Tyndall National Institute (Coordinator) Institut für Photonische Technologien e.v. École Polytechnique Fédérale de Lausanne
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1 Semiconducting Nanowire Platform for Autonomous Sensors SiNAPS Tyndall National Institute (Coordinator) Institut für Photonische Technologien e.v École Polytechnique Fédérale de Lausanne Imperial College of Science and Technology Aquamarijn Research BV 1
2 Semiconducting Nanowire Platform for Autonomous Sensors SiNAPS Vision Project Objectives Highlights Impact 2
3 ICT energy pie grows fast ICT and consumer electronics account for approximately 15% of global residential electricity consumption Data: IEA report (2009) 3
4 1,700 TWh in two decades! By 2030, energy use by household ICT and consumer electronics will triple consuming 1,700TWh 4,344 TWh 3,457 TWh 1,038 TWh Maps: Data: IEA report (2010) 4
5 Reduce energy consumption per chip Eric Pop group 5
6 Harvest ambient energy efficiently Images 6
7 Manage efficiently power at the nanoand macro-scale 7
8 Utilise resources effectively 8
9 SiNAPS response NW modified CMOS module Si Ge Energy Scavengers NW modified CMOS module Micro-fluidics Integrated Sensors CMOS module I O Logics and Transmittance A cost-effective technology enabling material platform Nanotech-based solar energy harvesting (generation II, III PVs) Energy-efficient ICT ICT for energy efficiency 9
10 Semiconducting Nanowire Platform for Autonomous Sensors SiNAPS Vision Project Objectives Highlights Impact 10
11 Science &Technology objectives Si Ge S&T1: Nanoscale energy harvesting system based on SiNWs - develop core-shell semiconducting nanowires for efficient light absorption and charge separation - fabricate high-efficiency PV mini-modules S&T2: Power-efficient, highly-selective/sensitive NW-based chemical sensing - develop surface functionalisation schemes on nanowires for selective binding - demonstrate sensing of streptavidin using immobilised biotin S&T3: Microfluidics for miniaturised nanowire-based chemical sensor - develop a microfluidic delivery system to be integrated with the chemical nano-sensor. S&T4: Efficient power management and data processing for micron-sized devices - develop a low-power complete CMOS electronics sensing interface with an embedded energy management concept S&T5: Integration into a single device of dimensions < 1mm 3 - integrate the individual modules into an Autonomous Platform with a target volume at and well beyond the state-of-the-art, namely, 4mm 3 and an ultimate target of smaller than 1 mm 3. I O 11
12 Semiconducting Nanowire Platform for Autonomous Sensors SiNAPS Vision Project Objectives Highlights Impact 12
13 properties of a-si:h from first-principles D.V. Lang et al, PRB 25, 5285 (1982) first-principles log of DOS vs energy (ev) for asi:h (12%H) experiment M. Legesse, M. Nolan and G. Fagas, unpublished 13
14 Current density (ma/cm 2 ) miniaturised solar cell with 7.29% efficiency a 500nm c 500nm b 500nm d 500nm 30nm Contact area: 7.02 mm 2 Efficiency: 7.29% Open circuit voltage: 476 mv Current density: ma/cm 2 Filling factor: Voltage (V) AM 1.5 Dark Guobin Jia, Martin Steglich, Ingo Sill, and Fritz Falk (IPHT), to appear in Solar Energy Materials and Solar Cells (2011) 14
15 Current (A) PV mini-modules 1,0x10-3 5,0x10-4 0,0-5,0x ,0x10-3 V OC = 1.83 V Active area 5.9 mm 2 P out >150 µw -1,5x ,0x ,5x ,0x10-3 Cell Cell Cell Cell Cell Cell ,5-1,0-0,5 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 U (V) 15
16 Miniaturised microfluidic delivery platform nanowire array microfluidic channel microfluidic platform 1 x 1 mm 16
17 surface functionalisation demonstrating biotin-streptavidin binding XPS-data attached dye-conjugated streptavidin 17
18 power management electronics Specification Value and/or Description Main Chip Size ~ 500µmX700µm excl PADs inc test structures Mini@sic Chip Area 1525X1525µm 2 (including PADs) Mini@sic Chip Area 1100X1100µm 2 (without PADs) Average Power Consumption 0.3µW (Power Management) Average Power Consumption 2µW (Integrated Temperature Sensor) Package CLCC 44 18
19 fundamentals of efficient and accurate simulation tools M. Iakovidis, GF in preparation D. Sharma, H. Arefi, GF, submitted 19
20 miniaturisation roadmap & integration Issue1 Issue2 Issue3 Targets easy experimenting Targets miniaturization while maintaining specifications Targets miniaturization while losing minimal functionality Test bed helps with proof Proof of concept first Proof of concept second of principle SiNAPS Node SiNAPS Node Chip size 25x25 [mm] Chip size 2x2 [mm] Chip size 1x1 [mm] test platform Integration based on PCB Horizontal Single Substrate or Horizontal Multiple Substrate (depending on project phase) Just intended for R&D testing Integration based on Polyimide or Ceramic substrate Single Substrate with support for 3D integration with battery and radio Target Date for Integration M22 Integration based on CMOS Die Single Substrate with support for 3D integration with battery and radio Target Date for Integration M30 towards issue 2 Large Bonding Area for conductive adhesive Radio chip Thin flexfoil 20
21 Semiconducting Nanowire Platform for Autonomous Sensors SiNAPS Vision Project Objectives Highlights Impact 21
22 Innovation pathway PV nanomaterial PV mini-modules PMU and frontend co-design Chemical nanosensor e-health Environment and Security Energy 22
23 Semiconducting Nanowire Platform for Autonomous Sensors SiNAPS Thank you! the team! 23
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