Reliability of Solder Joint Quality on J-Lead Oscillators Using HALT with Lead and Lead Free Compositions
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1 INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY Reliability of Solder Joint Quality on J-Lead Oscillators Using HALT with Lead and Lead Free Compositions Steve Laya Elite Electronic Engineering Todd Treichel Precision Devices, Inc.
2 Presentation Overview Primary Objective: Evaluation of Lead vs. Lead Free Use of HALT Vibration (and Thermal Shock) Initial Findings Sometimes things don t go as planned Understanding HALT Stresses Resonance Dwell To Determine Lead vs. Lead Free Post Test Analysis
3 Lead vs. Lead-Free Conversion from Lead to Lead-Free European Union Automotive Electronics Industrial and Commercial Electronics Assure reliability of Lead-Free
4 Published Research Follow up on PDI Testing Joint Council on Ageing Aircraft (JCAA)
5 J-Lead Ceramic Package Under Test
6 Test Vehicle PCB 10 parts Lead 10 parts Lead-Free J-Leaded Oscillators Hand Soldered To Fiberglass Epoxy PCB Lead Free Lead
7 Termination Diagram Electro Au, 1.00 µm Min. Kovar, 0.25 Min. Dia. Electro Ni, 1.78 µm Min. Cu FR4 Substrate Alloys Under Test Ag 3.0% Pb 37% Cu 0.5% Sn 63% Sn 96.5% Tin/Lead SAC 305 Solder
8 Solder Joint Inspection NASA-STD
9
10 HALT Table Location Placed in the center of the HALT vibration table with Air Flow evenly distributed Instrumentation to measure open circuit on PCB component interface.
11 Instrumentation
12 Elite s HALT System HALT Testing 60C/m Temp Shock 6-Axis Vibration Repetitive Shock Power Spectral Density Characteristics HALT Test Purpose
13 6-Axis RS Vibration Table
14
15
16 Test Results Thermal Shock Step Vibe Sustained Vibration at 50gs No failures after 35 hours of vibration testing. How come???
17 Perform a Vibration Survey
18 Perform a Vibration Survey
19 Perform a Vibration Survey
20
21 Measure PCB Resonance
22 Lead-Free 3 Lead 2 4
23 Resonance Search Run Demand (G) Ch2 (G) Ch3 (G) Ch4 (G) 1 Gs
24 Multiple Searches Location Gs 1 Location 3 On PCB Near Mounting Bolt Run #2 PCB2 Loc3 Run #3 PCB2 Loc3 Run #1 PCB2 Loc Multiple Searches Location Gs 4 Run #2 PCB1 Loc4 Run #3 PCB1 Loc4 Run #1 PCB1 Loc4 Location #
25 Measure resonance of the Oscillator On Chip (PCB2) With and Without Wax 8 Run #2 Accel Only 7 Run #3 Accel + Weight 6 5 Gs
26 Overlay resonance on plot of PSD Location G 2 /Hz PCB Response from HALT at 51.9g Control Sw ept Resonance 718.8, , 9.4 Location 2 Board 1- Ch G 2 /Hz 1 HALT Inputl Sw ept Resonance PCB Response ,
27 Overlay resonance on plot of PSD Location G 2 /Hz 1 Sw ept Resonancel PCB Response from HALT at 51.5g Control , ,371.88, 9.37 Location 1 Board 2 - Ch3 (Near Bolt) Sw ept Resonance HALT Input PCB Response G 2 /Hz
28 Overlay resonance on plot of PSD Location G 2 /Hz Sw ept Resonance PCB Response from HALT at 51.0gsHALT Response , Location 2 Board 2 - Ch Sw ept Resonance PCB Response from HALT at 51.0gsHALT Response HALT Input Location 2 Board 2 - Ch2 G 2 /Hz
29 Series2 Series3 Series4 Series1 Location 2 Board 2 -Ch2 (Center) , ,
30 What is the Board 718Hz Location 4 was at 23.3 g 2 /Hz RMS Acceleration at 718 (location 4) is Accel = (23.3 x 3.13) 1/2 = 1371Hz Location 3, 9.37 g 2 /Hz Accel = (9.37 x 3.13) ½ = Hz Location 2, g 2 /Hz Accel = (15.15 x 3.13) ½ = 6.8
31 Perform Resonance Dwell Pick a resonance Test to failure Determine time to failure
32 Lead-Free 3 Lead 2 4
33
34
35 Lead Free Resonance Dwell at 748Hz Loc 2 (Gs) Loc 3 (Gs) Control (Gs) Dwell (Min) Total 67 An still no pop-off failures!
36 Solder Joint Inspection 96.5Sn/3.0Ag/0.5Cu 63Sn/37Pb 40% of Joints Fractured 22% of Joints Fractured
37 Conclusions & Lessons Learned Both constructions are durable HALT Suitable for generating high vibration on PCB components Good fixturing is important Resonance Dwell Concentrates enormous energy at one frequency Selection of resonance frequency could skew results. Test Uniformity & Repeatability Difficult to achieve Board Resonances Locations
38 INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY Any questions Thank you! Enjoy the remainder of the conference.
Copyright International Microelectronics & Packaging Society (IMAPS), MASH Proceedings Baltimore, MD, May 7-10, 2007
Copyright 2007 - International Microelectronics & Packaging Society (IMAPS), MASH Proceedings Baltimore, MD, May 7-10, 2007 Reliability Analysis of Solder Joint Quality on J-Lead Ceramic Oscillators Using
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