Comparative tests on Electronic Technologies to be compatible with thermal cycling over extreme temperature range
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1 Comparative tests on Electronic Technologies to be compatible with thermal cycling over extreme temperature range 11th ESA Workshop on Advanced Space Technologies for Robotics and Automation ASTRA 2011 Dr. Sabine Klinkner von Hoerner & Sulger GmbH Schlossplatz 8, D Schwetzingen Co-authors: Nghiem Bao Duy Nguyen, Uwe Dose, Dr. Chris Gee-Yin Lee, and Dr. Josef Dalcolmo 1
2 Presentation Outline Introduction Test objectives Test items Overall test flow Test results Conclusion 2
3 ExoMars Bogie Motor Controller (BMC) Basic requirements BMC outside of thermally controlled warm body Electronics subject to extreme non-operational temperatures for ~ 180 temperature cycles Operational range: -50 C to +40 C Non-operational range: -125 C to +40 C PP Sterilisation: 125 C Qualification (test) temperature must exceed op & non-op limits by 10K Non-redundant BMC consists of one controller and one power board 3
4 Test objectives Testing PCB-component level NOT the components themselves 5 populated boards Four different configuration of materials One additional test item for vibration test of ceramic substrate Same schematic design, same layout as far as possible Component types/packages representative of FM unit Different track/via/pad geometries Tested simultaneously 4
5 PCB materials Thickfilm Hybrid PCBs Matching CTE, good thermal conductivity Required dimensions/configuration not space qualified Polyimide board High thermal resistance, CTE higher than ceramic Fully space qualified Solder Indium-alloy solder remains ductile at low temperatures Not space qualified Parylene C Coating Parylene is not ESA qualified Space applications MIL-I-46058C Coating thickness with 1-20µm Rigid-flex PCB Light and compact solution I/F to Ceramic boards 5
6 Test items 6
7 Testboard layout Ceramic test items Polyimide Test item Flexboard with Wirebonds Printed resistors 7
8 Overall test flow 1. Design of test items. 2. Manufacture/Population of test items. 3. Application of Parylene Coating. 4. Empty board tests. Application of Parylene Coating. Simulation of Dry Heat Microbial Reduction. Thermal cycling tests. 5. Simulation of Dry Heat Microbial Reduction. 6. Vibration test before thermal cycling. 7. Thermal cycling tests. 8. Vibration after thermal tests. 8
9 Test results of empty board cycling Application of DHMR process 3 periods of 6h at 125 C Visual inspection: All fine 10 thermal cycles with same test procedure as for populated boards Starting from ambient temperature Heating to +50 C Cooling to 135 C Heating to ambient temperature Visual inspection: Small patches of coating de-lamination on ceramic board 9
10 DHMR and Vibration Test results Populated items use same DHMR simulation process as empty boards The visual inspection did not reveal any change of board or coating properties. DHMR simulation had no effect on functionality of test items Ceramic boards withstand vibration test Approval of Mounting method for ceramic boards All five test items fully functional after test No visual effect of vibration 10
11 Thermal cycling test results Three major failure types: Failures on transformer solder joints on ceramic boards, caused by glueing method. Loose solder pads on ceramic boards with indium solder. Loose Parylene C coating on all test items. 11
12 Failure type 1 Failure of transformers on ceramic boards likely caused by glueing location, allowing tilt movement. Vibration may have damaged the solder joints. Glue on Polyimide substrate Glue on Ceramic substrate 12
13 Failure type 2 Pads on indium solder ceramic board come off. Effect increased with additional hand soldering process. Indium ceramic boards have different layer material configuration than tin-lead solder boards. Gold pad with indium solder delaminates easily from track layers below. MOSFET pads on ceramic board Thermistor pads 13
14 Failure type 3 Parylene C does not stick well to ceramic / glassivated surfaces. Parylene C is tested to survive temperatures down 160 C. Upper limit is given between 125 C and 220 C. Higher temperature and oxygen atmosphere shorten use life of Parylene C. Backside of ceramic board Coating on polyimide item Coating around MOSEFTs on ceramic boards 14
15 Conclusions Test provided various information on considered technologies Polyimide board shows the best results with no broken solder joint. Ceramic with tin-lead solder performed well few broken solder joints. Ceramic with Indium solder most failures mainly lift-off of solder pads. Test results do show a clear difference BUT none of the technologies can be clearly favoured/completely discarded Three main error types Gluing method of transformers Apply same gluing method as for Polyimide board Ceramic boards with indium solder Review material combination Parylene C Alternative coating/ reviewing DHMR process Limited number of samples no statistical conclusion Further tests required 15
COMPARATIVE TESTS ON ELECTRONIC TECHNOLOGIES TO BE COMPATIBLE WITH THERMAL CYCLING OVER EXTREME TEMPERATURE RANGE
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