ADVANCED HAND SOLDERING TECHNIQUES TRAINING CERTIFICATION TEST (DVD-111C) v.1

Transcription

1 This test consists of twenty multiple-choice questions. All questions are from the video: Advanced Hand Soldering Techniques DVD-111C. Use the supplied Answer Sheet and circle the letter corresponding to your selection for each test item. If more than one answer appears to be correct, pick the answer that appears to be the most complete response. If you wish to change an answer, erase your choice completely. When finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (14 correct answers), or better. Good luck! 1

2 ANSWER SHEET Name: Date: Circle the letter corresponding to your answer for each test item. 1 A B C D 2 A B C D 3 A B C D 4 A B C D 5 A B C D 6 A B C D 7 A B C D 8 A B C D 9 A B C D 10 A B C D 11 A B C D 12 A B C D 13 A B C D 14 A B C D 15 A B C D 16 A B C D 17 A B C D 18 A B C D 19 A B C D 20 A B C D 2

3 1. Changes in hand soldering techniques have occurred because a. components have gotten smaller b. the industry has transitioned to lead free solder c. components with center grounds have become more common 2. Drag Soldering is also called a. point to point soldering b. reflow soldering c. multi-lead soldering d. transition soldering 3. The reason for not starting drag soldering from a tacked corner is a. the position of the component may shift b. the leads may not wet properly c. to avoid solder bridges 4. When drag soldering, solder bridges are commonly caused by a. using lead free solder b. stopping the movement of the iron tip at the end of a row c. moving the iron tip along the heel of the leads rather than the toes 5. The technique of successfully drag soldering with lead free alloys involves a. using lower soldering iron temperatures b. placing the iron tip out at the toes of the gull wing leads c. increasing soldering speed along the row of leads d. using significantly less flux 6. The draw off and re-spread methods are used to a. remove defective components b. fix solder bridges c. apply flux evenly d. apply solder paste to the lands 7. Which of the following chip components is the smallest? a b c d

4 8. The recommended tool for removing the smallest chip component is a a. chisel tip sized to heat both terminations at the same time b. bifurcated tip c. thermal tweezer d. properly sized torch 9. The greatest difficulty in hand soldering ultra small chip components is a. handling the component b. choosing the correct solder c. choosing the right soldering iron tip d. creating a usable solder bump 10. DPAKs and BTCs are distinguished by a. castellations b. leadless terminations c. a center ground on the underside of the component d. a leadless array on the underside of the component 11. To effectively solder the center ground on a DPAK a. use a blade tip as wide as the termination b. the circuit board should be preheated c. the DPAK should be held in place with a wood stick or tweezers 12. The reason that hand soldering a DPAK often creates a better connection is a. the solder wire is higher quality than solder paste b. a solder bump is not needed c. voids are less likely to occur on the center ground termination d. less flux is required 13. When soldering the center ground on BTCs, it s important to a. use a hot air system to achieve solder flow b. create downward pressure with a holding device c. make sure that the outer perimeter terminations remain aligned with the lands 14. Large through hole components with heavy thermal mass a. are easier to solder because everything is bigger and more visible b. are more difficult to solder because they require more heat c. simply need higher soldering iron temperatures d. are soldered like any other component 4

5 15. Raising the soldering iron temperature can result in a. lifted lands b. overheated solder c. damage to the circuit board 16. The most efficient method of removing residual solder from large BGA land patterns a. is a combination of a large blade tip and solder wicking braid b. is point-to-point solder wicking c. is hand held vacuum extraction d. is solder scavenging systems 17. The problem with vacuum extractors is a. they can be slow b. they require a skilled operator c. there is less control in the process 18. The advantage of automated scavenging systems is a. lands are totally flat after solder removal b. nothing physical ever touches the board c. they are only incorporated in high end rework stations d. they remove solder quickly from the large BGA land patterns 19. The key to using a large blade tip in conjunction with solder wicking braid is to a. never exert any pressure when using the wicking braid b. only use pressure when you feel braid resistance c. only use wicking braid that is narrow d. only use the wicking braid on lands with large amounts of solder 20. We don t perform the wicking braid operation until we re ready to replace the BGA because a. the board is too hot after BGA removal b. flux residue has not been cleaned from the board c. when solder bumps are removed from the lands, the intermetallics oxidize quickly 5