Challenges of Evolving Technology in the Workplace. Tips. Bubba Powers. Board Density. Best Rework Soldering Practices. Power. Substrates.

Transcription

1 Real Estate Finishes Power Component Technology Board Density Tips Challenges of Evolving Technology in the Workplace Substrates Component Size Bubba Powers Manager of Technical Services Weller North America

2 The challenges among us: Board density Substrate material Component size Component technology 2

3 Manufacturer s challenges: Board density Substrate material Component size Component technology 3

4 Manufacturer s challenges: Tip size / geometry Tip life More power Real estate 4

5 Board density End the madness, please! 5

6 Board density 6

7 Substrate material Finishes FR / Ceramic / Flex / Metallized HAL Leaded / HAL Lead-Free ENIG Electroless Ni / Immersion Au Immersion Silver / Immersion Tin OSP Substrate images courtesy of Tensky Technology Co., Ltd. 7

8 Component size (size matters) 0201 / /

9 Component size (size matters) Micro BGA / Chip Scale / Flip Chip 9

10 Component size (size matters) 0201 / /

11 Component size (size matters) 0201 / / Mechanical pencil lead 0.5 mm 11

12 Component size (size matters) 0201 / / Mechanical pencil lead 0.5 mm 12

13 Tip selection (geometry matters) 0.3 mm 0.012" Small chisel tip 0.1 mm 0.004" 0.2 mm 0.008" Conical tip 13

14 Tip selection (geometry matters) 14

15 Component size (size matters) 15

16 Component size (size matters) 16

17 Component size (size matters) 17

18 Compensation factor Increased power versus temperature Power = Energy Temperature = Thermal compromise 18

19 Compensation factor Increased power, from Watts Soldering Iron PC Board Soldering Tip 19

20 Anatomy of a soldering tip Copper core controls high heat conductivity of the soldering tip Iron layer controls high wear resistance Chromium (chrome) layer limits the wettable area Tinned working area controls wettability of the soldering tip Lead-free tinning protects the working area of the tip when it is new Cross section LTC TIP 20

21 Solder alloy flux Solder iron tip temperature should be between: C ( F ) for Sn 63, Sn 62 and Sn 60 alloys C ( F) for SN100C, SnAg and SnAgCu (SAC 305, SAC 405, CASTIN, etc.) alloys. Hold the solder iron tip at a 45 to 60 angle to the work surface. The solder iron should contact both the component lead and PCB pad surface. Solder and flux should flow onto the lead and pad or lead and barrel to promote optimum flux activity for the joint being worked. If additional flux is needed, the use of AIM s NC266-3 flux is recommended. Operators should use an applicator capable of dispensing precise amounts of flux to eliminate over-saturation and excessive spread. 21

22 Solder alloy flux Solder iron tip temperature should be between: C ( F) for Sn 63, Sn 62 and Sn 60 alloys C ( F) for SnAg and SnAgCu alloys C ( F) for Sn 43 Pb 43 Bi 14 Hold the solder iron at a 45 to 60 angle to the work surface. The solder iron should contact both the component lead and PCB pad surface. Solder and flux should flow onto both the lead and pad or lead and barrel to promote optimum flux activity to the joint being worked. If additional flux is needed, the use of AIM s RMA flux is recommended. Operators should use an applicator capable of dispensing precise amounts of flux to eliminate over-saturation and excessive spread. 22

23 Solder alloy flux Process considerations: Solder iron tip temperatures are most commonly between: C ( F) for Sn 63 Pb 37 and Sn 62 Pb 36 Ag 02 alloys C ( F) for lead-free alloys 23

24 Solder alloy flux Process considerations: Heat both the land area and component lead to be soldered with the iron. Apply the solder wire to the land area or component lead. Do not apply the solder wire directly to the soldering iron tip. 24

25 Equipment / supplier Everyone has a choice! Choose your equipment and your suppliers wisely. Equipment should offer versatility and features that suit your current production needs Choose equipment suppliers who offer upgrade capabilities 25

26 Summary Board density / material Determines the equipment requirement Component size Crucial to the heat transfer process Tip size / geometry Equally important to heat transfer and tip life Flux selection Process considerations for now and the future 26

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