10+Gbps 0.8mm pitch Board to Board Connectors

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1 NEW 1+Gbps.mm pitch oard to oard onnectors FX1 Series.mm Pitch Variations :oplanar / Vertical / Stacking Number of ontacts : / / / 1 / 1/ 1 Multi functional contact (MF contact) as; q ground contact to enhance grounding. w power supply contacts up to 1 to reduce required pin counts. e 3-step sequential contacts for grounding and detection. Effective mating length of signal contact:. mm. (MF contact :.5mm / MF contact :1.5mm) Single contact Pin through hole mounting MF contacts increase strength against wrenching. Large mating guide for easy mating. MF contact MF contact IR Signal integrity features Impedance Insertion Loss-to-rosstalk-Ratio (IR) 11 5 The insertion loss-to-crosstalk ratio (IR) with five-aggressor differential FEXT meets the extrapolated IEEE.3ap specification for 1+Gbps with plenty of margins. 15 Z (Ohms) IR (d) Differential Impedance 1 The differential impedance is within 1±1 ohms at 35 ps rise time( % to %) IR IEEE spec Time (ns). 1 Variations oplanar connection Vertical connection FX1-**S-.SH Stacking connection FX1-**P-.SH FX1-**S-.SH FX1-**P-.SV** 15~ pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. Mechanical features FX1-**P-.SV 7. FX1-**S-.SV** 1. 1

2 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Product Specification urrent Rating.5(Signal) (Note3) 3.(MF contact ) Voltage Rating 1V pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. Rating Operating Temperature Range Storage Temperature Range Item 1.ontact Resistance.Insulation Resistance 3.Voltage Proof.Durabirity (mating/unmating) Specification 9m ohms max 1M ohms min No flashover or insulation breakdown 1m 5V D 3V / 1min ontact resistance: 1m ohms max 5 cycles 5.Vibration No electrical discontinuity of 1µs or more.shock No electrical discontinuity of 1µs or more -55ç ~ ç (Note 1) -1ç ~ ç (Note ) ondition Frequency:1 to 55Hz, pprox 5 min Single ampritude.75mm, 1cycles for 3 directions 9m/s,Duration of pulse 11ms, at 3 time for 3 directions 9 hours at temperature of ±ç and humidity of 9% to 95% 7.Humidity (Steady state) ontact Resistance :1m ohms max Insulation Resistance: 1M ohms min ontact Resistance :1m ohms max (-55ç:3 minutes,5ç:3minutes) under 5 cycle.temperature ycle Insulation Resistance: 1M ohms min (Note 1) Includes temperature rise caused by current flow. (Note ) Storage means a long-term storage state for the unused product before assembly to pcb. (Note 3) The rated current applies to per contact. (Note ) I nformation contained in this catalog represents general requirements for this Series. ontact us for the drawings and specifications for a specific part number shown. Material Receptacle / Header Part Material Insulator P Signal contact Phosphor bronze MF contact Phosphor bronze Finish Remark lack UL9V- ontact area:gold plated Lead area :Gold plated ontact area:gold plated Lead area :Tin plated Ordering Information Right ngle Receptacle ❶ Series Name FX1 - S -. SH ❶ ❷ ❸ ❹ ❸ onnector Type S ❺ P Right ngle Header FX1 - P -. SH ❶ ❷ ❸ ❹ ❺ FX1 - P -. SV 1 ❷ ❸ ❹ ❺ ❻ Straight Receptacle FX1 - S -. SV 15 ❶ ❷ ❸ ❹ ❺ :Receptacle :Header ❹ ontact Pitch :.mm ❺ ontact Type SH :oard Right ngle Type SV :oard Straight Type ❻ Stacking Height Designation Straight Header ❶ FX1 ❷ Number of contacts ❻

3 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Function hart Right ngle Receptacle Right ngle Header FX1-**S-.SH FX1-**P-.SH pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. oplanar connection Straight Receptacle Vertical connection Straight FX1-**S-.SV15 Header FX1-**P-.SV FX1-**S-.SV Stacking connection FX1-**P-.SV1 Stacking connections Heights Stacking Variation Straight Header FX1-**P-.SV** FX1-**P-.SV FX1-**P-.SV1 FX1-**S-.SV15 15mm 5mm FX1-**S-.SV mm 3mm Straight Receptacle FX1-**S-.SV** Signal Integrity Pin assignment To match 1 ohm differential impedance and to reduce crosstalk, a staggered GSSG pin assignment is recommended for FX1. (G=ground and S=signal) ross section of mating (coplanar connection) Pin assignment ( In case of pos. ) ontact ontact No. ontact ontact No. Signal pin Diff pair Ground pin 3

4 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Impedance The differential impedance is 1±1 ohm for FX1 at 35 ps rise time (% to %) Z (Ohms) pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. Z (Ohms) Time (ns) Time (ns). 1 Insertion Loss The differential insertion loss crosses 1d at GHz for FX S (d) S (d) Return loss The differential return loss meets the IEEE.3ap specification to 1 GHz for FX RL IEEE Spec RL (d) RL (d) -5 RL IEEE Spec

5 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Near-end crosstalk (NEXT) The staggered GSSG pin assignments resulted in low differential NEXT. S1 - - S (d) S Far-end crosstalk (FEXT) The staggered GSSG pin assignments resulted in low differential FEXT. S S S (d) S (d) Insertion-loss-to-crosstalk ratio (IR) The insertion-loss-to-crosstalk ratio (IR) with multi-aggressor differential FEXT meets the extrapolated IEEE.3ap specification to 1+Gbps with plenty of margins IR (d) IR (d) pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. S (d) 1 IR IEEE spec 1 IR IEEE spec 1 5

6 FX1 Series 1+Gbps.mm pitch oard to oard onnectors ±. P=.±.15 Right ngle Receptacle.5±.1 ±. No.F 11.9±. No.G No.H 1.5±.15 1.± pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. 9.5±.15 3.± ±. ±.15 D±.5 E±.5 1.±.15.5±.5.75±.5.5±.5 ll dimensions in mm D E F G H(pos.) No marking, "under development" Right ngle Header ±. P=.±.15 ±. 5.±..±. 9.5±.15 ±.15 No.F.5±.1 5.1±. indicates "available". HRS No. L L L L L L ±.15 FX1-S-.SH FX1-S-.SH FX1-S-.SH FX1-1S-.SH FX1-1S-.SH FX1-1S-.SH No.G No.H D±.5 E±.5 1.± ±.15.55±.5 1.±.15.75±.5 5±.5 ll dimensions in mm FX1-P-.SH FX1-P-.SH FX1-P-.SH FX1-1P-.SH FX1-1P-.SH FX1-1P-.SH indicates "available". HRS No. L L L579-- L L579-- L No marking, "under development" D E F G H(pos.) 1 1 1

7 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Straight Header ±. ±. P=.±.15.5±.1 No.H 7.±. No.G No.F (.5) 3.55±.15 D±.5 E±.5 1±.15 1.± ±. ll dimensions in mm FX1-P-.SV FX1-P-.SV FX1-P-.SV FX1-1P-.SV FX1-1P-.SV FX1-1P-.SV indicates "available". HRS No. L L L L D E F G H(pos.) No marking, "under development" ±. ±. Straight Header (1 type) P=.±.15.35±.1 No.H 7.±. No.G No.F 3.55±.15 FX1-P-.SV1 FX1-P-.SV1 FX1-P-.SV1 FX1-1P-.SV1 FX1-1P-.SV1 FX1-1P-.SV1 indicates "available". HRS No. L579-- L L579-- L D E F ±. ±. 1.±.15 1.± D±.5 E± ±.3 ±.15.9±. ±. pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. ±.15 ll dimensions in mm G H(pos.) No marking, "under development" 7

8 ±. ±.15 ±. P=.±.15.35±.1 No.G 7.±. No.H 5.1±. Straight Receptacle(15type) 3.±.15 FX1 Series 1+Gbps.mm pitch oard to oard onnectors.9± ±.15.9±. ±. D±.5 E±.5 1.±.15 ±. pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. 11.5±.3 No.F ll dimensions in mm indicates "available" D E F G H(pos.) No marking, "under development" Straight Receptacle(type) No.G 7.±. No.H ±. ±.15 ±. P=.±.15.35±.1 5.1±. HRS No. L L L L ±.15 FX1-S-.SV15 FX1-S-.SV15 FX1-S-.SV15 FX1-1S-.SV15 FX1-1S-.SV15 FX1-1S-.SV15 1.5±.3 No.F FX1-S-.SV FX1-S-.SV FX1-S-.SV FX1-1S-.SV FX1-1S-.SV FX1-1S-.SV indicates "available". HRS No. L L L L No marking, "under development" D E F ±. 1.±.15 ±. 1.±.15.9±. ± D±.5 E±.5 ll dimensions in mm G H(pos.)

9 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Recommended Land Pattern Dimension of P (P thickness: t=1.mm / Metal mask thickness: t=.1mm) FX1-S-.SH FX1-P-.SH FX1-S-.SH FX1-P-.SH ±.5 ±.5 FX1-S-.SH FX1-P-.SH FX1-1S-.SH ± R ±.5 P=.±.5 FX1-1P-.SH FX1-1S-.SH P EDGE ±.5 FX1-1P-.SH FX1-1S-.SH FX1-1P-.SH R ±.5 P=.±.5. ±.5 FX1-P-.SV FX1-P-.SV FX1-P-.SV FX1-1P-.SV FX1-1P-.SV FX1-1P-.SV ± Straight Header ±.5 ± P=.± ±.5 R TH.± ± ± TH Straight Header (SV 1 type) ±.5 ±.5 ±.5 FX1-P-.SV FX1-P-.SV FX1-P-.SV FX1-1P-.SV FX1-1P-.SV FX1-1P-.SV ±.5 P=.± R TH.± TH 1 ± Straight Receptacle (SV 15 / SV type).9±.5 pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved..± ±.5.75±.5 Right ngle Receptacle / Right ngle Header FX1-S-.SV15/ FX1-S-.SV15/ FX1-S-.SV15/ FX1-1S-.SV15/ FX1-1S-.SV15/ FX1-1S-.SV15/ ±.5 ±.5 ±.5 9

10 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Packing specification Right ngle Receptacle / Right ngle Header (35) (5) (35) (3) (P=7) FX1-P/S-.SH FX1-S-.SH FX1-S-.SH (P=1) pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. FX1-P-.SH FX1-P-.SH FX1-S-.SH (5) (1) FX1-P-.SH FX1-1S-.SH FX1-1P-.SH FX1-1S-.SH FX1-1P-.SH FX1-1S-.SH FX1-1P-.SH Quantity 7 5 >PS< QTY. Straight Header (35) (3±.5) (7.5) (P=) FX1-P-.SV (5) (1) (P=1) (31.5) QTY. 1 >PS< Quantity FX1-P-.SV 7 FX1-P-.SV FX1-P-.SV 5 FX1-1P-.SV FX1-1P-.SV FX1-1P-.SV

11 FX1 Series 1+Gbps.mm pitch oard to oard onnectors Straight Header 1 type / Straight Receptacle (15/ type) (35) (3) (31.5) (7.5) (P=) FX1-S-.SV15 FX1-S-.SV A FX1-P-.SV1 FX1-P-.SV1 (P=1) FX1-S-.SV FX1-P-.SV1 FX1-S-.SV15 5 FX1-S-.SV (1) (5) FX1-S-.SV FX1-S-.SV15 FX1-1P-.SV1 FX1-1S-.SV15 FX1-1S-.SV FX1-1P-.SV1 FX1-1S-.SV15 FX1-1S-.SV QTY. >PS< FX1-1P-.SV1 FX1-1S-.SV15 FX1-1S-.SV Mounting Temperature Profile (Reference) (MX 5ç) ç ç Temperature pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. Quantity FX1-P-.SV ç (ç) 9±1s Pre-heating time (15 to ç) MX s Soldering Time (ç min.) Time (Second) HRS test conditions Test board dimension material Solder method Solder composition Metal mask Reflow cycle : mm : Glass epoxy : Reflow : Paste Sn-3g-.5u :.1mm thick : cycle The temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, Volume/thickness and board size/thickness. onsult your solder paste and equipment manufacturer for specific recommendations. 11

12 FX1 Series 1+Gbps.mm pitch oard to oard onnectors leaning recommendations Organic solvent cleaning Solvent Type Room temperature cleaning Heated cleaning IP ( Isopropyl alcohol) YES YES HF ( Hydrochlorofluorocarbon ) YES YES Water based cleaning pr.1.1 opyright 1 HIROSE ELETRI O., LTD. ll Rights Reserved. When using water based cleaning agents (e.g., terpene, alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes it s affects on metals, platings and plastics. Remove any moisture after cleaning. Powered by TPDF ( Residual flux or cleaning agents in the contact areas may affect electrical performance. onnector Precautions llowable learance between the Mated Pair Within 1mm Recommend the allowable clearance at mating including angled insertion to be Max.1mm. Within 1mm Within 1mm oplanar connection Vertical connection Stacking connection P Fixture P and chassis can not be stabilized only by the connector. Fixture to stabilize the P is necessary. When fitting using a rotary insertion plug, please ensure you refer to the Rotary Insertion Guideline (TD -13) 1-3,Nakagawa huoh--home,tsuzuki-ku,yokohama-shi -5,JPN TEL: Fax: The contents of this catalog are current as of date of /1. ontents are subject to change without notice for the purpose of improvements.

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