T5621 Series T5721 Series 5x7 mm Surface Mount High Reliability Tristate/Non-Tristate, 16kHz to 100MHz

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1 Features Leadless chip carrier package is hermetically sealed for superior aging and field performance Crystal angle controlled to ±1 minute for excellent temperature stability 168 hour Class B burn-in and extensive environmental testing for best performance in rugged field environments Start-up time <10 ms, typical Tristate option available Calculated MTBF is 3.8 x 10 6 hours at 12 C RoHS Status Application Surface Mounted PCB projects requiring high reliability HCMOS clock waveforms Description: These high reliability oscillators provide HCMOS clock waveforms for applications subjected to the most stringent environmental conditions. They are mechanically robust and weigh less than 0.2 grams. This x7mm SMD package has a hermetic seal, thus ensuring the integrity of the part. Each oscillator is burned-in at 12 C for 168 hours, temperature cycled and centrifuged then fully tested in accordance with Table 1. Reliability tests are performed per Table 2. Electrical Specifications Parameter Symbol Condition Min Typ Max Unit Note Range Stability F MHz F/F Vs. Operating Temperature 2 7 See Chart Aging 1 st Year 3 ppm After 1 st Year 1 Operating Temperature Range T C See Chart Input Voltage Vcc V Input Current Icc 20 3 ma Waveform Measured at 0% V DD 40/60 60/40 % Symmetry Rise / Fall Time Output Level Input Requirement for Pin.1 Tr/Tf Zero Level One Level <10MHz 10MHz Sinking 16mA 0. Sourcing 10mA 4. Output enable - pin 1 may float or 2.8V min(sourcing 400 ua) Output disable (Tristate) pin 1 requires 0.4V max (sinking 400 ua) 2 1 ns V 0.8 to 2.4 volts 1

2 Environmental and Mechanical Conditions Parameter Conditions Shock MIL-STD 883, Method 2002, Test Condition B (100 peak g, 0. ms duration, ½ sine wave, shocks in 6 planes) Vibration MIL-STD 883, Method 2007, Test Condition A ( Hz of 0.06 d.a. or 20 Gs, whichever is less) Humidity Resistant to 8 R.H. at 8 C Leak Case Pads MIL-STD-883, Method 1014, Condition A and Condition C Hermetically sealed ceramic LCC 60 microinch of gold over nickel Resistance to Solvents Per MIL-STD-202, Method 21 Marking Epoxy ink or laser engraved FIXED OUTPUT TRISTATE Model Model Operating Temperature Stability T621 T721 - C to +8 C ±2 ppm T622 T722 - C to +8 C ±0 ppm T623 T723 - C to +12 C ±7 ppm T624 T724 - C to +12 C ±0 ppm Table 1 Each unit undergoes screening for product level B class 2 oscillators by MIL-PRF-310 Internal Visual Stabilization Bake Temperature Cycling Constant Acceleration Fine Leak Gross Leak Burn-in Electrical test at 2 C Current Rise Time Fall Time Duty Cycle MIL-STD-883 Method 1008, COND. B MIL-STD-883 Method 1010, COND. B MIL-STD-883 Method 2001, COND. A MIL-STD-883 Method 1014, COND. A MIL-STD-883 Method 1014, COND. C MIL-STD-883 Method 101, COND. B (12 C for 160 hours with bias) at max V DD at min V DD Zero logic level One logic level Tristate at 2 C and frequency verification at temperature extremes Thermal Characteristics Thermal Resistance From Junction to Case, RØjc 16 C/Watt Surface Mount Application These packages are designed for reflow soldering in accordance with recommended profiles. For handsoldering, the temperature of the iron should not exceed 400 C for three seconds. Serialized test data on each unit available upon request for additional cost. 2

3 Pin Assignments Package Pin # T T721-T724 Pin 1 Not Connected Tristate Pin 2 Ground Ground Pin 3 Output Output Pin 4 +.0V, V DD +.0V, V DD Marking Specification Model Number How to Order T M MTXX M YWWx Product code M is model type in MHz Date Code Manufacturer s Code 3

4 Fig.1 T322-20M with 2pf load Fig.2 T322-20M without load Recommended Reflow Soldering Profile 4

5 TABLE 2 Reliability Test Procedures and Conditions for Quartz Crystal Oscillators 1. Group A Electrical Characteristics at 2 C at nominal supply voltage and endpoints Input current Symmetry (Duty Cycle) Zero/One levels Rise/Fall times (verify frequency at the temperature extremes) Physical Dimensions Length/width Height Package finish (Corrosion, discoloration, etc.) Marking placement/legibility 2. Group B 1000 hrs at or above 12 C, nominal voltage, proper load (sample size by MIL -PRF-310 table 6, max. aging within 1 years requirement without catastrophic failures) 3. Group C- All units have passed Group A testing A. Subgroup 1: 8 pcs. End Point MIL-STD-883 Method 2002 Mechanical Shock COND.B 100 g s, 0.ms Output waveform drops, 6 axis MIL-STD-883 Method 2007 Vibration, var. COND. A freq. 20 g s, Output waveform 0.06 disp., 20-20, Hz MIL-STD-883 Method 2003 Solderability Visual 9% Coverage B. Subgroup 2: 4 pcs (One-half of Subgroup 1) End point MIL-STD-883 Method 1011 Thermal Shock COND. B Liq. To liq. Output waveform 1 cycles MIL-STD-202 Method 10 Altitude, 3.44 COND. B inch Hg. 12 hrs Output waveform MIL-STD-883 Method 1004 Moisture resist. with supply Output waveform voltage applied 2 C to 6 C, 90 to 100% RH, 10 cycles MIL-STD-202 Method 210 Resistance to COND. A Solder Heat Output waveform 3. sec C. Subgroups 3: 4 pcs. (One half of Subgroup 1) End point Storage Temp C No. Oper C Output waveform MIL-STD-883 Method 1009 Salt Atmosphere COND. A 24 3 C Output waveform % Solution Visual MIL-STD-883 Method 1014 Fine Leak Qs < X10-8 COND. A MIL-STD-883 Method 1014 Gross Leak Visual in 12 C COND. C Detector fluid Test data is available for additional cost.