SD Series 450W Discrete Unidirectional TVS Diode

Transcription

1 General Purpose ESD Protection - 5W Discrete Unidirectional TVS Diode RoHS Pb GREEN Description The SD series is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The SD series can safely absorb repetitive ESD strikes at ±3kV (contact discharge, IEC 1--) without performance degradation and safely dissipate 3A (SD5) of /μs induced surge current (IEC1--5) with very low clamping voltages. Pinout and Functional Block Diagram 1 Features ESD, IEC1--, ±3kV contact, ±3kV air EFT, IEC1--, A (5/5ns) Lightning, IEC1--5, 3A (t P =/μs, SD5) Low clamping voltage Low leakage current Small SOD33 package fits 5 footprints AEC-Q11 qualified Applications Switches / Buttons Test Equipment / Instrumentation Point-of-Sale Terminals Medical Equipment Notebooks / Desktops / Servers Computer Peripherals Automotive Electronics Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. 1 1 Littelfuse, Inc. Revision: /15/1

2 General Purpose ESD Protection - Absolute Maximum Ratings Symbol Parameter Value Units P pk Peak Pulse Power ( =/μs) 5 W T OP Operating Temperature - to 15 C T STOR Storage Temperature -55 to 15 C Notes: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Storage Temperature Range -55 to 15 C Maximum Junction Temperature 15 C Maximum Lead Temperature (Soldering -s) C SD5 Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM 1μA 5. V Reverse Voltage Drop =1mA. V =5V 1. μa =1A, =/µs, Fwd 9. V =1A, t P =/μs, Fwd 13. V Dynamic Resistance R DYN TLP, tp=1ns, I/O to Ground. Ω =/µs 3. A IEC1-- (Contact Discharge) ±3 kv IEC1-- (Air Discharge) ±3 kv Diode Capacitance 1 C D Reverse Bias=V, f=1mhz 35 pf SD1 Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM 1μA 1. V Reverse Voltage Drop =1mA 13.3 V =1V 1. μa =1A, =/µs, Fwd.5 V =1A, t P =/μs, Fwd.5 V Dynamic Resistance R DYN TLP, tp=1ns, I/O to Ground.9 Ω =/µs 17. A IEC1-- (Contact Discharge) ±3 kv IEC1-- (Air Discharge) ±3 kv Diode Capacitance 1 C D-GND Reverse Bias=V, f=1mhz 15 pf 9 1 Littelfuse, Inc. Revision: /1/1

3 General Purpose ESD Protection - SD15 Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM 1μA 15. V Reverse Voltage Drop =1mA 1.7 V =15V 1. μa =1A, =/µs, Fwd. V =1A, =/µs, Fwd 3. V Dynamic Resistance R DYN TLP, tp=1ns, I/O to Ground.3 Ω =/µs 1. A IEC1-- (Contact Discharge) ±3 kv IEC1-- (Air Discharge) ±3 kv Diode Capacitance 1 C I/O-GND Reverse Bias=V, f=1mhz 1 pf SD Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM 1μA. V Reverse Voltage Drop =1mA.7 V =V 1. μa =1A, =/µs, Fwd 3. V =5A, =/µs, Fwd. V Dynamic Resistance R DYN TLP, tp=1ns, I/O to Ground.9 Ω =/µs 7. A IEC1-- (Contact Discharge) ±3 kv IEC1-- (Air Discharge) ±3 kv Diode Capacitance 1 C I/O-GND Reverse Bias=V, f=1mhz 5 pf SD3 Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM 1μA 3. V Reverse Voltage Drop =1mA. V =3V 1. μa I Clamp Voltage 1 PP =1A, =/µs, Fwd 5. V V C =A, =/µs, Fwd. V Dynamic Resistance R DYN TLP, tp=1ns, I/O to Ground.1 Ω =/µs 5. A IEC1-- (Contact Discharge) ±3 kv IEC1-- (Air Discharge) ±3 kv Diode Capacitance 1 C I/O-GND Reverse Bias=V, f=1mhz 5 pf Note: 1. Parameter is guaranteed by design and/or device characterization..transmission Line Pulse (TLP) with 1ns width and ps rise time Littelfuse, Inc. Revision: /1/1

4 General Purpose ESD Protection - Non-Repetitive Peak Pulse Power vs. Pulse Time Capacitance vs. Bias Peak Pulse Power - P pk (kw) Pulse Duration - tp (µs) Capacitance (pf) SD5 SD1 SD15 SD SDC SD3 SD3C Bias Voltage (V) Power Derating Curve Pulse Waveform % of Rated Power Ambient Temperature - TA ( o C) Percent of 11% 1% 9% % 7% % 5% % 3% % 1% % Time (μs) SD5 Transmission Line Pulsing(TLP) Plot SD1 Transmission Line Pulsing(TLP) Plot Littelfuse, Inc. Revision: /1/1

5 Temperature TVS Diode Arrays (SPA Diodes) General Purpose ESD Protection - SD15 Transmission Line Pulsing(TLP) Plot SD Transmission Line Pulsing(TLP) Plot SD3 Transmission Line Pulsing(TLP) Plot Soldering Parameters Reflow Condition - Temperature Min (T s(min) ) 15 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max) ) C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak T S(max) to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max) T S(min) t S Preheat t L Ramp-down Reflow - Temperature (T L ) (Liquidus) 17 C - Temperature (t L ) 15 seconds 5 time to peak temperature Time Peak Temperature (T P ) +/-5 C Time within 5 C of actual peak Temperature ( ) seconds Ramp-down Rate C/second max Time 5 C to peak Temperature (T P ) minutes Max. Do not exceed C Littelfuse, Inc. Revision: /1/1

6 c. D b TVS Diode Arrays (SPA Diodes) General Purpose ESD Protection - Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity. inches (.1mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 9 V- Ordering Information Part Number Package Marking Min. Order Qty. SD5-1FTG SOD33 g 3 SD1-1FTG SOD33 g1 3 SD15-1FTG SOD33 g 3 SD-1FTG SOD33 g3 3 SD3-1FTG SOD33 g 3 Notes : 1. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr.. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI Part Marking System Part Numbering System SD** 1 F T G g * TVS Diode Arrays (SPA Diodes) G= Green T= Tape & Reel Blank: SD5-1FTG 1: SD1-1FTG : SD15-1FTG 3: SD-1FTG : SD3-1FTG Voltage Number of Channels Package F: SOD33 Package Dimensions -SOD33 L E E1 L1 L.5 A1 A A Recommended Solder Pad Unit: mm SOD33 Symbol Millimeters Inches Min Max Min Max A A A b c D E E L.75 REF.19 REF L Ø º º º º 13 1 Littelfuse, Inc. Revision: /1/1