InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor
|
|
- Susanna Webster
- 5 years ago
- Views:
Transcription
1 InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:
2 MEMS Process Review Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR JMRK Revision 1.0 Published: April 23, 2007 Revision 2.0 Published: May 2, 2007
3 MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Major Findings 2 Device Overview 2.1 Package and Device 2.2 MEMS Gyroscope, Cap and Reference Die 2.3 ASIC Portion Die Features 3 IDG-300 ASIC Basic Device Analysis 3.1 Process 4 MEMS Gyroscope Sensor and Associated Functional Elements 4.1 General Structure 4.2 Bond Pads for MEMS 4.3 MEMS Cross Section 4.4 Silicon Substrate 4.5 Process for MEMS Functional Elements of Reference Die 4.6 Process for Cap Die 4.7 IDG-300 Device Assembly 5 MEMS Sensor Architectural Analysis 5.1 Overview 5.2 Proof Mass and Various Hinges 5.3 Flexure, Spring, and Sense Electrodes 6 Critical Dimensions 6.1 Package and Device 6.2 Critical Dimensions ASIC Portion of Reference Die 6.3 Critical Dimensions MEMS Die Portion of Device 6.4 Critical Dimensions Reference Die (MEMS Functional Portion) 6.5 Critical Dimensions Cap Die 6.6 Critical Dimensions Assembled Device
4 MEMS Process Review 7 References 8 Statement of Measurement Uncertainty About Chipworks
5 Overview Overview 1.1 List of Figures 2 Device Overview Invensense IDG-300Q Chip on PCB Board Top View Invensense IDG-300Q Chip on PCB Board Bottom View Top Package View Bottom Package View Package Pin Out Plan View Package X-Ray Side View Package X-Ray Gyroscope Device Plan View Si Cap Die Markings Gyroscope Device Tilt View Gyroscope Device Side View Gyroscope MEMS-Cap Corner Tilt View SEM Image of Cap Die Wire Bond Plan View SEM Image of ASIC Die Wire Bond Plan View ASIC Die Wire Bond Tilt View IDG-300 MEMS Gyroscope and Cap-Die Photographs IDG-300 Y-Axis MEMS Gyroscope Die Photograph IDG-300 MEMS Gyroscope Die Corner Photograph ( C) IDG-300 MEMS Gyroscope Die Corner Photograph ( C) IDG-300 Cap Die Photograph IDG-300 Reference (ASIC) Die Photograph Reference (ASIC) Die Photograph Delayered to Metal IDG-300 Photograph of MEMS Functional Elements on the Reference Die IDG-300 Photograph of Reference MEMS Die Seal Between Rate Sensors Annotated Die Photograph Die Markings a Die Markings b ASIC Die Corner a ASIC and Features Underneath MEMS ASIC Die Corner a ASIC Features ASIC Die Corner b ASIC Features ASIC Die Corner c ASIC Features ASIC Die Corner d ASIC Features Minimum Pitch Bond Pads Lateral NPN Transistors and Resistors Logic Transistors DMOS Transistors MOS Transistors and Capacitors
6 Overview IDG-300 ASIC Basic Device Analysis General Structure Glass Etch General Structure Silicon Etch Detail Cross Section SEM Image of Poly-Poly Capacitor Die Edge Die Seal Bond Pad Edge Minimum Pitch Metal Minimum Pitch Metal Minimum Pitch Metal Minimum Pitch Contacts Minimum Gate Length PMOS Transistors ASIC N-Well SCM Start of the ASIC Devices SCM ASIC P-Well and Graded Epi SRP Photograph Showing Location of Measurement SRP of ASIC P-Well ASIC N-Well SRP Photograph Showing Location of Measurement SRP of ASIC N-Well 4 MEMS Gyroscope Sensor and Associated Functional Elements General Structure of IDG-300 Device Center (S7) General Structure of IDG-300 Device (S3) General Structure of IDG-300 Device (S4) Bond Pad Tilt View EDS Spectrum of MEMS-Reference Die Bonding Flexure Bond Pad Sensing Peripheral Center Bond Pad Sensing Electrode Bond Pad Sensing Electrode Bond Pad Cross Section Sensing Electrode Bond Pad Standoff Cross Section Flexure Hinge 1 Cross Section (P2S3) Flexure Hinge 1 Cross Section (P2S3) Detail Flexure Hinge 2 Cross Section (P2S3) Detail Torsional Hinge and Flexure Hinge 2 (P2S5) Torsional Hinge (P2S6) Torsional Hinge (P2S6) Detail Peripheral Center Sensing Electrode Capacitance Fingers (P2S7) Capacitance Fingers (P2S7) Detail SCM Image of IDG-300 Gyroscope Device (P2) MEMS Functional Features of Reference Die Tilt View X-Rate Sensor on Reference Die Plan View Drive Electrodes in the Center of Cavity Drive Electrodes on Cavity Edge Drive Electrodes in the Center of Cavity Tilt View Reference Wafer Cavity DRIE Sidewall Tilt View Reference Die Bond Pads Plan View
7 Overview Reference Die Peripheral Center Bond Pads Plan View Center Drive Electrodes Center Drive Electrodes Detail Drive Electrodes on Cavity Right Edge Detail Drive Electrodes on Cavity Left Edge Detail Cavity Left Edge Detail Cross Section Cap Die Tilt View Pyramids on Cap Plan View Pyramids on Cap Tilt View Alignment Trench on Cap Optical Plan View Cap Bond Pad Cap Bond Pad Edge Left Edge of Alignment Trench on Cap Right Edge of Alignment Trench on Cap Cross Section of Cap Cap Underside Oxide Layer Cross Section of Pyramids on Cap Edge of MEMS-Cap Die Edge of MEMS-Cap Die Detail MEMS-ASIC Die Bonding MEMS-ASIC Die Bonding Peripheral Center Bond Pad 5 MEMS Sensor Architectural Analysis Block Diagram IDG-300 Gyroscope Plan View Optical IDG-300 Gyroscope Tilt View SEM Annotated IDG-300 Gyroscope MEMS Plan View SEM Plate and Flexure Hinge 2-1 and Torsional Hinge 1 Part Plate, Proof Mass 1, and Flexure Hinges 2-2 and 2-1 Part Centre Plate, Flexure Hinges 1-3 and 1-4, and Hinge 1 Part Centre Plate, Flexure Hinges 1-3 and 1-4, and Hinge 1 Part Centre Plate, Flexure Hinges 1-1 and 1-2, and Hinge 2 Part Centre Plate Hinge 1 H 1 (P1) Centre Plate Hinge 2 H 2 (P1) Flexure Hinges 1-1 (FH 1-1) Detail Flexure Hinges 1-2 (FH 1-2) Flexure Hinges 1-3 and 1-4 (FH 1-3, 1-4) Flexure Hinges 1-3 and 1-4 (FH 1-3, 1-4) Part Flexure Hinge 2-1 (FH 2-1) Detail Flexure Hinge 2-2 (FH 2-2) Part Flexure Hinge 2-3 (FH 2-3) Detail Torsion Hinge 1 (TH 1) Detail Torsion Hinge 2 (TH 2) and Flexure Hinge 2 (FH 2) Part Torsion Hinge 3 (TH 3) Detail Torsion Hinge 4 (TH 4) Detail Centre Plate Hinge
8 Overview Torsion Hinge Width Flexure Hinge 1 Width Flexure Hinge 2 Width Flexure Spring Hinge Width General Structure of Flexure, Spring and Sensor Electrodes Plan View General Structure of Flexure, Spring and Sensor Electrodes Tilt View Electrode Isolation Trench and Capacitance Fingers Tilt View SEM Flexure Spring and Capacitance Fingers Tilt View SEM Flexure Spring Capacitance Fingers 1.2 List of Tables 1 Overview Device Identification Device Summary for IDG-300 Gyroscope Sensor Packaged Device Device Summary for IDG-300 Gyroscope Cap Die Device Summary for IDG-300 Gyroscope Sensor Die Device Summary for IDG-300 ASIC Die Summary of Major Findings for Cap Die Summary of Major Findings MEMS Gyroscope Die Summary of Major Findings for Control ASIC Portion of Die Process 2 Device Overview IDG 300 Pressure Volume and Residual Gas Analysis IDG-300 Package and Die Dimensions Summary of Dimensions for ASIC Portion of the IDG IDG-300 ASIC Basic Device Analysis ASIC Dielectric Layers Observed Critical Dimensions ASIC Metal Layers Observed Critical Dimensions 4 MEMS Gyroscope Sensor and Associated Functional Elements MEMS Die Features Dimensions Reference Die (MEMS Functional Part) Feature Dimensions Cap Die Feature Dimensions Assembled Device Feature Dimension 5 MEMS Sensor Architectural Analysis IDG-300 MEMS Critical Parameters 6 Critical Dimensions IDG-300 Package and Die Dimensions Summary of Dimensions for ASIC Portion of the IDG ASIC Dielectric Layer Observed Critical Dimensions ASIC Metal Layers Observed Critical Dimensions MEMS Die Features Dimensions Reference Die (MEMS Functional Part) Feature Dimensions Cap Die Feature Dimensions Assembled Device Feature Dimension
9 InvenSense IDG-300 Dual Axis Angular Rate Gyroscope Sensor About Chipworks About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
STMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review
3-Axis Accelerometer For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond
More informationInvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope
InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationBosch Sensortec BMP180 Pressure Sensor
Bosch Sensortec BMP180 MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com MEMS Process Review Some of the information in this report may be
More informationTexas Instruments ISO7220A Capacitor Type Digital Isolator
Texas Instruments ISO7220A Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in this report may be covered
More informationMarvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch
Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationSTMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller
STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information
More informationQualcomm QFE1100 Envelope Tracking PA Power Supply
Qualcomm QFE1100 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask and/or copyright protection.
More informationTexas Instruments/Apple 343S0538 Touch Screen Controller with F Die Markings
Texas Instruments/Apple 343S0538 Touch Screen Controller with F761530 Die Markings 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationMarvell I1062-B0 Hard Drive Controller SoC
Marvell I1062-B0 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.
More informationApple/Dialog Semiconductor 343S0622-A1/D2018A WLED Driver
Apple/Dialog Semiconductor 343S0622-A1/D2018A 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents,
More informationFreescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor
Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationFoveon FX17-78-F13D Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process
Foveon FX17-78-F13D-07 14.1 Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process Imager Process Review For comments, questions, or more information about this report,
More informationQualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor
Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationSony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis
Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600 Module 1: Overview Analysis Sony IMX128AQP 24.3 Mp CIS from Nikon D600 2 Some of the information in this report may be covered
More informationFreescale MCIMX535DVV1C i.mx535 Mobile Applications Processor
Freescale MCIMX535DVV1C i.mx535 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis Some of the information
More informationAkustica AKU2000 MEMS Microphone. MEMS Process Review
Akustica AKU2000 MEMS Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationSamsung SDP1301 DTV SERDES Interface
Samsung SDP1301 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationCMOSIS CMV Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling
CMOSIS CMV4000 4 Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling Imager Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada
More informationApple/Cirrus Logic 338S1081/46L01 Multi-Standard Audio Decoder
Apple/Cirrus Logic 338S1081/46L01 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationRDA Microelectronics RDA8851A GSM/GPRS Baseband SoC
RDA Microelectronics RDA8851A 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationFocalTech FT5206GE1 Capacitive Touch Screen Controller IC
FocalTech FT5206GE1 Functional Analysis with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Functional Analysis Some of the information in
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 1: Overview Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of the information
More informationTexas Instruments Sitara XAM3715CBC Application Processor 45 nm UMC Low Power Process
Texas Instruments Sitara XAM3715CBC Application Processor Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationu-blox M8030-KT Concurrent Multi-GNSS Receiver
u-blox M8030-KT Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationNVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process
NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Analysis
More informationMarvell Avastar 88W ac Wi-Fi 2x2 MIMO Combo Chip
Marvell Avastar 88W8897 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this
More informationMediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver
MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be
More informationApple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2
Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information
More informationFullhan FH8520 Image Signal Processor
Fullhan FH8520 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationFocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) Capacitive Touch Screen Controller
FocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be
More informationFocalTech FT5316 Touch Screen Controller
FocalTech FT5316 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.
More informationQualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY
Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 5: Substrate Dopant Analysis Nikon NC81369R CMOS Image Sensor from the Nikon D3200 2 Some of the information
More informationCanon LC Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i)
Canon LC1270 18.0 Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i) Module 3: Planar Pixel Analysis Canon LC1270 CMOS Image Sensor 2 Some of the
More informationSamsung K4B1G0846F-HCF8 1 Gbit DDR3 SDRAM 48 nm CMOS DRAM Process
Samsung K4B1G0846F-HCF8 48 nm CMOS DRAM Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics
More informationMicron MT66R7072A10AB5ZZW 1 Gbit Phase Change Memory 45 nm BiCMOS PCM Process
Micron MT66R7072A10AB5ZZW 45 nm BiCMOS PCM Process Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in
More informationSony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000. Module 5: Substrate Dopant Analysis
Sony IMX071 16.2 Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000 Module 5: Substrate Dopant Analysis Sony IMX071 16.2 Mp, 4.8 µm Pixel Size, APS-C (DX Format) CMOS Image Sensor
More informationQualcomm MDM9235M 4G LTE Advanced Modem
Qualcomm MDM9235M Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationOmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 3: Planar Pixel Analysis
OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 3: Planar Pixel Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask
More informationMemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis
MemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationTexas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator
Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this
More informationSony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera
18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera Imager Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Imager
More informationQualcomm APQ8084 Snapdragon 805 Application Processor
Qualcomm APQ8084 Snapdragon 805 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information
More informationQualcomm MSM8926 Snapdragon 400 Application Processor
Qualcomm MSM8926 Snapdragon 400 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information
More informationVolterra VT1115MF PWM Controller Chip
Process Review with Supplementary TEM Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales
More informationBroadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process
Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process Structural Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis
More informationTexas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver
Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver Basic Functional Analysis with Cost Estimate 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationMediaTek MT3333AV (BT10085B Die) Satellite Receiver SoC
MediaTek MT3333AV (BT10085B Die) 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationIBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram
IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram Front End Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com
More informationQualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver
Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 4: Pixel Cross-Sectional Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of
More informationSony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera
Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera Module 2: Die Utilization Sony IMX096AQL APS-C CMOS Image Sensor
More informationOmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 1: Overview Analysis
OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 1: Overview Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask and/or
More informationSiTime SIT8002AC-13-18E50 One Time Programmable Oscillator
SiTime SIT8002AC-13-18E50 MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales
More informationAKM AK8973 and AK Axis Electronic Compass
AKM AK8973 and AK8974 Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call
More informationIntel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process
Intel Xeon E3-1230V2 CPU Structural Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis Some of the information in this report may
More informationFreescale SCK20DN51Z K20 USB MHz Microcontroller eflash. Flash Process Review
Freescale SCK20DN51Z K20 USB 2.0 50 MHz Microcontroller eflash Flash Process Review Freescale SCK20DN51Z Microcontroller eflash 2 Some of the information in this report may be covered by patents, mask
More informationAnalog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review
November 1, 2005 Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review For comments, questions, or more information about this report, or for any additional technical
More informationLSI Logic LSI53C1030 PCI-X to Dual Channel Ultra320 SCSI Controller 0.18 µm CMOS Process
LSI Logic LSI53C13 PCI-X to Dual Channel Ultra32 SCSI Controller.18 µm CMOS Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs
More informationSony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor. Module 3: Planar Pixel Analysis
Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor Module 3: Planar Pixel Analysis Sony PMW-F55 CineAlta 4K HD Super 35 mm Digital Motion Camera
More informationSony IMX Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor
Sony IMX046 8.11 Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationMEMSIC MMC3120M Tri-Axis Magnetic Sensor
MEMSIC MMC3120M Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales
More informationPowerDsine/Freescale
April 25, 2005 PowerDsine/Freescale PD64004 4 Channel Power-Over-Ethernet (POE) Manager Process Review For questions, comments, or more information about this report, or for any additional technical needs
More informationAltera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process
Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process Process Review FEOL Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process
More informationSony IMX018 CMOS Image Sensor Imager Process Review
September 6, 2006 Sony IMX018 CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationRockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process
Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process Process Review FEOL Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com
More informationPowerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M 512 Megabit DDR2 SDRAM Structural Analysis
February 23, 2007 Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationIntel Xeon E3-1230V2 22 nm Tri-Gate Microprocessor
Intel Xeon E3-1230V2 Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the information in this report may be covered
More informationAMD ATI TSMC 28 nm Gate Last HKMG CMOS Process
AMD ATI 7970 215-0821060 TSMC 28 nm Gate Last HKMG CMOS Process Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the
More informationPeregrine Semiconductor PE4268 SP6T RF UltraCMOS TM Switch Structural Analysis
September 21, 2005 Peregrine Semiconductor PE4268 Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationFLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera
FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera Infrared Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationIntel Q3GM ES 32 nm CPU (from Core i5 660)
Intel Q3GM ES Partial Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please
More informationPanasonic DMC-GH Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera
Panasonic DMC-GH1 12.1 Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera Imager Process Review For comments, questions, or more
More informationSamsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report
October 13, 2006 Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report (with Optional TEM Analysis) For comments, questions, or more information about this report,
More informationSony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera
Sony IMX147 20 Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera Module 5: Substrate Dopant Analysis Sony IMX147 Back Illuminated
More informationTexas Instruments M Digital Micromirror Device (DMD)
Texas Instruments 1910-612M Digital Micromirror Device (DMD) MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationMagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process
MagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationSonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review
November 8, 2006 Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationNikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings
Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationSamsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM. DRAM Process Report with Custom BEOL and Dopant Analysis
Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM DRAM Process Report with Custom BEOL and Dopant Analysis Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM 2 Some of the information in this report may be
More informationOki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process
Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process Custom Process Review with TEM Analysis For comments, questions, or more information about this report, or for any
More informationMotorola MPXV5004G Integrated Pressure Sensor Structural Analysis
December 21, 2004 Motorola MPXV5004G Integrated Pressure Sensor Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationFreescale MCIMX357DVM5B 90 nm Multimedia Application Processor
Freescale MCIMX357DVM5B 90 nm Multimedia Application Processor ESD Protection Device Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationOlympus EVOLT E-410/Matsushita LiveMOS Image Sensor
Olympus EVOLT E-410/Matsushita Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationMicron MT9T Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor
Micron MT9T111 3.1 Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor Imager Process Review with Optional TEM Analysis of SRAM For comments, questions, or more information
More informationSharp NC Megapixel CCD Imager Process Review
Sharp NC9360 2.0 Megapixel CCD Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationNanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis
September 20, 2005 Nanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning
More informationLinear Technology. LTC3808EGN DC/DC Controller. Circuit Analysis
Linear Technology LTC3808EGN DC/DC Controller Circuit Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationIntel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process
Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered
More informationTexas Instruments S W Digital Micromirror Device
Texas Instruments S1076-6318W MEMS Process Review with Supplementary TEM Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationSony IMX145 8 Mp, 1.4 µm Pixel Pitch Back Illuminated (BSI) CMOS Image Sensor from the Apple iphone 4S Smartphone
Sony IMX145 8 Mp, 1.4 µm Pixel Pitch Back Illuminated (BSI) CMOS Image Sensor from the Apple iphone 4S Smartphone Imager Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationMicrochip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis
March 13, 2006 Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationSpansion S29GL512N11TAI Mbit MirrorBit TM Flash Memory Structural Analysis
March 5, 2007 Spansion S29GL512N11TAI02 512 Mbit MirrorBit TM Flash Memory Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationTexas Instruments BRF6350B Bluetooth Link Controller UMC 90 nm RF CMOS
Texas Instruments BRF6350B UMC 90 nm RF CMOS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please
More informationQualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP. Module 2: CMOS FEOL Analysis
Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP Module 2: CMOS FEOL Analysis Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP 2 Some of the information in this report may be covered by patents, mask
More informationSilicon Laboratories
Silicon Laboratories Si8233BD 4.0 A Isolated High-Side/Low-Side Driver Full Circuit Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
More informationSamsung K9G8G08U0M-PCB0 8 Gbit MLC NAND Flash Structural Analysis
November 6, 2006 Samsung K9G8G08U0M-PCB0 Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please
More informationAuthenTec AES1710 Secure Slide Fingerprint Sensor
AuthenTec AES1710 Secure Slide Fingerprint Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationOmniVision OV2640 1/4-Inch 2 Megapixel CMOS Image Sensor (OV253AI Die Markings) TSMC 0.13 µm Process
March 5, 2007 OmniVision OV2640 1/4-Inch 2 Megapixel CMOS Image Sensor (OV253AI Die Markings) TSMC 0.13 µm Process Imager Process Review For comments, questions, or more information about this report,
More informationSamsung K4H510838C-UCCC 512Mbit DDR SDRAM Structural Analysis
July 26, 2005 Samsung K4H510838C-UCCC 512Mbit DDR SDRAM Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More information