no-clean and halide free INTERFLUX Electronics N.V.
|
|
- Clara Barber
- 5 years ago
- Views:
Transcription
1 Delphine series no-clean and halide free s o l d e r p a s t e INTERFLUX Electronics N.V.
2 Product manual
3 Key properties - Anti hidden pillow defect - Low voiding chemistry - High stability - High moisture resistance - Suitable for vapor phase soldering - Long profile capability - Halogen free - RO L0 (IPC-JSTD-004A) - Good cosmetics, clear minimal residue is a next generation lead-free from INTERFLUX Delphine lead-free series. After the implementation of lead-free processes it was clear that the chemistry in the lead-free era needed to be different from what was used up until then. Using the experience of the first generation lead-free products, market demands and analysis of market feedback, the Delphine carefully combines this acquired knowledge into a high performance product.
4 Performance overview ultra fine pitch capability volume consistency better than 3% difference in repeatability on combined 0,25mm (10mil) and 0,20mm (8mil) round apertures less than 2% difference after 6 hours of regular printing Printing printer abandon less than 2% difference after 2 hours temperature range excellent performance between 15 C and 29 C print speed range 20 mm/sec to 150 mm/sec voiding pass IPC-7095A class 1,2,3 requirements solder beading excellent performance Reflow solder balls pass preferred to IPC-J-STD-004 solder wetting pass preferred to IPC-J-STD-004 cold/ hot slump pass to IPC-J-STD-004 residue/ cosmetics excellent performance Ambient humidity resistance pass 4 hours at 26 C and 96% RH prior to reflow have no effect on reflow of mounted boards
5 Performance radar graph radar graph extensive field: 14 parameters total mean score: 84% alloy tested: Sn96,5 Ag3,0 Cu0,5 metal content tested: 89,5% squeegee release residue tackiness paste rolling residue spread print definition solder ball abandon void level tack solder spreading slump hot & cold solder wetting hidden pillow humidity resistance
6 Hidden pillow temperature: 22 C humidity: 55% R.H. method: Bga peel off after reflow hidden pillow on bga body side hidden pillow on board side The hidden pillow or head-in -pillow defect on a ball grid array (bga) type component as seen in a cross section. on bga body side on board side
7 Voiding reference: IPC-7095A result: pass for class 1,2,3 low voiding on voids on standard paste
8 Ultra fine pitch capability print speed: 70mm/sec temperature: 22 C humidity: 55% R.H. aperture: 0,25 mm (10mil) A difference of less than 3% volume deviation was measured. An abandon time of 1 hour for 0,25mm (10mil) apertures as test condition. Capable to show high repeatability of the volume of the printed deposit for 0,25mm (10mil) and 0,20mm (8mil) aperture sizes using type 3 size powder Repeatable 0201 component aperture printing using type 3 size powder Typical under screen cleaner wipe interval up to 10 prints at 0,5mm (20mil) pitch
9 Volume consistency Boards are printed using a 120µm thick stencil. Before and after each print boards are weighed on high precision scales. This process is repeated in time and the obtained values are set out in the graph below. print speed: 70mm/sec temperature: 22 C humidity: 55% R.H. During a 6 hour period of printing, a difference of less than 2% volume deviation was measured.
10 Printer abandon Boards are printed using a 120µm thick stencil. Before and after each print boards are weighed on high precision scales. This process is repeated after 2 hours of inactivity and values are set out in the graph below. print speed: 70mm/sec temperature: 22 C humidity: 55% R.H. After a 2 hour period of abandoning the printer and paste, a difference of less than 2% volume deviation was measured for the first print. The 2nd and 3rd print showed a deviation of less than 0,2% which is considered standard process deviation.
11 Temperature range Volume deviation variations of the printed paste amount at different temperatures. print speed: 70mm/sec temperature: variable C humidity: 55% R.H. At 15 C a total deviation of less than 0,6% was measured, at 22 C the deviation was less than 0,8% and at 29 C the deviation was less than 1,5%.
12 Print speed range Volume variations at different print speeds of the printed paste amount print speed: variable temperature: 24 C humidity: 53% R.H. mean deviations measured: 10mm/sec: less than 0,2% 20mm/sec: less than 0,4% 35mm/sec: less than 0,4% 50mm/sec: less than 0,2% 70mm/sec: less than 0,2%
13 Solder paste tack Tack force over an 8 hour period of time method: J-STD-005 and IPC-TM temperature: 25 C ± 2 C humidity: 50% R.H. ± 10% tack in g mean deviations measured: less than 3% over 8 hour (480min)
14 Solder beading print speed: 70 mm/sec temperature: 22 C humidity: 53% R.H. Solder beading resistance: good
15 Solder balling temperature: 22 C humidity: 55% R.H. method: J-STD-005 IPC-TM result: pass as preferred 15 min result: pass as preferred 4 hours
16 Solder wetting temperature: 22 C humidity: 55% R.H. method: J-STD-005 IPC-TM wetting on oxidized Cu 105% spread of the printed SAC305 paste wetting and spreading on NiAu the grey circle is original print deposit area wetting and spreading on Chem Sn the grey circle is original print deposit area
17 Cold/ hot slump temperature: 22 C humidity: 55% R.H. method: J-STD-005 IPC-TM Pre slump pattern A-21 Hot slump: pass pattern A-20 Cold slump: pass pattern A-21 Hot slump: pass pattern A-21
18 Residue/ cosmetics typical residue amount after reflow: <5%
19 Humidity resistance temperature: 26 C humidity: 96% RH time: 3 and 4 hours a suffering from humidity 3 hours at 26 C - 96% RH prior to reflow resulting in displaced components and flux spatter humidity resistance 4 hours at 26 C - 96% RH prior to reflow
20 Application data Printing data squeegee material: stainless steel preferred printing speed: mm/sec squeegee pressure: ±0,25 kg per cm squeegee blade length temperature range: C humidity: % R.H. stencil life: > 8 hours abandon time: 2 22 C 55% R.H. Mounting data tack time: > 8 hours Reflow data consult product T.D. for details profile type: straight ramp to peak or soak profile heating type: convection, vapor phase, laser, atmosphere: air or nitrogen (N 2 ) recommended linear and soak profile for SnAgCu alloy m.p. 217 C
21 Reliability data Electrical properties (summary) Surface Insulation Resistance pass 8,98x1008 Ω TM (IPC 85 C-85%R.H.) Electrical properties (details) boards (group E) Control boards (group F) Board 1 Board1 Pattern T1 6,23x1008 Ω Ti 3,96x1012 Ω T3 9,86x1008 Ω T1 3,01x1009 Ω T3 2,72x1009 Ω Board 2 Board2 Pattern T1 7,54x1008 Ω Ti 2,28x1012 Ω T3 1,18x1009 Ω T1 2,70x1009 Ω T3 2,16x1009 Ω Board 3 Pattern T1 4,82x1008 Ω T3 5,32x1008 Ω Ti pattern initial measurements T1 pattern measurements after 24 hours T3 pattern measurements after 168 hours
22 Other data Cleaning Stencil manual cleaning: Misprint: Interflux ISC 8020 and IPA/ D.I. pre-saturated wipes Interflux ISC 8020 and IPA/ D.I. pre-saturated wipes Storing Unopened paste jars: Opened paste jars: keep at 3-7 C at room temperature Do not mix used and new paste as this may change paste properties INTERFLUX Electronics N.V. Eddastraat Gent INTERFLUX Singapore Ltd. Belgium INTERFLUX China INTERFLUX Danmark Aps INTERFLUX Eesti Ltd Represented by: INTERFLUX France INTERFLUX Electronikai Kft Hungary INTERFLUX Electronics Italia INTERFLUX Poland INTERFLUX Skandinavia AB INTERFLUX Skandinavia Norge As
M series. Product information. Koki no-clean LEAD FREE solder paste. Contents. Lead free SOLUTIONS you can TRUST.
www.ko-ki.co.jp Ver. 42017e.2 Prepared on Oct. 26, 2007 Koki no-clean LEAD FREE solder paste Anti-Pillow Defect Product information This Product Information contains product performance assessed strictly
More information& Anti-pillow. Product information. Koki no-clean LEAD FREE solder paste. Contents. Lead free SOLUTIONS you can TRUST.
www.ko-ki.co.jp #46019E Revised on JUN 15, 2009 Koki no-clean LEAD FREE solder paste Super Low-Void & Anti-pillow Product information Pillow defect This Product Information contains product performance
More informationEngineering Manual LOCTITE GC 10 T3 Solder Paste
Engineering Manual LOCTITE GC T Solder Paste Suitable for use with: Standard SAC Alloys GC The Game Changer Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters
More informationPRODUCT PROFILE ELECTROLOY NO CLEAN LEAD FREE PASTE
PRODUCT PROFILE ELECTROLOY NO CLEAN LEAD FREE PASTE Product Name Product Code #515 LEAD FREE PASTE Sn99.0/Ag0.3/Cu0.7 EMCO#515-315P DOC CATEGORY: 3 PF EMCO#515-315P 14062010 REV.B Page 1 of 5 PRODUCT DESCRIPTION
More informationS3X58-M High Reliability Lead Free Solder Paste. Technical Information. Koki no-clean LEAD FREE solder paste.
www.ko-ki.co.jp #52007 Revised on Nov.27, 2014 Koki no-clean LEAD FREE solder paste High Reliability Lead Free Solder Paste S3X58-M500-4 Technical Information O₂ Reflowed 0.5mmP QFP 0603R This product
More informationTECHNICAL INFORMATION
TECHNICAL INFORMATION Super Low Void Solder Paste SE/SS/SSA48-M956-2 [ Contents ] 1. FEATURES...2 2. SPECIFICATIONS...2 3. VISCOSITY VARIATION IN CONTINUAL PRINTING...3 4. PRINTABILITY..............4 5.
More informationGSP. TOYOTA s recommended solder paste for automotive electronics. Product information. LEAD FREE solder paste.
www.ko-ki.co.jp #47012E 2011.09.27 LEAD FREE solder paste TOYOTA s recommended solder paste for automotive electronics Product information Crack-Free Residue This Product Information contains product performance
More informationContact Material Division Business Unit Assembly Materials
Contact Material Division Business Unit Assembly Materials MICROBOND SOP 91121 P SAC305-89 M3 C Seite 1 Print Performance Soldering Performance General Information MICROBOND SOP 91121 P SAC305-89 M3 Technical
More informationFactbook Cobar OT2 Virtual
Factbook OT2 Table of Contents 01 Table of contents 02 Handling guidelines OT2 solder paste 03 Printing continuous printing process window 04 Printing interval printing process window 05 Recommended reflow
More informationSMT Assembly Considerations for LGA Package
SMT Assembly Considerations for LGA Package 1 Solder paste The screen printing quantity of solder paste is an key factor in producing high yield assemblies. Solder Paste Alloys: 63Sn/37Pb or 62Sn/36Pb/2Ag
More informationSolder Pastes. for electronics manufacturing. Solder Wires Solder Pastes Fluxes Solder Bars
Solder Wires Solder Pastes Fluxes Solder Bars Soldering equipment Measurement and testing systems Conformal Coatings Accessories Solder Pastes for electronics manufacturing WE HAVE THE RIGHT SOLDER PASTE
More informationGrypper GrypperG40 GrypperG80
Grypper GrypperG40 GrypperG80 High performance net zero footprint engineering test sockets ATTACHMENT AND REMOVAL GUIDE Before You Begin ABOUT THIS GUIDE Welcome to the Grypper Product Test Socket Attachment
More informationBumping of Silicon Wafers using Enclosed Printhead
Bumping of Silicon Wafers using Enclosed Printhead By James H. Adriance Universal Instruments Corp. SMT Laboratory By Mark A. Whitmore DEK Screen Printers Advanced Technologies Introduction The technology
More informationSMT Troubleshooting. Typical SMT Problems For additional process solutions, please refer to the AIM website troubleshooting guide
SMT Troubleshooting Typical SMT Problems For additional process solutions, please refer to the AIM website troubleshooting guide Solder Balling Solder Beading Bridging Opens Voiding Tombstoning Unmelted
More informationA FEASIBILITY STUDY OF CHIP COMPONENTS IN A LEAD-FREE SYSTEM
A FEASIBILITY STUDY OF 01005 CHIP COMPONENTS IN A LEAD-FREE SYSTEM Chrys Shea Dr. Leszek Hozer Cookson Electronics Assembly Materials Jersey City, New Jersey, USA Hitoshi Kida Mutsuharu Tsunoda Cookson
More informationUltra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads Li Ma, Fen Chen, and Dr. Ning-Cheng Lee Indium Corporation Clinton, NY mma@indium.com; fchen@indium.com; nclee@indium.com Abstract
More informationSMART GROUP STANDARD. Control of Solder Paste used in Electronic Assembly Process. SMART Group. 2 Normative References
2 Normative References The Test Methods employed are adapted from IPC-TM-650 comprising: SMART GROUP STANDARD Control of Solder Paste used in Electronic Assembly Process Number: SG PCT 01 Control of Solder
More informationThe Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance. Presented by Karl Seelig, V.P. Technology AIM Metals & Alloys
The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance Presented by Karl Seelig, V.P. Technology AIM Metals & Alloys Solder Powder Solder Powder Manufacturing and Classification
More informationAPPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS
Keywords: OLGA, SMT, PCB design APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Abstract: This application note discusses Maxim Integrated s OLGA and provides the PCB design and
More informationHOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY?
HOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY? ABSTRACT Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. Very
More informationUnderstanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
As originally published in the IPC APEX EXPO Conference Proceedings. Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael
More informationA review of the challenges and development of. the electronics industry
SMTA LA/OC Expo, Long Beach, CA, USA A review of the challenges and development of SMT Wave and Rework assembly processes in SMT, the electronics industry Jasbir Bath, Consulting Engineer Christopher Associates
More informationFILL THE VOID III. Tony Lentz FCT Assembly Greeley, CO, USA
FILL THE VOID III Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT This study is part three in a series of papers on voiding in solder joints and methods for mitigation of voids.
More informationEF Solder Cream (V) (EFC-3C05)
EF Solder Cream (V) (EFC3C05) www.ecojoin.co.kr EF Solder Cream Series Technical Data Sheet EFC3C05 (Sn3.0Ag0.5Cu) Ecojoin.co.,Ltd 7233, KorimDong, YongInSi, KyungKiDo,(449010), KOREA Http://www.ecojoin.co.kr
More informationHOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE?
HOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE? Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT The surface finishes commonly used on printed circuit boards (PCBs) have
More informationJU-48P. Heat Curable SMT Adhesive for Printing. Product Information. Heat Curing Type SMT Adhesive for Printing. Contents.
www.ko-ki.co.jp #51010E Revised on June 16, 2014 Heat Curing Type SMT Adhesive for Printing Heat Curable SMT Adhesive for Printing JU-48P Product Information This Product Information contains product performances
More informationAssembly Guidelines Sterling Silver & MacStan Immersion Tin Coated PCB s
Assembly Guidelines Sterling Silver & MacStan Immersion Tin Coated PCB s By: MacDermind Final Finish Team MacDermid Inc. Flat solderable surface finishes are required for the increasingly dense PCB designs.
More informationUltra Fine Pitch Printing of 0201m Components. Jens Katschke, Solutions Marketing Manager
Ultra Fine Pitch Printing of 0201m Components Jens Katschke, Solutions Marketing Manager Agenda Challenges in miniaturization 0201m SMT Assembly Component size and appearance Component trends & cooperation
More informationPrepared by Qian Ouyang. March 2, 2013
AN075 Rework Process for TQFN Packages Rework Process for TQFN Packages Prepared by Qian Ouyang March 2, 2013 AN075 Rev. 1.1 www.monolithicpower.com 1 ABSTRACT MPS proprietary Thin Quad Flat package No
More informationTECHNICAL INFORMATION S3X 60NH
Lead free SOLUTIONS you can TRUST TECHNICAL INFORMATION Lead Free No-clean Flux Cored Solder Wire S3X 60NH 1. Features Excellent solderability offers good workability. Minimum flux spattering, easy separation
More informationBroadband Printing: The New SMT Challenge
Broadband Printing: The New SMT Challenge Rita Mohanty & Vatsal Shah, Speedline Technologies, Franklin, MA Gary Nicholls, Ron Tripp, Cookson Electronic Assembly Materials Engineered Products, Johnson City,
More informationMurata Silicon Capacitors WBSC / WTSC / WXSC 250 µm / WLSC 100 µm Assembly by Wirebonding. Table of Contents
Table of Contents Table of Contents...1 Introduction...2 Handling Precautions and Storage...2 Pad Finishing...2 Process Flow with Glue...2 Process Flow with Solder Paste...3 Recommendations concerning
More information!"#$%&'()'*"+,+$&#' ' '
!"#$%&'()'*"+,+$&#' *"89"+&+6'B22&83%45'8/6&10/%2'A"1'/22&83%4'/+#'C"0+0+D'8&67"#2'0+'&%&
More informationCan Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly
Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly tlentz@fctassembly.com Outline/Agenda Introduction Claims & questions about coatings Experiment design Results of coating performance
More informationMeeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes
Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes Authored by: Ed Briggs, Indium Corporation Abstract The explosive growth of personal electronic devices, such as mobile phones,
More informationThe Multicore line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes. Whether your process requires long abandon times, wide process
More informationModule No. # 07 Lecture No. # 35 Vapour phase soldering BGA soldering and De-soldering Repair SMT failures
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering Indian Institute of Science, Bangalore Module No. # 07 Lecture No. # 35 Vapour phase soldering
More informationV349 (CLF5043) Halide Free No Clean Core Wire Fine Wire Applications
Pb V349 (CLF5043) Halide Free No Clean Core Wire Fine Wire Applications INTRODUCTION Viromet* 349, with a composition of Sn/Ag/Cu/In + X, is one of the high-performance lead free solder available in the
More informationPerformance Enhancing Nano Coatings: Changing the Rules of Stencil Design. Tony Lentz
Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design Tony Lentz tlentz@fctassembly.com Outline/Agenda Introduction Experimental Design Results of Experiment Conclusions Acknowledgements
More informationA Technique for Improving the Yields of Fine Feature Prints
A Technique for Improving the Yields of Fine Feature Prints Dr. Gerald Pham-Van-Diep and Frank Andres Cookson Electronics Equipment 16 Forge Park Franklin, MA 02038 Abstract A technique that enhances the
More informationA COMPARATIVE STUDY OF BALL GRID ARRAY AND ULTRA FINE-PITCH QFP TECHNOLOGIES USING SOLDER PASTE STENCIL PRINTING
A COMPARATIVE STUDY OF BALL GRID ARRAY AND ULTRA FINE-PITCH QFP TECHNOLOGIES USING SOLDER PASTE STENCIL PRINTING Roger Rörgren, Per Carlsson and Johan Liu IVF - The Swedish Institute of Production Engineering
More informationOPTIMIZING THE PRINT PROCESS FOR MIXED TECHNOLOGY
OPTIMIZING THE PRINT PROCESS FOR MIXED TECHNOLOGY Clive Ashmore, Mark Whitmore, and Simon Clasper Dek Printing Machines Weymouth, United Kingdom ABSTRACT Within this paper the method of optimising a print
More informationWB/WT/WXSC 250µm/WLSC100µm - Assembly by Wirebonding
General description This document describes the attachment techniques recommended by Murata* for their vertical capacitors on the customer substrates. This document is non-exhaustive. Customers with specific
More informationPrinting Practices for Components. Greg Smith
Printing Practices for 01005 Components Greg Smith gsmith@fctassembly.com Outline/Agenda Introduction 01005 Components-Size, Shape and usage Stencil Design Transfer Efficiencies Q & A Introduction 01005
More informationHKPCA Journal No. 10. Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder. Minna Arra Flextronics Tampere, Finland
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder Minna Arra Flextronics Tampere, Finland Dongkai Shangguan & DongJi Xie Flextronics San Jose, California, USA Abstract
More informationStep Stencil Technology
Step Stencil Technology Greg Smith gsmith@fctassembly.com Tony Lentz tlentz@fctassembly.com Outline/Agenda Introduction Step Stencils Technologies Step Stencil Design Printing Experiment Experimental Results
More informationmcube LGA Package Application Note
AN-001 Rev.02 mcube LGA Package Application Note AN-001 Rev.02 mcube, Inc. 1 / 21 AN-001 Rev.02 Guidelines for Printed Circuit Board (PCB) Design and Assembly with mcube Land Grid Array (LGA) Package Sensors
More informationCAN NANO-COATINGS REALLY IMPROVE STENCIL PERFORMANCE?
CAN NANO-COATINGS REALLY IMPROVE STENCIL PERFORMANCE? Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT The trajectory of electronic design and its associated miniaturization shows
More informationCan Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly
Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly tlentz@fctassembly.com Outline/Agenda Introduction Claims & questions about coatings Experiment design Results of coating performance
More informationImprove SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationStencil Technology. Agenda: Laser Technology Stencil Materials Processes Post Process
Stencil Technology Agenda: Laser Technology Stencil Materials Processes Post Process Laser s YAG LASER Conventional Laser Pulses Laser beam diameter is 2.3mil Ridges in the inside walls of the apertures
More informationVT-35 SOLDER PASTE PRINTING DEFECT ANALYSIS AND PREVENTION. Script Writer: Joel Kimmel, IPC
VIDEO VT-35 SOLDER PASTE PRINTING DEFECT ANALYSIS AND PREVENTION Script Writer: Joel Kimmel, IPC Below is a copy of the narration for the VT-35 videotape. The contents for this script were developed by
More informationApplication Note 5026
Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction This document outlines the design and assembly guidelines for surface laminar circuitry
More informationTECHNICAL INFORMATION S03X7C-56M
Lead free SOLUTIONS you can TRUST TECHNICAL INFORMATION Lead Free No-clean Flux Cored Solder Wire S03X7C-56M The alloy composition of the lead-free resin flux cored solder is now dominated by SnAg3.0Cu0.5,
More informationInvestigating the Component Assembly Process Requirements
Investigating the 01005-Component Assembly Process Requirements Rita Mohanty, Vatsal Shah, Arun Ramasubramani, Speedline Technologies, Franklin, MA Ron Lasky, Tim Jensen, Indium Corp, Utica, NY Abstract
More informationNPL Report MATC(A)18 The Effect of Solder Alloy, Metal Particle Size and Substrate Resist on Fine Pitch Stencil Printing Performance
NPL Report The Effect of Solder Alloy, Metal Particle Size and Substrate Resist on Fine Pitch Stencil Printing Performance Ling Zou, Milos Dusek, Martin Wickham & Christopher Hunt August 01 NPL Report
More informationStencil Printing of Small Apertures
Stencil Printing of Small Apertures William E. Coleman Ph.D. Photo Stencil, Colorado Springs, CO Abstract Many of the latest SMT assemblies for hand held devices like cell phones present a challenge to
More informationSTENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS
STENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS William E. Coleman, Ph.D. Photo Stencil Colorado Springs, CO, USA ABSTRACT SMT Assembly is going through a challenging phase with the introduction of miniature
More informationADVANCED HAND SOLDERING TECHNIQUES TRAINING CERTIFICATION TEST (DVD-111C) v.1
This test consists of twenty multiple-choice questions. All questions are from the video: Advanced Hand Soldering Techniques DVD-111C. Use the supplied Answer Sheet and circle the letter corresponding
More informationPrint Performance Studies Comparing Electroform and Laser-Cut Stencils
Print Performance Studies Comparing Electroform and Laser-Cut Stencils Rachel Miller Short William E. Coleman Ph.D. Photo Stencil Colorado Springs, CO Joseph Perault Parmi Marlborough, MA ABSTRACT There
More informationIntroduction of IMS Technology for Advanced Solder Bumping on Wafers / Laminates
Introduction of IMS Technology for Advanced Solder Bumping on Wafers / Laminates Science & Technology IBM Research Tokyo Yasumitsu Orii, PhD Senju Metal Industry Co.,TW Deputy General Manager Lewis Huang
More informationTHE QUICK POCKET REFERENCE FOR TIN/LEAD AND LEAD-FREE SOLDER ASSEMBLY
THE QUICK POCKET REFERENCE FOR TIN/LEAD AND LEAD-FREE SOLDER ASSEMBLY Solder plus Support Copyright 2008 by AIM All rights reserved. No part of this work covered by the copyright hereon may be reproduced
More informationESDAVLC6-1V2. Single line low capacitance Transil for ESD protection. Description. Features. Applications. Complies with following standards:
Single line low capacitance Transil for ESD protection Description Datasheet production data Features Ultra small PCB area = 0.09 mm² Unidirectional device Very low diode capacitance Low leakage current
More informationRESERVOIR PRINTING IN DEEP CAVITIES
As originally published in the SMTA Proceedings RESERVOIR PRINTING IN DEEP CAVITIES Phani Vallabhajosyula, Ph.D., William Coleman, Ph.D., Karl Pfluke Photo Stencil Golden, CO, USA phaniv@photostencil.com
More informationBGA Rework Stencils. Applying solder paste for BGA rework. Description. How Flextac Stencils Work. Application
BGA Rework Stencils If you ve been using metal stencils for BGA rework, we have some great news for you. Flextac BGA Rework Stencils...a creative new product that is a major improvement over what you maybe
More informationImprove SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical
More informationAssembly Instructions for SCA6x0 and SCA10x0 series
Technical Note 71 Assembly Instructions for SCA6x0 and SCA10x0 series TABLE OF CONTENTS Table of Contents...1 1 Objective...2 2 VTI'S DIL-8 and DIL-12 packages...2 3 Package Outline and Dimensions...2
More informationWire Wound Chip Inductors LPI0805FT Series
INTRODUCTION Product : LPI Miniature SMD Inductor For Power Line Size : 0805 The LPI series are low profile inductor used in notebook, PC, cellular phone backlight, inverter and etc. The devices are designed
More informationSELECTIVE SOLDER PASTE DEPOSITION RELIABILITY TEST RESULTS Bob Wettermann BEST Inc 3603 Edison Place Rolling Meadows IL
SELECTIVE SOLDER PASTE DEPOSITION RELIABILITY TEST RESULTS Bob Wettermann BEST Inc 3603 Edison Place Rolling Meadows IL 60008 bwet@solder.net ABSTRACT The rapid assimilation of Ball Grid Array (BGA) and
More informationIMPROVED SMT AND BLR OF 0.35MM PITCH WAFER LEVEL PACKAGES
As originally published in the SMTA Proceedings. IMPROVED SMT AND BLR OF 0.35MM PITCH WAFER LEVEL PACKAGES Brian Roggeman and Beth Keser Qualcomm Technologies, Inc. San Diego, CA, USA roggeman@qti.qualcomm.com
More informationAssembly Instructions for SCC1XX0 series
Technical Note 82 Assembly Instructions for SCC1XX0 series TABLE OF CONTENTS Table of Contents...1 1 Objective...2 2 VTI's 32-lead Dual In-line Package (DIL-32)...2 3 DIL-32 Package Outline and Dimensions...2
More informationFill the Void IV: Elimination of Inter-Via Voiding
Fill the Void IV: Elimination of Inter-Via Voiding Tony Lentz FCT Assembly Greeley, CO, USA Greg Smith BlueRing Stencils Lumberton, NJ, USA ABSTRACT Voids are a plague to our electronics and must be eliminated!
More informationTECHNICAL INFORMATION. S03X7Ca-56M
Lead free SOLUTIONS you can TRUST TECHNICAL INFORMATION Lead Free No-clean Flux Cored Solder Wire The normal alloy composition of the lead free rosin flux cored solder wires, is now dominated by SnAg3.0Cu0.5
More informationZero Height Ultra Mini SiSonic Microphone Specification With MaxRF Protection Halogen Free PRELIMINARY
Zero Height Ultra Mini SiSonic Microphone Specification With MaxRF Protection Halogen Free PRELIMINARY Knowles Acoustics 1151 Maplewood Drive Itasca, IL 60143 1of 10 1. DESCRIPTION AND APPLICATION 1.1
More informationESDALC6V1-5M6. 5-line low capacitance Transil arrays for ESD protection ESDALC6V1-5M6. Applications. Description. Features
5-line low capacitance Transil arrays for ESD protection Applications Datasheet - production data Where transient overvoltage protection in ESD sensitive equipment is required, such as: Micro QFN package
More informationApplication Note AN SupIRBuck Power Quad Flat No-Lead (PQFN) Board Mounting Application Note
Application Note AN-1132 SupIRBuck Power Quad Flat No-Lead (PQFN) Board Mounting Application Note Table of Contents Page Device construction...2 Design considerations...3 Assembly considerations...4 Mechanical
More informationAN Surface mount reflow soldering description. Document information
Rev. 04 13 August 2009 Application note Document information Info Keywords Abstract Content surface mount, reflow soldering, component handling This application note provides guidelines for the board mounting
More informationthe product: Fluitin XL-825V ALPHA Cored Solder Wire product guide Cored Solder Wire
the product: ALPHA Fluitin ALPHA Fluitin Cored Solder Wire Cored Solder Wire product guide 1 Product Guide CONTENTS Page # 1. Introduction 3 2. General Performance 4-7 3. Wetting Performance 8 4. Cosmetics
More informationApplication Note AN-1011
AN-1011 Board Mounting Application Note for 0.800mm Pitch Devices For part numbers IRF6100, IRF6100PBF, IR130CSP, IR130CSPPBF, IR140CSP, IR140CSPPBF, IR1H40CSP, IR1H40CSPPBF By Hazel Schofield and Philip
More informationStudy on Solder Joint Reliability of Fine Pitch CSP
As originally published in the IPC APEX EXPO Conference Proceedings. Study on Solder Joint Reliability of Fine Pitch CSP Yong (Hill) Liang, Hank Mao, YongGang Yan, Jindong (King) Lee. AEG, Flextronics
More informationUWSC Ultra large-band Wire bonding Silicon Capacitor Wire Bondable Vertical
UWSC Ultra large-band Wire bonding Silicon Capacitor Wire Bondable Vertical Rev 1.5 Key Features Ultra largeband performance up to 26 GHz Resonance free Phase stability Unique capacitance value of 1nF
More informationSelecting Stencil Technologies to Optimize Print Performance
As originally published in the IPC APEX EXPO Conference Proceedings. Selecting Stencil Technologies to Optimize Print Performance Chrys Shea Shea Engineering Services Burlington, NJ USA Abstract The SMT
More informationPCB Supplier of the Best Quality, Lowest Price and Reliable Lead Time. Low Cost Prototype Standard Prototype & Production Stencil PCB Design
The Best Quality PCB Supplier PCB Supplier of the Best Quality, Lowest Price Low Cost Prototype Standard Prototype & Production Stencil PCB Design Visit us: www. qualiecocircuits.co.nz OVERVIEW A thin
More informationProcess Guidelines to Ensure Optimal SMT Electronics Assembly
Process Guidelines to Ensure Optimal SMT Electronics Assembly Authored by: Ed Briggs and Ronald C. Lasky, PhD, PE. Abstract The continuing miniaturization of personal electronics devices, such as mobile
More informationPractical Solutions for Successful Pb-Free Soldering. Brian Allder Qualitek-Europe
Practical Solutions for Successful Pb-Free Soldering Brian Allder Qualitek-Europe Challenges/Barriers to Lead Free Cost Material Availability Process Modifications Material Compatibility Standards Inspection
More informationSOLDER PASTE PRINTING (DVD-34C) v.2
This test consists of twenty multiple-choice questions. All questions are from the video: Solder Paste Printing (DVD-34C). Each question has only one most correct answer. Circle the letter corresponding
More informationUnderstanding stencil requirements for a lead-free mass imaging process
Electronics Technical Understanding stencil requirements for a lead-free mass imaging process by Clive Ashmore, DEK Printing Machines, United Kingdom Many words have been written about the impending lead-free
More informationApplication Note. Soldering Guidelines for Module PCB Mounting Rev 13
Application Note Soldering Guidelines for Module PCB Mounting Rev 13 OBJECTIVE The objective of this application note is to provide ANADIGICS customers general guidelines for PCB second level interconnect
More informationImprove SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. Greeley, CO Abstract Reduction of first pass defects in the SMT assembly process minimizes cost, assembly
More informationWIRE WOUND CHIP INDUCTORS HCI SERIES HCI 0805 F T 1R0 K - Introductions. Features. Part Number Code HCI SERIES
HCI SERIES WIRE WOUND CHIP INDUCTORS HCI SERIES Introductions Product : HCI Miniature SMD Inductor For Power Line Size : 0805 The HCI series are low profile inductor used in notebooks, PC s, Cellular phone
More informationTable 1: Pb-free solder alloys of the SnAgCu family
Reflow Soldering 1. Introduction The following application note is intended to describe the best methods for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles should
More informationAN5046 Application note
Application note Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT packages Introduction The PowerFLAT package (5x6) was created to allow a larger die to fit in a standard
More informationAN-5067 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages
Introduction AN-5067 Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages The current miniaturization trend
More informationSunlord Wire Wound SMD Power Inductor Page 1 of 7 SPECIFICATIONS
Sunlord Wire Wound SMD Power Inductor Page 1 of 7 SPECIFICATIONS Customer Product Name Wire Wound SMD Power Inductor Sunlord Part Number SWPA4020S T Customer Part Number [ New Released, Revised] SPEC No.:
More informationESDAVLC6V1-1BM2 ESDAVLC6V1-1BT2
ESDAVLC6V1-1BM2 ESDAVLC6V1-1BT2 Single line low capacitance Transil for ESD protection Features single line bidirectional protection breakdown voltage V BR = 6.1 V min. very low capacitance (6 pf typ.
More informationApplications of Solder Fortification with Preforms
Applications of Solder Fortification with Preforms Carol Gowans Indium Corporation Paul Socha Indium Corporation Ronald C. Lasky, PhD, PE Indium Corporation Dartmouth College ABSTRACT Although many have
More informationProduct Specification - LPM Connector Family
LPM Product Specification - LPM OVERVIEW Developed for mobile devices and other space-constrained applications, the Neoconix LPM line of connectors feature exceptional X-Y-Z density with a simple, highly
More informationProfiled Squeegee Blade: Rewrites the Rules for Angle of Attack
Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack Ricky Bennett, Rich Lieske Lu-Con Technologies Flemington, New Jersey Corey Beech RiverBend Electronics Rushford, Minnesota Abstract For
More information