Ultra Fine Pitch Printing of 0201m Components. Jens Katschke, Solutions Marketing Manager

Transcription

1 Ultra Fine Pitch Printing of 0201m Components Jens Katschke, Solutions Marketing Manager

2 Agenda Challenges in miniaturization 0201m SMT Assembly Component size and appearance Component trends & cooperation with manufacturers Production equipment, parameters & settings, materials Results Important topics which influence the yield First impressions from the new ASM 0201m Test Board ASM Assembly Systems 3/15/2018 Page 2

3 Agenda Challenges in miniaturization 0201m SMT Assembly Component size and appearance Component trends & cooperation with manufacturers Production equipment, parameters & settings, materials Results Important topics which influence the yield First impressions from the new ASM 0201m Test Board ASM Assembly Systems 3/15/2018 Page 3

4 Comparison Smallest components: 0603, 0402, 0201, 0402 m, 0201 m Salt crystals 0402m (metric) 0201m (metric) mm ASM Assembly Systems 3/15/2018 Page 4

5 Comparison Human hair on top of 0201m capacitor dimensions in µm 0201m Length: µm 3 Hair Diameter: µm 0201m Width: µm 1 2 ASM Assembly Systems 3/15/2018 Page 5

6 Component type nomenclature Component declaration [in] x [in] Non-metric (imperial code) metric [mm] x [mm] q ,25 x 0,125 n.a ,3 x 0,15 0,016 in x 0, ,4 x 0,2 0,024 in x 0, ,6 x 0,3 0,039 in x 0, ,0 x 0, ,6 x 0,8 ASM Assembly Systems 3/15/2018 Page 8

7 Used printer for 0201m printing DEK NeoHorizon 03iX Improved performance: Core Cycle Time: 8 sec Machine Alignment Capability: 2 ±12,5 µm (± 6 Sigma) Wet print (CpK) Capability**: 2 ±25µm (± 6 Sigma) CpK Accuracy certification by external system AVS as standard Configuration: **2 ±25µm certified by external equipment by ASM AVS Squeegee pressure feedback Hawkeye 750 camera (prepared for verification) DEK Adjustable Width Stencil Mount (AWSM) DEK Cyclone for wet/vac/dry cleaning VF35 side channel vacuum pump DEK All Purpose Clamping (APC) ASM Assembly Systems 3/15/2018 Page 10

8 DEK Stainless Steel stencil with DEK Nano Ultra coating 50 µm thick Optimized stencil performance! DEK Stainless Steel stencil DEK FineGrain Laser cut DEK Nano Ultra coated For smooth and reliable solder paste release. ASM Assembly Systems 3/15/2018 Page 12

9 Pad and stencil aperture dimensions for 0201mm 12,5 µm 100 µm Aperture 125 µm 130 x 90 µm µm 100 µm 100 µm 110 µm 250 µm 310 µm Pad on PCB Gap: Pad to Pad ASM Assembly Systems 3/15/2018 Page 13

10 DEK Stencil Solutions Stencil technical specification ASM Laser Cut stencil products Standard Stainless Steel Laser Cut Nickel FineGrain Stainless Steel Standard E-form Nickel Platinum E-form Stencil Material Type 304 PHD Nickel Fine Grain SS Hard Nickel Hard Nickel Material Hardness (HV) 370 > / /-50 Grain Size (µm) Thickness Available (µm) Thickness Tolerance 4% 7% <2% 10% <5% Area Ratio window >0.66 >0.6 >0.55 >0.5 >0.5 Sheet width max 610mm 584mm 610mm 610mm 584mm Apertures Size Tolerance ±5 µm ±5 µm ±5 µm ±10 µm ±4 µm ASM Assembly Systems 3/15/2018 Page 14

11 Product curve of Laser Cut stencils Laser Cut Standard Stainless Steel (SS) >0.66 Laser Cut Fine Grain (FG) >0.55 Laser Cut Fine Grain (FG) + NanoUltra >0.45 Improved Yield. Increased Efficiency, reduced costs ASM Assembly Systems 3/15/2018 Page 15

12 DEK Nano Ultra Coating of aperture walls None coated aperture Coated aperture ASM Assembly Systems 3/15/2018 Page 16

13 Solder paste type 6 printed with DEK 45 µm stencil ASM Assembly Systems 3/15/2018 Page 17

14 Comparison different solder paste types Alloy: SAC - SnAg3Cu0.5 Type 5 Type 6 The use of type 6 solder paste is highly recommended Type 5: resonable results after reflow 18 µm 10 µm Average solder ball diameters ASM Assembly Systems 3/15/2018 Page 18

15 Requirements Reflow oven To start processing 03015m & 0201m components, make sure that your reflow oven has the following components/features: PCB transport: Absolutely vibration-free Thin substrates require a support system Temperature profile: Stable process repeat accuracy (Cmk at least 1.67, preferably > 2) The system must have a homogeneous linear temperature profile with a rise gradient that s controllable via temperature and flow rate. The timeline over liquids must be adjustable in very fine increments. To keep the difference between the desired reflow temperature and the oven s peak temperature as small as possible, select a system with excellent heat transfer characteristics. The cooling-down gradient must be adjustable via temperature and flow rate. Reflow atmosphere: The system must be able to operate with a Nitrogen atmosphere. The Nitrogen controller must operate accurately within the ppm range and provide 100 percent control over the nitrogen volume. ASM Assembly Systems 3/15/2018 Page 19

16 Comparison Type 5 and Type 6 solder paste after reflow Type 5 Type 6 ASM Assembly Systems 3/15/2018 Page 20

17 Solder Joints of 0201 metric (solder paste SAC05, type 6, 45 µm) ASM Assembly Systems 3/15/2018 Page 21

18 Is it really that simple to process & 0201m? Well, perfect equipment will definitely help to make your life easy. But watch out that you also use the right ingredients. You need as well a: Perfect layout Good PCB manufacturer & material Clean and temperature controlled environment Next you will see what you should also pay attention to! ASM Assembly Systems 3/15/2018 Page 22

19 What s the problem with board stretch? Stencil Elongated PCB versus stencil Left Center Right Elongated PCB versus stencil Solder Paste shifted to the right PCB / Pallet Solder Paste shifted to the left Solder Paste without shift ASM Assembly Systems 3/15/2018 Page 23

20 Where do you measure the pad dimensions? Top or bottom? Well, it depends! PCB makers measure at the bottom, stencil makers at the top ASM Assembly Systems 3/15/2018 Page 24

21 Different processes used during PCB manufacturing will lead to a different geometry of the pads which leads to paste printing problems The standard process Panel-Plating Technology Special process Pattern-Plating Technology Creates often overetched pads! ASM Assembly Systems 3/15/2018 Page 25

22 Mismatch of stencil and PCB because of PCB stretch together with overetching of small pads will lead into desaster Despite the stencil apertures having the correct size and the correct pad to pad distance, printing will be impossible or will have poor quality. The problem is caused by pads which do not have the dimensions as specified when ordering the PCB, and pads which are not in the locations where they are supposed to be, due to shrinkage. ASM Assembly Systems 3/15/2018 Page 26

23 What can happen, if PCB and Stencil do not match due to shrinkage / stretch of the PCB in combination with over etched pads Scenario 1: The stencil slides over the pads, then no paste will end up on top of the pads, the squeegee will wipe it off. Only in the gap between the pad and the stencil opening some paste may be sticking. Scenario 2: The stencil is gasketing only on one side of a pad, then it will not lay flat on top of the pads. In some areas the squeegee will wipe paste off. In other areas the stencil will push paste in the gap between the pad and the stencil bottom side. ASM Assembly Systems 3/15/2018 Page 27

24 New Test PCB Components ASM Assembly Systems 15/03/2018 Page 29

25 Example Some layout variations on the new Test PCB Nominal pad dimensions Track width of 60 and 40 µm Pad to Pad gap 50 µm ASM Assembly Systems 15/03/2018 Page 30

26 50 µm gap without tracks 50 µm gap with 40µm wide tracks ASM Assembly Systems 15/03/2018 Page 31

27 Perfect placed 0201m on sticky tape ASM Assembly Systems 15/03/2018 Page 32

28 Test board printed with type 5 solder paste / stencil thickness 50 µm Pad dimensions: 150 x 140 µm Distance: 100 µm Pad to Pad spacing: 75 µm Pad dimensions: 150 x 140 µm Distance: 90 µm Pad to Pad spacing: 75 µm Pad dimensions: 150 x 130 µm Distance: 90 µm Pad to Pad spacing: 75 µm Pad dimensions: 125 x 140 µm Distance: 90 µm Pad to Pad spacing: 75 µm ASM Assembly Systems 15/03/2018 Page 33

29 0201m placed in paste with a 50 µm gap (pad to pad) ASM Assembly Systems 15/03/2018 Page 34

30 Reflowed PCB with 0201m with 60 µmtracks between pads ASM Assembly Systems 15/03/2018 Page 35

31 Comparison for Between different track width, track design, gap and pad size Tilted components Tilted components Straight components Straight components 03015m-P2-00-TE40-50-X m-P3-00-TE40-50-X m-P2-90-TM60-75_X m-P2-90-TM40-75_X100 gap It seems that a smaller gap causes components to tilt ASM Assembly Systems 15/03/2018 Page 36

32 Possible defects Tombstone due to dust in the production environment 01005m Fiber ASM Assembly Systems 15/03/2018 Page 37

33 Any particles, dust, fibers will cause defects: A clean environment and clean materials are a must! 03015m ASM Assembly Systems 15/03/2018 Page 38

34 Professional network on Xing and LinkedIn Latest information on facebook All videos & animations on YouTube ASM Newsletter All ASM online tools at a glance MyASM Stay informed via Blog: Smart SMT Factory Forum Thank you Jens Katschke, jens.katschke@asmpt.com