-RM-WHA-B Wire Harness Assembly Training & Reference Guide LIV IPC-HBK-001F Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes Amendment 1 Guidelines for Cleaning of Printed Boards and Assemblies esign and Critical Process Requirements for Cable and Wiring Harnesses (kit products : WP-113, WP- 114, WP-116) HBK-001F C IPC-HBK-001F(E) Handbook and guide to supplement IPC-J-ST-001 IPC-HBK-001F()1 HBK-005 IPC-HBK-005()1 Guide to Solder Paste Assessment HBK-630 LIV IPC-HBK C IPC-HBK-630(E) IPC-HBK-630()1 Guidelines for esign, Manufacture, Inspection and Testing of Electronic Enclosures

7 HBK-830A LIV IPC-HBK-830A C IPC-HBK-830A(E) IPC-HBK-830A()1 Guidelines for esign, Selection and Application of Conformal Coatings HBK-840 IPC-HBK-840()1 Solder Mask Handbook HBK-850 J-ST-001F- WAM1 J-ST-001F- FR J-ST-002 J-ST-003C- WAM1 J-ST-004B J-ST-005A J-ST-006C J-ST-020E J-ST-030A J-ST-033C-1 J-ST-075 SM-784 SM-785 LIV IPC-HBK C IPC-HBK-850(E) IPC-HBK-850()1 LIV IPC-J-ST-001F-WAM C IPC-J-ST-001F-WAM1(E) IPC-J-ST-001F-WAM1()1 LIV IPC-J-ST-001F-FR C IPC-J-ST-001F-FR(E) IPC-J-ST-001F-FR()1 LIV IPC-J-ST C IPC-J-ST-002(E) IPC-J-ST-002()1 LIV IPC-J-ST-003C-WAM C IPC-J-ST-003C-WAM1(E) Solderability Tests for Printed Boards IPC-J-ST-003C-WAM1()1 IPC-J-ST-004B()1 LIV IPC-J-ST-005A C IPC-J-ST-005A(E) Requirements for Soldering Pastes IPC-J-ST-005A()1 LIV IPC-J-ST-006C C IPC-J-ST-006C(E) IPC-J-ST-006C()1 LIV IPC-J-ST-020E C IPC-J-ST-020E(E) IPC-J-ST-020E()1 LIV IPC-J-ST-030A C IPC-J-ST-030A(E) IPC-J-ST-030A()1 LIV IPC-J-ST-033C C IPC-J-ST-033C-1(E) IPC-J-ST-033C-1()1 IPC-J-ST-075() IPC-SM-784()1 IPC-SM-785()1 Guidelines for esign, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly Requirements for Soldered Electrical and Electronic Assemblies - with Amendment 1 Exigences des Assemblages Electriques et Electroniques Brasés (French Language) EIA/IPC/JEEC J-ST-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires Requirements for Soldering Fluxes - includes Amendment 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC/JEEC Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount evices Selection and Application of Board Level Underfill Materials Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount evices Classification of Non-IC Electronic Components for Assembly Processes Guidelines for Chip-on-Board Technology Implementation Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

8 SM-817A SM-840E T-50M T-50M-FR LIV IPC-SM-817A C IPC-SM-817A(E) IPC-SM-817A()1 IPC-SM-840E()1 LIV IPC-T-50M C IPC-T-50M(E) IPC-T-50M()1 LIV IPC-T-50M-FR C IPC-T-50M-FR(E) IPC-T-50M-FR()1 General Requirements for ielectric Surface Mount Adhesives Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Terms and efinitions for Interconnecting and Packaging Electronic Circuits Termes et éfinitions pour les Circuits Electroniques Imprimés et Assemblés (French Language)