Enabling concepts: Packaging Technologies
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1 Enabling concepts: Packaging Technologies Ana Collado / Liam Murphy ESA / TEC-EDC 01/10/2018 ESA UNCLASSIFIED - For Official Use
2 Enabling concepts: Packaging Technologies Drivers for the future: Higher speed (>Gbps serial link) Higher integration between different active parts technologies Higher power dissipation Parts availability and market trends (e.g. Plastic parts, copper wire) Environmental regulation requirements (Lead free components) ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 2
3 Emerging Packaging Technologies for Space applications Plastic Ball Grid Array (PBGA): wire bonding on organic substrate Flip-chip on ceramics substrate Plastic Ball Grid Array (PBGA): Flip-chip on organic substrate Wafer Level Packaging: Fan-in or Fan Out WLP 2D & 2.5D packaging 3D Packaging ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 3
4 Enabling concepts: Flip chip packaging Concept description: Could be done onto ceramic or organic substrate (e.g.pbga) Different bumping solutions (SAC alloys, Cu pillar) Technology Benefits: Lower inductance than wire bonding Better bandwidth performance Lead free bumping (REACH compliant) Technology Drawbacks: Non-hermetic packages Little proven flight heritage Space acceptability: Extensive reliability testing related to Lead Free bumping and plastic packaging Establishment of procedures and requirements for manufacturing and test ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 4
5 Enabling concepts: Wafer Level Packaging Concept description: FI-WLP: Fan-in redistribution FO-WLP: Fan out redistribution with final molding Technology Benefits: Suitable for new sub-micron technologies (e.g. <28nm) Small Form Factor / Lower cost => High Drive from Mobile and IoT markets Technology Drawbacks: Dielectric strength /reliability of Redistribution Layers. Final encapsulation method is molded plastic (thermal management issues) Space acceptability: Lack of definition for testing of BEOL manufacturing Qualification approach similar to the silicon qualification ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 5
6 Enabling concepts: 2D / 2.5D Packaging Concept description: 2D / 2.5D Packaging (TSV). Silicon interposer, with or without TSVs. Different options/configurations possible Technology Benefits: Integration of different technologies (e.g. RF/ Digital) Technology Drawbacks: Use of Copper pillars with tin content > 97% Micro-copper pillars technology still evolving Complex testing procedures Space acceptability: High diversity of technologies and unknown reliability level (for Flight applications) ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 6
7 Enabling concepts: 3D Packaging Concept description: Proven Tech: Stacked dies and Package-on-Package (PoP) Emerging Tech: 3D Wafer Stacking with TSV interconnects Technology Benefits: Shorter-faster interconnections Solution for Memory on Logic Technology Drawbacks: Thermal management issues Micro-copper pillar & TSV technologies Limited shelf life (Moisture and solderability issues) Space acceptability: Complex Supply Chain. Qualification of both MEOL and BEOL processes ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 7
8 Conclusions From the packaging perspective: - Advanced packaging is perceived as a big variety of possible options in different maturity levels. - Requirements flow down from components performance requirements/needs - Reduced data available on space testing performed of Advanced Packaging - Complex supply chain adds difficulty to the qualification of the product - Advanced Packaging suppliers mainly in Far East - Upcoming packaging materials restrictions (RoHs, REACH) => Could ESA use/qualify any of these technologies in the future? ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 8
9 Advanced Packaging Conference ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 9
10 Back up slides CBGA: ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 10
11 Back up slides Organic BGA: ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 11
12 Back up slides TSV Formation: ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 12
13 Back up slides Xilinx Virtex T ESA UNCLASSIFIED - For Official Use Ana Collado TEC-EDC 01/10/2018 Slide 13
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