Integrated Photonics using the POET Optical InterposerTM Platform

Transcription

1 Integrated Photonics using the POET Optical InterposerTM Platform Dr. Suresh Venkatesan CIOE Conference Shenzhen, China Sept. 5, 2018 POET Technologies Inc. TSXV: PUBLIC POET PTK.V Technologies Inc. PUBLIC 11

2 The greatest single breakthrough in the near term will be the integration of photonics into SiP products - Bill Bottoms, co-chairman Heterogenous Integration Roadmap (HIR) committee [EE Times, Dylan McGrath 8/24/2018] The Future is NOW. Introducing The POET Optical Interposer POET Technologies Inc. PUBLIC 22

3 Agenda Motivation POET Optical Interposer Technology Advantages Summary POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 3 3

4 Agenda Motivation POET Optical Interposer Technology Advantages Summary POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 4 4

5 Data Communications market fueled by growth in connectivity Exabytes per month % CAGR Gaming (1%,4%) File Sharing (8%,3%) Web/Data (18%,11%) IP VOD (22%,14.5%) 0 Internet Video (51%,67.4%) Source: Cisco VNI Global IP Traffic Forecast; Old phone Kbps Kilo=10 3 Home Mbps Mega = 10 6 Datacenter Gbps Giga = 10 9 Front plates Tbps Tera = Traffic Peta = Traffic Today Exa = Annual global cloud traffic is set to exceed 14 zettabytes by 2020 Traffic Tomorrow Zetta = Yotta = POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 5 5

6 Mega data centers require new technology Need smaller, faster, cheaper and lower power integrated photonic transceivers The economic end of Moore s Law is here. Heterogenous Integration separately manufactured silicon and non-silicon components integrated into a higher level system in a 3D system in package Heterogenous Integration involves - components, design components, packaging technologies, materials, thermal management, supply chain POET is employing the concepts of heterogenous integration to create Integrated Photonics Optical Engines Mega Data Centers built by Others POET Technologies Inc. TSXV: POET PTK.V Technologies PUBLIC Inc. PUBLIC 6 6

7 Cost is King Why Integration Matters Wafer Fab Costs The POET Interposer Solution Packaging and Testing Costs Photonics Electronics 0% 50% 100% Packaging and testing = > 80% of total cost of a conventional photonics components Applying proven wafer-scale semiconductor manufacturing techniques can achieve : Dramatically reduced component cost Improved size, power, cost, speed, reliability and scalability New functionalities Chip Scale Hybrid Assembly of electronic and photonic components POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 77

8 Agenda Motivation POET Optical Interposer Technology Advantages Summary POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 8 8

9 Three Approaches to Optical Engine / Transceiver Manufacturing Integrated Conventional Assembled one at a time Components placed manually Optically align each placement High component cost High assembly cost Final test upon completion Silicon Photonics Monolithic chip integration, except: Lasers not wafer scale so need active alignment High insertion losses, no high volume commercial integrated mux-demux High cost per die and wasted real estate for laser attach Final test upon completion A device, not a Platform POET Optical Interposer Multi-chip module approach Use known good die No active alignment Low insertion losses Wafer level assembly, packaging and test Low cost per die High final yield High performance detectors and integrated mux-demux True Platform Technology POET Technologies Inc. PUBLIC POET Technologies Inc. TSXV: PTK.V PUBLIC 99

10 Chip-scale Integration using POET s Optical Interposer Electrical Interposer Electrical Die 2 Electrical Die 1 Electrical Die 2 Electrical Interconnections Electrical Die 1 Optical Interposer Electrical Die 1 Electrical Die 2 Optical Optical Die 1 Die 2 Waveguides Optical Layer Electrical Layer Electrical Die 1 Electrical Die 2 Optical Die 1,2 First practical application of 3D semi fabrication processes to photonic interposer devices: Flip chip and under-bump metal Through silicon vias (TSVs) Pick and place assembly Wafer-level test, burn-in and packaging Compatible with Si CMOS processing POET Technologies Inc. TSXV: POET PTK.V Technologies PUBLIC Inc. PUBLIC 10 10

11 POET s Optical Interposer Platform Wafer Level Hermetic Cap (Optional) Extending the functionality of electrical interposers with Optical Waveguides Z-height Alignment Stops Active Die Metal Waveguide Layer Optical Axis Low Loss, Low Stress and Low Temperature waveguides enable integration with conventional silicon technology Wirebond Pad Cu Trace Solder Bump on Die Side Active Die Attach Waveguides built above top metal enables integration with IC s Optional TSV Thermal Management Multi-level (Optical) Cu backend. Interposer can include passives such as resistors, MIM caps, etc. High Resistivity Silicon Substrate Scribe Street and Fiber Groove Passive alignment of optics using optical reference planes designed into Optical Interposer and advancements in CMOS packaging technology for x & y alignment POET Technologies Inc. TSXV: POET PTK.V Technologies PUBLIC Inc. PUBLIC 11 11

12 POET Optical Interposer Platform A multi-purpose integration platform with unique benefits for transceiver manufacturers in datacom and telecom Proprietary Dielectric Waveguides eliminate costly components and active alignment Ultra-low loss material improves coupling efficiency Athermal not sensitive to temperature changes Passive devices embedded in dielectric at no added cost System Architecture allows optimal power/performance/cost Small form factor and elegant lateral optical axis design High scalability for multiple protocols and increasing data rates High flexibility platform for customized applications Full Wafer-level Integration of all components Fabrication, test, packaging all at wafer level Hundreds of modules vs. one module at a time Known good device assembly improves yield and lowers cost True Silicon CMOS compatibility a disruptive advantage On-chip integration with electronic devices Competitive waveguides (glass, silica, SiN) NOT compatible with CMOS Multiple applications beyond transceivers POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 12 12

13 Agenda Motivation POET Optical Interposer Technology Advantages Summary POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 13 13

14 POET Optical Interposer Technology - Essential Features Material Properties of Dielectric Waveguides Varying Index Multi-Layer Waveguides Low Transmission Losses High Coupling Efficiency to InP actives and Fiber Filter Functionality in the Waveguides Passive Pick and Place Wafer Scale Assembly POET Technologies Inc. TSXV: PTK.V PUBLIC

15 1 Material Properties of Dielectric Waveguides Bulk Material Loss Waveguide 2017 l=1302nm Loss= 3.2dB/cm l=1553nm Loss= 3.05dB/cm Full Wafer Characterization Buffer 2018 Material Improvement to <0.2dB/cm loss Material Loss < 0.2dB/cm Low Loss for both O Band and C Band POET Technologies Inc. TSXV: PTK.V PUBLIC 15

16 2 Varying Index Multi-Layer Waveguides AWG chip with fiber matching SSCs Intrinsically Coupled Multiple Waveguides of different refractive index Transitions managed with simple lithography Compatible with Mode Profiles of Single Mode Fiber, Laser Source or Detectors Input Fiber Mode Input SSC Mode Small Waveguide Mode SSC Small Waveguide Mode Output SSC Mode SSCs Output Fiber Mode Mode Conversion enabled using multi-waveguide technology POET Technologies Inc. TSXV: PTK.V PUBLIC 16

17 2 Varying Index Multi-Layer Waveguides Patterned single mode waveguides Measured Simulated Excellent Mode control of the fundamental mode through optimized design and patterning POET Technologies Inc. TSXV: PTK.V PUBLIC 17

18 3 Low Transmission Losses Fiber LOSS IN STRAIGHT WAVEGUIDES (2X Coupling Loss + Transmission Loss) Simulated Coupling Loss : 0.36dB/side Transmission Loss is < 0.5dB/cm MEASURED CALCULATED <0.5dB/cm Transmission Loss minimal impact of surface roughness <0.5dB coupling loss to SMF with appropriate waveguide design POET Technologies Inc. TSXV: PTK.V PUBLIC 18

19 4 High Coupling Efficiency to InP actives and Fiber Big-spot waveguide at dielectric chip facet -0.5 db Big-spot waveguide at InP chip facet -0.5 db InP actives and Dielectric Waveguides co-optimized for peak coupling efficiency POET Technologies Inc. TSXV: PTK.V PUBLIC 19

20 4 Hybrid Integration of Dielectric and InP Chips Dielectric Waveguide coupled to InP PIN Receiver with integrated SSC B. Responsivity measured with waveguide coupling InP Chip with SSC Fiber A. Responsivity measured with fiber coupling A. 0.6dB improvement in coupling matches simulations InP Chip with SSC P in Dielectric Waveguide IO Fiber B. P in <1dB coupling efficiency achievable between dielectric waveguide and InP active chip through passive alignment POET Technologies Inc. TSXV: PTK.V PUBLIC 20

21 5 Grating Functionality in Dielectric Waveguides Low Loss (3dB insertion loss) -30dB cross talk No Polarization dependence Temperature independent grating stability. New designs and process improvements in progress to meet the bandwidth requirements of CWDM POET Technologies Inc. TSXV: PTK.V PUBLIC 21

22 6 Passive pick and place alignment for Wafer Scale Assembly High Accuracy Assembly for Hybrid Integration Photonic Platform (HIPP) Assembled PSM4 HIPP Receive Engines High Placement Accuracy: < +/- 3σ High Speed Automatic Assembly: UPH > 130 Support Process Offset Compensation for mass production with high placement accuracy High bonding accuracy and high speed demonstrated ( 0.5um) for passive placement of InP active die on Optical Interposer POET Technologies Inc. TSXV: PTK.V PUBLIC 22

23 Agenda Motivation POET Optical Interposer Technology Advantages Summary POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 23 23

24 A Compelling Price Difference for Optical Engines POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 24 24

25 400G Data Center Interconnects 400G DR4 Modulator Array 50G Baud Modulator 50G Baud PIN Optical Interposer enables a low cost assembly platform for 400G DR4 and multi-channel architectures (FR4 and FR8) Cost of 8 channel optics mitigated through use of low cost Mux/De-Mux utilizing Dielectric Gratings integrated into the interposer Enables low cost 400G using 50Gbaud optics and avoids expensive DSP and gear ratio modification Co-design active components and the optical interposer to enable passive placement 400G FR8 Modulator Array 50G Baud Modulator 50G Baud PIN Pick/Place die attach of GC Array and PIN & Modulator arrays High Coupling efficiency enables external cavity laser form factors Wafer level hermetic seal and wafer level test POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC POET Technologies Inc. TSXV: PTK.V PUBLIC 25

26 Broad Range of Applications Data centers Telecom Networking Automotive Industrial Sensing High Performance Computing POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 26 26

27 Agenda Motivation POET Optical Interposer Technology Advantages Summary POET Technologies Inc. TSXV: PTK.V PUBLIC POET Technologies Inc. PUBLIC 27 27

28 POET s Optical Interposer Platform Receive Optical Engines Quad PIN 100G Quad PIN 400G CWDM and LR4 Filters Waveguide integrated Interposers Assembly Dicing Ongoing Ongoing Transmit Optical Engines 25G DML 100G 25G EML 100G Hermetic Seal Gain Chips + External Cavity Laser For 400G Ongoing Ongoing Ongoing 1H 2019 Development POET Technologies Inc. TSXV: POET PTK.V Technologies PUBLIC Inc. PUBLIC 28 28

29 Summary The POET Optical Interposer TM is a NOVEL integration and assembly platform for Photonics POET enables an Optical Multi-Chip Module using Chip Scale Packaging technology tailored for Photonics Addressing large and rapidly growing sensing, datacom and telecom markets POET products address multi-billion USD datacom market, growing at >25% CAGR Highly differentiated, IP protected technology Low-cost leadership with highly scalable technology and Known Good Die assembly Leveraging innovative Optical Interposer platform architecture & proprietary dielectric waveguides Significant technology development and product qualification progress Manufacturing, assembly and test capabilities and supply chain partners established POET Technologies Inc. PUBLIC 2929 POET Technologies Inc. TSXV: PTK.V PUBLIC

30 Thank You! Learn more at Booths 2512, POET Technologies Inc. PUBLIC 30