AuthenTec AES1710 Secure Slide Fingerprint Sensor
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- Rosemary Marsh
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1 AuthenTec AES1710 Secure Slide Fingerprint Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:
2 Package Analysis Table of Contents 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Device Summary 1.5 Package Summary 2.1 Package and Die 3.1 Package Cross Section Overview 3.2 Package Cross Section Analysis 4 Materials Analysis 4.1 SEM-EDS Analysis of Board Interconnect and Land Platings 4.2 SEM-EDS Analysis of Selected Packaging Materials 5 References 6 Statement of Measurement Uncertainty and Scope Variation Report Evaluation
3 Overview List of Figures AES1710 Fingerprint Sensor on PCB Perspective View Package Photograph Top Package Photograph Bottom Plan View Package X-Ray Side View Package X-Ray AES1710 on PCB TMS791 Die Photograph Die Markings Die Corner Minimum Pitch Bond Pads Planes of Cross-Sectioning Package Cross Section Overview (Section A) Package Edge (Section A) Edge of Package Window (Section A) Package Edge (Section B) Reinforcement Frame Coating Through Hole Via Solder Ball Solder Ball Land Plating SEM Solder Ball Land Plating Optical Stitch Bond Land Stitch Bond Land Plating SEM Stitch Bond Land Plating Optical Die Cross Section Overview Die Bottom Interconnection Bond Pad Overview Detailed View of Die Bond Pad Reinforcement Frame Interconnection (Section C) 4 Materials Analysis SEM-EDS Spectrum of Cu Board Interconnect SEM-EDS Spectrum of Ni Solder Ball Land Plating SEM-EDS Spectrum of AuNi Solder Ball Land Plating SEM-EDS Spectrum of Sn Solder Ball SEM-EDS Spectrum of Au Stitch Bond Outer Land Plating SEM-EDS Spectrum of Ni Stitch Bond Inner Land Plating SEM-EDS Spectrum of Sensor Area Coating SEM-EDS Spectrum of Ag Epoxy Die Attach SEM-EDS Spectrum of Ag Epoxy Reinforcement Frame Attach SEM-EDS Spectrum of Reinforcement Frame Body SEM-EDS Spectrum of Reinforcement Frame Inner Coating SEM-EDS Spectrum of Reinforcement Frame Outer Coating
4 Overview List of Tables Samples Analyzed Device Summary Package Summary Package and Die Dimensions Package Materials and Observed Critical Dimensions
5 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
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