PLEDxN Series. PLED Open LED Protectors PLEDxN Series. RoHS. Description
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- Marybeth Sutton
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1 RoHS Description The open LED protector provides a switching electronic shunt path when a single LED in an LED string fails as an open circuit. This ensures the entire LED string will continue to function even if a single LED in the string does not. This provides higher reliable lighting functions in applications such as headlights, aircraft lights, airport runway lighting, roadside warning lights, etc. This component is compatible with one watt rated LEDs with a nominal 35 ma current at 3V. The SOD-123FL package is one of the lowest height profiles (1.1 mm) packages offered in the industry. Pinout Diagram Features & Benefits Anode Schematic Symbol Fast switching Automatically resets after power cycle Compatible with industrial standard package SOD- 123FL Compatible with industrial lighting environments IEC ESD 3kV (Air), 3kV (Contact) ESD protection of data lines in accordance with IEC (IEC 81-2) Low profile: maximum height of 1.1mm RoHS compliant and halogen-free MSL: Level 1 - unlimited Control Circuit Electrical Characteristics(All parameters are measured at T A =25 C unless otherwise noted) Part Number BR = 1 mamps I LEAK V = 5V I H = 35mA Critical rate of rise dv/dt 2V bias Volts ua ma ma A V V pf Min Max Max Max Max Max Max Max Max PLED6N P6N , Notes: 1) Standard FR-4 PCB with Copper Pads (2mm x 2mm/pad) 2) Aluminum PCB Pads (2mm x 3mm/pad)
2 Capacitance (pf) PLED Open LED Protectors Thermal Considerations Symbol Parameter Value Unit Average On State Current, (T A = 25 C) 1. 1, 2 A On-state Voltage (T A = 125 C) 1. V P D Power Dissipation (T A = 25 C) W T J 8 1 Operating Junction Temperature Range C 5 2 T S Storage Temperature Range -65 to +15 C R θjl Thermal Resistance: Junction to Lead 25 1 C/W 2 2 Notes: R θja 1) Standard FR-4 PCB with Copper Pads (2mm x 2mm/pad) 2) Aluminum PCB Pads (2mm x 3mm/pad) Thermal Resistance: Junction to Ambient 8 1 C/W 5 2 V-I Characteristics vs. Junction Temperature +I -V I S I H -I +V C hange % cent of P er C Junction Temperature (T J ) C Normalized DC Holding Current vs. Ambient Temperature Capacitance vs Voltage i H i H ( T C = 2 5 C ) of R atio C Ambient Temperature (T C ) C Bias (V)
3 Leakage Current vs Temperature vs Leakage (µa) Temperature (ºC) Operating Current vs. Ambient Temperature LED Interference Test Circuit Operating Current (A) V bat 12 Vdc 2. Ω, 1/4 W 11 kω, 1/4 W PWM Q2 2N2222 Q1 LED Driver Ambient Temperature (ºC) ON/OFF Switch Control Circuit PLED Typical Operation Waveforms 1mA LED CH2 I: LED, 1mV/div=1mA/div CH3 V: PLED6N 35mA LED CH2 I: LED, 1mV/div=2mA/div CH3 V: PLED6N CH2 CH2 CH3 CH3
4 Soldering Parameters Reflow Condition Pb Free assembly Pre Heat - Temperature Min (T s(min) ) 15 C - Temperature Max (T s(max) ) 2 C - Time (min to max) (t s ) 6 18 secs Average ramp up rate (Liquidus Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 217 C Reflow - Temperature (t L ) 6 15 seconds Peak Temperature (T P ) 26 +/-5 C Time within 5 C of actual peak Temperature (t p ) 3 seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P ) 8 minutes max Do not exceed 26 C Physical Specifications Environmental Specifications Terminal Material Terminal Finish Body Material Packaging Package Code Description Copper Alloy 1% Matte Tin Plated UL recognized epoxy meeting flammability classification V- Packaging Quantity N SOD-123FL 3 Industry Standard EIA-481 Tape and Reel High Temperature Voltage Blocking Temperature Cycling Biased Temperature & Humidity Resistance to Solder Heat Moisture Sensitivity Level Burn-In Test MIL-STD-75: Method 14, Condition A, 8% min DC, 15 C, 54 hours MIL-STD-75: Method 151, -65 C to 15 C, 15-minute dwell, 1 cycles EIA/JEDEC: JESD22-A11 8% min, 85 C, 85%RH, 18 hours MIL-STD-75: Method C, 1 seconds JEDEC-J-STD-2, Level 1 =.35 Adc, 18 hours Part Numbering System Part Marking System Bar PLED 6 N Component Type PLED: LED Protector Package Type: N: SOD-123FL P6N XXXXX Anode Typical Lot Number Part Marking
5 Dimensions - SOD-123FL Package C D G H A B E E F Dimensions Millimeters Inches Min Max Min Max A B C D E F G H Mounting Pad Layout 1.6 (.62) 1.3 (.51) 1.4 (.55) Tape and Reel Specification.31 (8.).157 (4.).8 (2.2) Arbor Hole Dia..157 (4.) Optional 7 7. (178) (33).59 DIA (1.5) Cover tape Dimensions are in inches (and millimeters)..33 (8.5) Direction of Feed
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Features -3V/-3, =46mΩ (typ.) @ V GS =-1V =55mΩ (typ.) @ V GS =-4.5V =79mΩ (typ.) @ V GS =-2.5V Super High Dense Cell Design Reliable and Rugged Enhance ESD Cell Protection Lead Free and Green Devices
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P-Channel Enhancement Mode MOSFET Features Pin Description -2V/-4.9A, R DS(ON) =43mΩ (Max.) @ V GS =-4.5V R DS(ON) =58mΩ (Max.) @ V GS =-2.5V R DS(ON) =88mΩ (Max.) @ V GS =-1.8V 1% UIS + R g Tested Reliable
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Dual N-Channel Enhancement Mode MOSFET Features Pin Description 60V/5, R DS(ON) =38mΩ(Typ.) @ = V R DS(ON) =55mΩ(Typ.) @ = 4.5V Super High Dense Cell Design Reliable and Rugged Lead Free and Green Devices
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N-Channel Enhancement Mode MOSFET Features Pin Description 60V / 120A, R DS(ON) = 6.0 mω (typ.) @ V GS =V Avalanche Rated Reliable and Rugged Lead Free and Green Devices Available (RoHS Compliant) G D
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