TARIF IFTEC DES NORMES IPC (TOUS LES PRIX SONT SUSCEPTIBLES D'ÉVOLUER EN FONCTION DE LA PARITÉ EURO/DOLLAR)

Transcription

1 TARIF IFTEC DES NORMES IPC (TOUS LES SONT SUSCEPTIBLES D'ÉVOLUER EN FONCTION DE LA PARITÉ EURO/DOLLAR) MAJ : 07/11/2017 Validité : 04/12/17 IFTEC : 33 rue Ravon BOURG-LA-REINE - France Tel : Fax : Mail : iftec@iftec.fr Site : SAS CAPITAL RCS Nanterre Id. TVA FR

2 Colissimo Expert France : poids < 2 kg 18 poids > 2kg < 4 kg 24 poids > 4kg < 6 kg 30 poids > 6kg < 8 kg 36 poids > 8kg < 10 kg B A A B 2221B-FR 2222A 2222A-FR 2223D LIV = Livre version papier CD = licence individuelle, PDF sur CD D = licence individuelle, PDF téléchargeable Coût transport / emballage Colissimo Expert étranger : 35 poids < 3 kg 69 poids > 3kg < 6 kg 78 poids > 6kg < 10 kg 103 poids > 10kg < 15 kg 129 poids > 15kg < 20 kg LIV IPC-1071B CD IPC-1071B(E) D IPC-1071(D)1-96 LIV IPC CD IPC-1072(E) D IPC-1072(D)1-96 LIV IPC-1601A CD IPC-1601A(E) Printed Board Handling and Storage Guidelines D IPC-1601A(D)1-96 LIV IPC D IPC-1782(D)1-158 D IPC-2141A(D)1-127 D IPC-2152(D)1-158 LIV TARIF IFTEC NORMES IPC AU 7 NOVEMBRE 2017 IPC-2220-FAM (SERIE 2221B A D ) LIV IPC-2221B IPC 2220 Family of Design Documents CD IPC-2221B(E) Generic Standard on Printed Board Design D IPC-2221B(D)1-158 LIV IPC-2221B-FR CD IPC-2221B-FR(E) D IPC-2221B-FR(D)1-222 LIV IPC-2222A D IPC-2222A(D)1-127 LIV IPC-2222A-FR CD IPC-2222A-FR(E) D IPC-2222A-FR(D)1-177 LIV IPC-2223D CD IPC-2223D(E) D IPC-2223D(D)1-158 D IPC-2225(D)1-127 D IPC-2226(D)1-127 Intellectual Property Protection in Printed Board Manufacturing Intellectual Property Protection in Electronic Assembly Manufacturing Standard for Manufacturing and Supply Chain Traceability of Electronic Products Design Guide for High-Speed Controlled Impedance Circuit Boards Standard for Determining Current Carrying Capacity in Printed Board Design Norme Générique de Conception du Circuit Imprimé (French Language) Sectional Design Standard for Rigid Organic Printed Boards Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides (French Language) Sectional Design Standard for Flexible Printed Boards Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies Sectional Design Standard for High Density Interconnect (HDI) Boards

3 D IPC-2251(D)1-127 LIV IPC CD IPC-2291(E) Design Guideline for Printed Electronics D IPC-2291(D)1-96 D IPC-2611(D)1-96 D IPC-2612(D)1-96 D IPC (D)1-127 D IPC-2614(D)1-127 Design Guide for the Packaging of High Speed Electronic Circuits Generic Requirements for Electronic Product Documentation Sectional Requirements for Electronic Diaamming Documentation (Schematic and Logic Descriptions) Sectional Requirements for Electronic Diaamming Symbol Generation Methodology Sectional Requirements for Board Fabrication Documentation 2615 D IPC-2615(D)1-127 Printed Board Dimensions and Tolerences 4101E 4103A-WAM1 4202B 4203A 4204A-WAM1 4412B 4552-WAM A A-WAM1 LIV IPC-4101E D IPC-4101E(D)1-156 LIV IPC-4103A-WAM CD IPC-4103A-WAM1(E) D IPC-4103A-WAM1(D)1-127 LIV IPC-4202B D IPC-4202B(D)1-90 LIV IPC-4203A CD IPC-4203A(E) D IPC-4203A(D)1-127 LIV IPC-4204A-WAM CD IPC-4204A-WAM1(E) D IPC-4204A-WAM1(D)1-127 LIV IPC-4412B CD IPC-4412B(E) D IPC-4412B(D)1-96 LIV IPC-4552-WAM CD IPC-4552-WAM1-2(E) D IPC-4552-WAM1-2(D)1-158 D IPC-4553A(D)1-158 D IPC-4554(D)1-158 LIV IPC CD IPC-4556(E) D IPC-4556(D)1-158 LIV IPC-4562A-WAM CD IPC-4562A-WAM1(E) Metal Foil for Printed Board Applications D IPC-4562A-WAM1(D)1-127 Specification for Base Materials for Rigid and Multilayer Printed Boards Specification for Base Materials for High Speed / High Frequency Applications Flexible Base Dielectrics for Use in Flexible Printed Circuitry Cover and Bonding Material for Flexible Printed Circuitry Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry - With Amendment 1 Specification for Finished Fabric Woven from "E" Glass for Printed Boards Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Specification for Immersion Silver Plating for Printed Boards Specification for Immersion Tin Plating for Printed Circuit Boards - includes Amendment 1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

4 D 6012D-FR D IPC-5704(D)1-96 LIV IPC-6010-FAM (SERIE D C C) D IPC-6011(D)1-96 LIV IPC-6012D CD IPC-6012D(E) D IPC-6012D(D)1-158 LIV IPC-6012D-FR CD IPC-6012D-FR(E) D IPC-6012D-FR(D)1-222 Cleanlisness Requirements for Unpopulated Printed Board IPC-6010 Family of Board Performance Documents Generic Performance Specification for Printed Boards Qualification and Performance Specification for Rigid Printed Boards Spécification de la Qualification et des Performances des Circuits Imprimés Rigides 6012DA LIV IPC-6012DA CD IPC-6012DA(E) D IPC-6012DA(D)1-96 Automotive Applications Addendum to IPC-6012D 6012DS-FR LIV IPC-6012DS-FR CD IPC-6012DS-FR(E) D IPC-6012DS-FR(D)1-127 Avenant pour les Applications Spatiales et Aéronautiques Militaires de l'ipc-6012d 6013D LIV IPC-6013D D IPC-6013D(D)1-158 D IPC-6015(D)1-96 D IPC-6016(D) D IPC-6017(D) C LIV IPC-6018C CD IPC-6018C(E) D IPC-6018C(D)1-158 Qualification and Performance Specification for Flexible Printed Boards Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7090 LIV IPC-7090-FAM (SERIE C) IPC-7090 Packages for PCBs and Assemblies C LIV IPC D IPC-7091(D)1-158 LIV IPC CD IPC-7092(E) D IPC-7092(D)1-158 D IPC-7093(D)1-158 D IPC-7094(D)1-158 LIV IPC-7095C CD IPC-7095C(E) D IPC-7095C(D)1-158 Design and Assembly Process Implementation of 3D Components Design and Assembly Process Implementation for Embedded Components Design and Assembly Process Implementation for Bottom Termination Components Design and Assembly Process Implementation for Flip Chip and Die Size Components Design and Assembly Process Implementation for BGAs 7351B LIV IPC-7351B D IPC-7351B(D)1-158 Generic Requirements for Surface Mount Design and Land Pattern Standard

5 7525B D IPC-7525B(D)1-96 LIV IPC Stencil Design Guidelines A 7711/21C 7711/21B-FR CD IPC-7527(E) Requirements for Solder Paste Printing D IPC-7527(D)1-158 LIV IPC-7530A D IPC-7530A(D)1-158 LIV IPC-7711/21C CD IPC-7711/21C(E) D IPC-7711/21C(D)1-309 LIV IPC-7711/21B-FR CD IPC-7711/21B-FR(E) D IPC-7711/21B-FR(D)1-424 LIV IPC CD IPC-9121(E) Troubleshooting for PCB Fabrication Processes D IPC-9121(D)1-319 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) Rework, Modification and Repair of Electronic Assemblies Reprise, modification et réparation des assemblages électroniques 9201A D IPC-9201A(D)1-158 Surface Insulation Resistance Handbook B B 9701A 9704A 9709 A-600J D IPC-9202(D)1-96 LIV IPC CD IPC-9203(E) D IPC-9203(D)1-158 LIV IPC-9252B CD IPC-9252B(E) D IPC-9252B(D)1-96 LIV IPC CD IPC-9641(E) High Temperature Printed Board Flatness Guideline D IPC-9641(D)1-96 LIV IPC-9691B CD IPC-9691B(E) D IPC-9691B(D)1-158 D IPC-9701A(D)1-96 LIV IPC-9704A CD IPC-9704A(E) D IPC-9704A(D)1-158 LIV IPC CD IPC-9709(E) D IPC-9709(D)1-158 LIV IPC-A-600J CD IPC-A-600J(E) Acceptability of Printed Boards D IPC-A-600J(D)1-183 Material and Process Characterization / Qualification Test Protocol for Assessing Electrochemical Performance Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle Requirements for Electrical Testing of Unpopulated Printed Boards User Guide for the IPC-TM-650, Method , Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Miation Testing) Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Printed Circuit Assembly Strain Gage Test Guideline Test Guidelines for Acoustic Emission Measurements during Mechanical Testing

6 A-600J-FR LIV IPC-A-600J-FR CD IPC-A-600J-FR(E) D IPC-A-600J-FR(D)1-270 Acceptabilité des Circuits Imprimés (French language) A-610G LIV IPC-A-610G D IPC-A-610G(D)1-183 Acceptability of Electronic Assemblies A-610F-FR A-620C A-620C-FR A-630 LIV IPC-A-610F-FR CD IPC-A-610F-FR(E) D IPC-A-610F-FR(D)1-222 LIV IPC-A-620C CD IPC-A-620C(E) D IPC-A-620C(D)1-183 LIV IPC/WHMA-A-620C-FR D IPC/WHMA-A-620C-FR(D)1-261 LIV IPC-A CD IPC-A-630(E) D IPC-A-630(D)1-158 Acceptabilité des assemblages électroniques (French Language) Requirements and Acceptance for Cable and Wire Harness Assemblies Exigences et Critères d'acceptabilité pour l'interconnexion des Faisceaux de Fils et de Câbles (French Language) Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures AJ-820A LIV IPC-AJ-820A CD IPC-AJ-820A(E) Assembly & Joining Handbook CC-830B- WAM1 CH-65B D-620-K D IPC-AJ-820A(D)1-158 D IPC-CC-830B-WAM1(D)1-96 D IPC-CH-65B(D)1-158 LIV IPC-D-620-K CD IPC-D-620(E) D IPC-D-620(D)1-158 DRM-18H LIV IPC-DRM-18H DRM-PTH-F LIV IPC-DRM-PTH-F DRM-SMT-F LIV IPC-DRM-SMT-F Component Identification Training and Reference Guide Through-Hole SolderJoint Evaluation Training & Reference Guide Surface Mount Solder Joint Evaluation Training & Reference Guide DRM-WHA-B LIV IPC-DRM-WHA-B Wire Harness Assembly Training & Reference Guide LIV IPC-HDBK-001F Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes Amendment 1 Guidelines for Cleaning of Printed Boards and Assemblies Design and Critical Process Requirements for Cable and Wiring Harnesses (kit products : WP-113, WP- 114, WP-116) HDBK-001F HDBK-005 CD IPC-HDBK-001F(E) D IPC-HDBK-001F(D)1-158 D IPC-HDBK-005(D)1-158 Handbook and guide to supplement IPC-J-STD-001 Guide to Solder Paste Assessment HDBK-630 LIV IPC-HDBK CD IPC-HDBK-630(E) D IPC-HDBK-630(D)1-158 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

7 HDBK-830A LIV IPC-HDBK-830A CD IPC-HDBK-830A(E) D IPC-HDBK-830A(D)1-158 Guidelines for Design, Selection and Application of Conformal Coatings HDBK-840 D IPC-HDBK-840(D)1-158 Solder Mask Handbook HDBK-850 J-STD-001G J-STD-001F- FR J-STD-002D J-STD-003C- WAM1 J-STD-004B J-STD-005A J-STD-006C J-STD-020E J-STD-030A J-STD-033C-1 J-STD-075 SM-784 SM-785 LIV IPC-HDBK CD IPC-HDBK-850(E) D IPC-HDBK-850(D)1-158 LIV IPC-J-STD-001G D IPC-J-STD-001G(D)1-158 LIV IPC-J-STD-001F-FR CD IPC-J-STD-001F-FR(E) D IPC-J-STD-001F-FR(D)1-222 LIV IPC-J-STD-002D CD IPC-J-STD-002D(E) D IPC-J-STD-002D(D)1-127 LIV IPC-J-STD-003C-WAM CD IPC-J-STD-003C-WAM1(E) Solderability Tests for Printed Boards D IPC-J-STD-003C-WAM1(D)1-158 D IPC-J-STD-004B(D)1-158 LIV IPC-J-STD-005A CD IPC-J-STD-005A(E) Requirements for Soldering Pastes D IPC-J-STD-005A(D)1-96 LIV IPC-J-STD-006C CD IPC-J-STD-006C(E) D IPC-J-STD-006C(D)1-96 LIV IPC-J-STD-020E CD IPC-J-STD-020E(E) D IPC-J-STD-020E(D)1-96 LIV IPC-J-STD-030A CD IPC-J-STD-030A(E) D IPC-J-STD-030A(D)1-158 LIV IPC-J-STD-033C CD IPC-J-STD-033C-1(E) D IPC-J-STD-033C-1(D)1-96 D IPC-J-STD-075(D)1-96 D IPC-SM-784(D)1-127 D IPC-SM-785(D)1-127 Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly Requirements for Soldered Electrical and Electronic Assemblies Exigences des Assemblages Electriques et Electroniques Brasés (French Language) EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires Requirements for Soldering Fluxes - includes Amendment 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices Selection and Application of Board Level Underfill Materials Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices Classification of Non-IC Electronic Components for Assembly Processes Guidelines for Chip-on-Board Technology Implementation Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

8 SM-817A SM-840E T-50M T-50M-FR LIV IPC-SM-817A CD IPC-SM-817A(E) D IPC-SM-817A(D)1-96 D IPC-SM-840E(D)1-96 LIV IPC-T-50M CD IPC-T-50M(E) D IPC-T-50M(D)1-158 LIV IPC-T-50M-FR CD IPC-T-50M-FR(E) D IPC-T-50M-FR(D)1-222 General Requirements for Dielectric Surface Mount Adhesives Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Terms and Definitions for Interconnecting and Packaging Electronic Circuits Termes et Définitions pour les Circuits Electroniques Imprimés et Assemblés (French Language)