15 + Gbps 0.5mm pitch Stacking Connectors

Transcription

1 Housing Metal fitting 15 + Gbps.5mm pitch Stacking Connectors FX1 Series Electrical Interface for the OIF 1G Long-Haul DWDM Transmission Module (MSA-1GLH) With GND Plate Type Ground plate and metal fitting make contact Cross Section Floating Floating.5mm Signal Integrity Features Insertion-Loss-to-Crosstalk-Ratio(ICR) The insertion-loss-to-crosstalk-ratio (ICR) with five-aggressor differential FEXT meets the extrapolated IEEE 82.3ap specification for 15 + Gbps. Differential Impedance 85ø configuration and 1ø configuration are available. Stack Height 2-piece type With ground plate Headers Receptacles FX1#-xP/x-SV FX1# xp/x SV1 FX1#-*S/*-SV 4mm 5mm 3-piece type Ground plate Signal contact.75mm.75mm ICR (db) Mechanical Features.5mm Pitch Stacking height: 4 to 8mm (2-piece type) 8 to 13mm (3-piece type) Number of Contacts With ground plate: 8 / 1 / 12 / 14 Without ground plate: 96 / 12 / 144 / piece interposer : 12 / 144 /168 Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. 1 Signal:1 Ground Arrangement Signal and ground contacts are arranged in a 1:1 ratio. The ground plate is connected to the board and the resulting ground stability effectively reduces noise. Suited to High-Density Applications The.5 mm signal contact pitch provides a smaller overall connector, using less mounting area on the board. Optional Ground Plate An alternate style without the ground plate is available. The space provided by the ground plate removal has been filled with additional signal contacts. <3-piece type> Smooth floating with high speed transmission capability supported by unique 3-piece floating system Multiple connectors are allowed on the same PCB (Allowable Mis-alignment Range: ±.3 mm in XY direction) 1 ICR ICR spec Without ground plate Stacking Height Header (Mating side) Interposer Header(Fixed side) 8 mm FX1#-xP-SV FX1#-xP-SV 9 mm FX1#-xP-SV FX1-xIP-xD(Q)-8H FX1#-xP-SV1 1 mm FX1#-xP-SV1 FX1#-xP-SV1 11 mm FX1#-xP-SV2(*) FX1#-xP-SV1 12 mm FX1#-xP-SV3(*) FX1-xIP-xD(Q)-8PH FX1#-xP-SV1 13 mm FX1#-xP-SV4(*) FX1#-xP-SV1 (Note *) SV2/SV3/SV4 of 12pos and 14pos variations have not been released yet. Please contact a Hirose Representative for the release schedule. Z (Ohm) ( ) S(3,3) Time (ps) Headers FX1#-xP-SV FX1 xp SV1 FX1#-168P-SV2 FX1#-168P-SV3 FX1#-168P-SV4 Receptacles FX1#-*S-SV 4mm 5mm 6mm 7mm 8mm (H):Reference dimension 215.1e 1

2 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors MSA-1GLH Electrical Interface (2 piece type) Product Specifications (Rating) Rating Rated current Note 1 Rated voltage 5 V AC Operating temperature range Operating humidity range -55 to 85ç Relative humidity 95% max (No condensation) Storage temperature range Storage humidity range -4 to +6ç (Note 2) 4 to 7% (Note 2) Note 1: Refer to FX1-168pin derating curves from test reports TR57E Note 2: The term storage refers to unused products kept for a long time prior to board mounting. Operating temperature and humidity range are applicable to the non-conducting state after board assembly. Note 3: Other information is shown in the General Product Specifications. Receptacles without ground plate No.a1 (P=.5) No.a2 41.5±.2 No.a84 No.a83.2±.5 Unit: mm 7.3±.3 3.2±.3 7.1±.2 2.5±.2 No.b1 No.b2 49.1±.3 No.b83 No.b84 14 A (.6) (Ø1) 44.4±.1 (Ø1) Guidepost No. of Contacts Part No. HRS No. Remarks Signal FX1A-168S-SV (**) ** With guideposts 168 FX1B-168S-SV (**) ** Without guideposts [Specifications number] -, ( ) (83): Embossed tape packaging 1RL:1pcs/ AuP.76µm (84): Embossed tape packaging 1RL:5pcs/ AuP.76µm Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Using multiple connectors between identical boards is not recommended. (85): Embossed tape packaging 1RL:25pcs/ AuP.76µm (93): Tray packaging / AuP.76µm Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15mm Board-to-Board Distance HEADER CONNECTOR FX1A(B)-168P-SV*(83) SOLDER 3 PCB 1 Ø1.2± ±.5.5±.3 No.a1 No.a2 No.b2 No.b ± ±.5 No.a84 No.a83 No.b83 No.b84 Ø1.2± ±.3(LAND WIDTH).25±.3(METAL MASK) 2 B 1 (A) (1.1):MATING LENGTH RECEPTACLE CONNECTOR FX1A(B)-168S-SV(83) FX1A(B)-168P-SV(83) FX1A(B)-168P-SV1(83) FX1A(B)-168P-SV2(83) FX1A(B)-168P-SV3(83) FX1A(B)-168P-SV4(83) SOLDER 3 FX1A(B)-168S-SV(83) 1 (A) 2 B 4 4.3± ± ± ± ±.127 Note 1 Not required in products without guideposts. Note Stacking height from lead to lead (reference dimensions) Board-to-board distance Stencil (metal mask) shall be based on Hirose's recommended aperture and thickness. PCB 2

3 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors MSA-1GLH Electrical Interface Headers without ground plate No.b1 (P=.5) No.b2 41.5±.2 No.a84.2±.5 No.a83 5.9±.3 5.7±.2 2.5±.2 A 14 No.a1 No.a2 No.a83 No.a84 (.6) A±.3 (Ø1) 49.1± ±.1 (Ø1) Guidepost Part No. HRS No. No. of Contacts Quantity/Reel A Signal (Note 3) FX1A-168P-SV (**) ** 3.5 1, FX1A-168P-SV1 (**) ** 4.5 1, FX1A-168P-SV2 (**) ** FX1A-168P-SV3 (**) ** FX1A-168P-SV4 (**) ** FX1B-168P-SV (**) ** 3.5 1, FX1B-168P-SV1 (**) ** 4.5 1, FX1B-168P-SV2 (**) ** FX1B-168P-SV3 (**) ** FX1B-168P-SV4 (**) ** [Specifications number] -, ( ) (83): Embossed tape packaging 1RL:1pcs/ AuP.76µm (93): Tray packaging / AuP.76µm (85): Embossed tape packaging 1RL:25pcs/ AuP.76µm Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. Note 4: Using multiple connectors between identical boards is not recommended. Unit: mm Remarks With guideposts Without guideposts Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm ± ± ±.5 Ø1.2± Ø1.2±.5 No.b1 No.b2 No.b84 No.b No.a2 1.45±.5 No.a1 Note 1 Not required in products without guideposts. No.a83 No.a84.3±.3(LAND PATTERN).25±.3(METAL MASK) 3

4 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Signal integrity Pin assignment To match 1 ohm differential impedance and to reduce crosstalk, a staggered GSGSG pin assignment is recommended. (G=ground and S=signal) GSGSG signal Diff pair ground Impedance The differential impedance is 1 +/- 1 ohm for FX1 at 3 ps rise time (2% to 8%). 4 mm (without GND) 5 mm (without GND) Z (Ohm) 1 Z (Ohm) S(3,3) Time (ps) S(3,3) Time (ps) 4 mm (with GND) 5 mm (with GND) Z (Ohm) 1 Z (Ohm) S(3,3) Time (ps) S(3,3) Time (ps) Propagation delay The propagation delay is 62 and 67 ps for FX1 of 4mm and 5mm height (with and without GND), respectively. 4

5 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Insertion loss The differential insertion loss crosses 1 db at 1.8 and 9.2 GHz for FX1 of 4mm and 5mm height, respectively. 4 mm (without GND) 5 mm (without GND) IL IL 4 mm (with GND) 5 mm (with GND) IL Return loss The differential return loss meets the IEEE 82.3ap specification to 2 + and 13.5 GHz for FX1 of 4mm and 5mm height, respectively. 4 mm (without GND) 5 mm (without GND) RL (db) RL (db) RL RL Spec RL RL Spec mm (with GND) 5 mm (with GND) RL (db) RL (db) RL RL Spec RL RL Spec

6 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Near-end crosstalk (NEXT) The staggered GSGSG pin assignment results in low differential NEXT between neighboring pairs. 4 mm (without GND) NEXT 5 mm (without GND) NEXT mm (without GND) FEXT 5 mm (without GND) FEXT mm (with GND) 5 mm (with GND) FEXT FEXT mm (with GND) 5 mm (with GND) NEXT NEXT Far-end crosstalk (FEXT) The staggered GSGSG pin assignment results in low differential FEXT between neighboring pairs

7 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Insertion-loss-to-crosstalk ratio (ICR) The insertion-loss-to-crosstalk ratio (ICR) with five-aggressor differential FEXT meets the extrapolated IEEE 82.3ap specification to 1 + Gbps. 6 4 mm (without GND) 6 5 mm (without GND) ICR (db) 3 ICR (db) ICR ICR spec ICR ICR spec mm (with GND) 5 mm (with GND) ICR (db) 3 ICR (db) ICR ICR spec ICR ICR spec

8 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors General Product Specifications (2 piece type) Rating Rated current Rated voltage.3 A 5 V AC Operating temperature range Operating humidity range -55 to 85ç (Note 1) Relative humidity 95% max (No condensation) Storage temperature range Storage humidity range -1 to +6ç (Note 2) 4 to 7% (Note 2) Item Requirements Conditions 1. Insulation resistance 1 M ø min Measured at 1 V DC 2. Voltage resistance No flashover or breakdown 15 V AC applied for one minute 3. Contact resistance 6 m ø max Measured at 1 ma 4. Vibration resistance No electrical discontinuity for 1 µs or greater No damage, cracks, or parts looseness Frequency: 1 to 55 Hz, amplitude of.75 mm in 3 axis directions, 1 cycles each. 5. Shock resistance No electrical discontinuity for 1 µs or greater No damage, cracks, or parts looseness 6. Damp heat (Steady state) Contact resistance of 7 m ø max, insulation resistance of 1 M ø min, no damage, cracks, or parts looseness 7. Temperature cycle Contact resistance of 7 m ø max, insulation resistance of 1 M ø min, no damage, cracks, or parts looseness 8. Mating Cycles Contact resistance of 7 m ø max No damage, cracks, or parts looseness 9. Resistance to soldering heat No melting of resin portion which affects performance Acceleration of 49 m/s 2, 11 ms duration, sine half-wave waveform, for 3 cycles in both directions of each of the 3 axes Temperature of 4ç, humidity of 9 to 95%, duration 96 h Temperature: -55ç 15 to 35ç 85ç 15 to 35ç Time: 3 min. 2 to 3 min. 3 min. 2 to 3 min. for 5 cycles 5 times Reflow: At the recommended temperature profile Soldering iron temperature: 36ç for 5 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term storage refers to unused products kept for a long time prior to board mounting. Operating temperature and humidity range are applicable to the non-conducting state after board assembly. Note 3: Information contained in this catalog represents general requirements for this series. Contact us for the drawings and specifications for a specific part number shown. Materials Part Material Finish Notes Insulator LCP Beige UL94V- Contacts Phosphor bronze Header Contact Area: Gold plating Lead Area: Tin plating Receptacle Contact Area: Gold plating Lead Area: Flash plating --- Ground plate Phosphor bronze Tin plating --- Metal fitting Phosphor bronze Tin plating --- Ordering Information q w FX1 # - * P / * - SV 1 (**) q Series name : FX1 A : With guide post B : Without guide post w e Number of contacts With ground plate Signal/Ground: 8/8, 1/1, 12/12, 14/14 Without ground plate Signal: 96, 12, 144, 168 r t y u e r t y u Connector type P : Header S : Receptacle Mounting style SV : Straight SMT Product height Blank : Standard 1 : Standard + 1mm Packaging options Blank, (71) : Tray packaging (21), (91) : Embossed tape packaging 8

9 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Headers with ground plate 4mm Stacking Height Unit: mm Part No. HRS No. No.of Contacts Signal Ground A B C C E F Remarks FX1A-8P/8-SV(**) ** FX1A-1P/1-SV(**) ** FX1A-12P/12-SV(**) ** FX1A-14P/14-SV(**) ** FX1B-8P/8-SV(**) ** FX1B-1P/1-SV(**) ** FX1B-12P/12-SV(**) ** FX1B-14P/14-SV(**) ** [Specifications number] -, ( ) (71): Tray packaging (91): Embossed tape packaging Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1, pieces.) Note 4: Using multiple connectors between identical boards is not recommended. With guideposts Without guideposts Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, 2 places on both sides, indicate the metal fittings. The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts. 9

10 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Headers with ground plate 5mm Stacking Height (.5) A±.2.5±.5.2±.5 5.9±.3 (5.7) 2.5±.2 A (.75) (.75) (6) B±.2 C±.3 (.6) 4.5±.3 2-(Ø1) D±.1 Guidepost Unit: mm Part No. HRS No. No. of Contacts Signal Ground A B C C E F Remarks FX1A-8P/8-SV1(**) ** FX1A-1P/1-SV1(**) ** FX1A-12P/12-SV1(**) ** FX1A-14P/14-SV1(**) ** FX1B-8P/8-SV1(**) ** FX1B-1P/1-SV1(**) ** FX1B-12P/12-SV1(**) ** FX1B-14P/14-SV1(**) ** [Specifications number] -, ( ) (71): Tray packaging (91): Embossed tape packaging Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1, pieces.) Note 4: Using multiple connectors between identical boards is not recommended. With guideposts Without guideposts Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, 2 places on both sides, indicate the metal fittings. The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts. 1

11 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Receptacles with ground plate (.5) A±.2.5±.5.2±.5 7.3±.3 (7.1) 3.2±.3 2.5±.2 (.75) (.75) (6) B±.2 C±.3 (.6) 2-(Ø1) D±.1 A Guidepost Unit: mm Part No. HRS No. No. of Contacts Signal Ground A B C C E F Remarks FX1A-8S/8-SV(**) ** FX1A-1S/1-SV(**) ** FX1A-12S/12-SV(**) ** FX1A-14S/14-SV(**) ** FX1B-8S/8-SV(**) ** FX1B-1S/1-SV(**) ** FX1B-12S/12-SV(**) ** FX1B-14S/14-SV(**) ** [Specifications number] -, ( ) (71): Tray packaging (91): Embossed tape packaging Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1, pieces.) With guideposts Without guideposts Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, 2 places on both sides, indicate the metal fittings. Not required in products without guideposts. 11

12 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Headers without ground plate 4mm Stacking Height A±.2 (.5).2 ± ±.3 3.5±.3 (5.7) 2.5 ±.2 B±.3 (.6) 2-(Ø1) C±.1 Guidepost Unit: mm Part No. HRS No. No. of Contacts Signal A B C D E Remarks FX1A-96P-SV(**) ** FX1A-12P-SV(**) ** FX1A-144P-SV(**) ** FX1A-168P-SV(**) ** FX1B-96P-SV(**) ** FX1B-12P-SV(**) ** FX1B-144P-SV(**) ** FX1B-168P-SV(**) ** [Specifications number] -, ( ) (71): Tray packaging (91): Embossed tape packaging Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1, pieces.) With guideposts Without guideposts Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm D +.1 E -.1 Ø1.2 ±.5 C±.5 A ±.5 2 Ø1.1 ±.5.5 ± ±.5.3 ±.3(Land).25±.3(Metal mask) Note 1 The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. 2 Not required in products without guideposts. 12

13 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Headers without ground plate 5mm Stacking Height A ±.2 (.5 ).2 ± ±.3 (5.7 ) 2.5 ±.2 (.6 ) 4.5±.3 2-(Ø 1) B±.3 C±.1 Guidepost Unit: mm Part No. HRS No. No. of Contacts Signal A B C D E Remarks FX1A-96P-SV1(**) ** FX1A-12P-SV1(**) ** FX1A-144P-SV1(**) ** FX1A-168P-SV1(**) ** FX1B-96P-SV1(**) ** FX1B-12P-SV1(**) ** FX1B-144P-SV1(**) ** FX1B-168P-SV1(**) ** [Specifications number] -, ( ) (71): Tray packaging (91): Embossed tape packaging Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1, pieces.) Note 4: Using multiple connectors between identical boards is not recommended. With guideposts Without guideposts Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm 2 Ø1.1 ±.5.5 ±.3 D +.1 E -.1 C±.5 A ± Ø1.2 ± ±.5.3 ±.3(Land).25±.3(Metal mask) Note 1 The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. 2 Not required in products without guideposts. 13

14 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Receptacles without ground plate A±.2 (.5 ).2 ±.5 3.2±.3 Recommended PCB Layout Dimensions (Metal mask) Recommended metal mask thickness:.15 mm D +.1 E -.1 C±.5 Ø1.2±.5 1 A±.5 1 Ø1.1±.5.5± ±.3 ( 7.1 ) 2.5 ±.2 B±.3 (.6 ) 2-(Ø1) C±.1 Guidepost Part No. HRS No. No. of Contacts Signal A B C D E Remarks FX1A-96S-SV(**) ** FX1A-12S-SV(**) ** FX1A-144S-SV(**) ** FX1A-168S-SV(**) ** FX1B-96S-SV(**) ** FX1B-12S-SV(**) ** FX1B-144S-SV(**) ** FX1B-168S-SV(**) ** [Specifications number] -, ( ) (71): Blank (21): Embossed tape packaging Note 1: There is no polarity with respect to board mounting for this product. Note 2: The coplanarity of this product's SMT leads is.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1, pieces.) Note 4: Using multiple connectors between identical boards is not recommended. Unit: mm With guideposts Without guideposts 1.45±.5.3±.3(Land).25±.3(Metal mask) Note 1 Not required in products without guideposts. 14

15 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors General Product Specifications (3 piece type) Rating Rated current Rated voltage.3 A 5 V AC Operating temperature range Operating humidity range -55 to 85ç (Note 1) Relative humidity 95% max (No condensation) Storage temperature range Storage humidity range -1 to +6ç (Note 2) 4 to 7% (Note 2) Item Requirements Conditions 1. Insulation resistance 1 M ø min Measured at 1 V DC 2. Voltage resistance No flashover or breakdown 15 V AC applied for one minute 3. Contact resistance 8mm height : 8mø max 9mm height : 85mø max 1mm height : 9mø max 11mm height : 95mø max Measured at 1 ma 12mm height : 1mø max 13mm height : 15mø max 4. Vibration resistance No electrical discontinuity for 1 µs or greater No damage, cracks, or parts looseness Frequency: 1 to 55 Hz, amplitude of.75 mm in 3 axis directions, 1 cycles each. 5. Shock resistance No electrical discontinuity for 1 µs or greater No damage, cracks, or parts looseness 6. Damp heat (Steady state) Contact resistance change : 2 mø or less, insulation resistance of 1 M ø min, no damage, cracks, or parts looseness 7. Temperature cycle Contact resistance change : 2 mø or less, insulation resistance of 1 M ø min, no damage, cracks, or parts looseness 8. Mating Cycles Contact resistance change : 2 mø or less No damage, cracks, or parts looseness Acceleration of 49 m/s 2, 11 ms duration, sine half-wave waveform, for 3 cycles in both directions of each of the 3 axes Temperature of 4ç, humidity of 9 to 95%, duration 96 h Temperature: -55ç 15 to 35ç 85ç 15 to 35ç Time: 3 min. 2 to 3 min. 3 min. 2 to 3 min. for 5 cycles 5 times Note 1: Includes temperature rise caused by current flow. Note 2: The term storage refers to unused products kept for a long time prior to board mounting. Operating temperature and humidity range are applicable to the non-conducting state after board assembly. Note 3: Information contained in this catalog represents general requirements for this series. Contact us for the drawings and specifications for a specific part number shown. Materials Part Material Finish Notes Insulator LCP Black/Gray UL94V- Contacts Phosphor bronze Contact Area: Gold plating --- Ground bar Phosphor bronze Ni plating --- Ordering Information FX1 - # IP - 36 DM1 - #H (#) q w e r t y u i q Series Name : FX1 w Pin count : 12, 144, 168 pins e Connector type r Number of Diff-pairs t Signal type IP : Interposer D : Diff. 1 ohm Q : Diff. 85 ohm (Blank) : Open pin field y Pin configuration Blank = Standard (all diff pairs), M* =Reduced GND pins u Stacking height 8H : 8 to 1mm 8PH : 11 to 13mm i Specification suffix # (Blank) : Ni1.5µm + Au.1µm (3) : Ni1.5µm + Au.76µm 15

16 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Interposer (3piece type) 7.7± ±.5 A±.5 Mating side (Gray) Fixed side (Black) 6.5±.5 Unit: mm Part No. HRS No. Singleended Signal Differential Ground type pairs pins pins A Remarks FX1-168IP-4D-8H(**) ** 1 ø For 8 to 1mm height FX1-168IP-4D-8PH(**) ** For 11 to 13mm height FX1-168IP-52Q-8H(**) ** For 8 to 1mm height 85 ø FX1-168IP-52Q-8PH(**) ** For 11 to 13mm height FX1-168IP-8H(**) ** Open For 8 to 1mm height 168 FX1-168IP-8PH(**) ** pin field For 11 to 13mm height FX1-144IP-32D-8H(**) ** 1 ø For 8 to 1mm height FX1-144IP-32D-8PH(**) ** For 11 to 13mm height FX1-144IP-44Q-8H(**) ** For 8 to 1mm height 85 ø FX1-144IP-44Q-8PH(**) ** For 11 to 13mm height FX1-144IP-8H(**) ** Open For 8 to 1mm height 144 FX1-144IP-8PH(**) ** pin field For 11 to 13mm height FX1-12IP-28D-8H(**) ** 1 ø For 8 to 1mm height FX1-12IP-28D-8PH(**) ** For 11 to 13mm height FX1-12IP-36Q-8H(**) ** For 8 to 1mm height 85 ø FX1-12IP-36Q-8PH(**) ** For 11 to 13mm height FX1-12IP-8H(**) ** Open For 8 to 1mm height 12 FX1-12IP-8PH(**) ** pin field For 11 to 13mm height [Specifications number] -, ( ) Blank: Contact plating Ni1.5µm+Au.1µm (3): Contact plating Ni1.5µm+Au.76µm 16

17 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Signal integrity (3-piece type) Pin assignment For 1 ohm type interposer, pin assignment shall be GSGSG. For 85 ohm type interposer, pin assignment shall be GSSG. 1.Differential Impedance 1 Type 2.Differential Impedance 85 Type 3.Open Pin Field Type (With Ground Bar) (With Ground Bar) (No Ground Bar) Pin Assignment Pin Assignment Pin Assignment Row A Row A Row A Row B Row B Row B Signal Pin Dedicated Ground Pin Ground Bar Differential Pair Impedance mm (85 ohm type) Insertion Loss 8mm (85 ohm type) Z (Ohm) TDR, Rise-time: 5ps(2-8%) Time (ns) IL Return Loss The differential return loss meets the IEEE 82.3ap specification to 2+GHz for FX1 of 8mm height. 8mm (85 ohm type) RL (db) RL RL spec

18 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Near-end crosstalk (NEXT) 8mm (85 ohm type) Sdd(2,3) Sdd(2,5) Far-end crosstalk (FEXT) 8mm (85 ohm type) S(dB) -3 S(dB) Frequency(GHz) Frequency(GHz) Insertion-loss-to-crosstalk ratio (ICR) The insertion-loss-to-crosstalk ratio (ICR) with fiveaggressor differential FEXT meets the extrapolated IEEE 82.3ap specification to 15 + Gbps. 6 8mm (85 ohm type) 5 4 ICR (db) ICR ICR spec

19 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Embossed Carrier Tape Dimensions Headers 2±.1 12±.1 4±.1 Ø ±.1 A±.1 B±.1 C±.3 (D).9 (.4) Unit: mm Insertion Connector A B C D E F G FX1#-8P/8-SV FX1#-1P/1-SV FX1#-12P/12-SV FX1#-14P/14-SV FX1#-96P-SV FX1#-12P-SV FX1#-144P-SV FX1#-168P-SV FX1#-8P/8-SV Unreeling direction.2±.5 R Receptacles 2±.1 (6.2) (6.6) 12±.1 4±.1 Ø ±.1 (3.5) (.4).9 FX1#-1P/1-SV FX1#-12P/12-SV1 FX1#-14P/14-SV FX1#-96P-SV FX1#-12P-SV FX1#-144P-SV1 FX1#-168P-SV Note: There is no polarity with respect to embossed tape packaging for this product. 37 A±.1 B±.1 C±.3 Unit: mm Insertion Connector A B C E F G FX1#-8S/8-SV Unreeling direction.2±.5 R (7.6) (8) FX1#-1S/1-SV FX1#-12S/12-SV FX1#-14S/14-SV FX1#-96S-SV FX1#-12S-SV FX1#-144S-SV FX1#-168S-SV Note: There is no polarity with respect to embossed tape packaging for this product. Reel Dimensions (G) (Ø8) Ø13±.5 (E) (F) 19

20 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Recommended Temperature Profile HRS test Conditions Test board Glass epoxy 161mm 1mm 1.6mm thick Solder method :Reflow Solder composition : Paste, 96.5%Sn/3%Ag/.5%Cu Metal mask :.15mm thick Reflow cycles :2 cycles The temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Washing Conditions Organic Solvent Cleaning Solvent IPA (Isopropyl alcohol) HCFC (Hydrochlorofluorocarbon) Room temperature washing Heated washing Water Type Cleaning When using water based cleaning agents (e.g., terpene, alkali saponifiers) make sure the labeling discloses any effect on metals, platings and plastics. Remove any moisture after cleaning. Residual flux or cleaning agents in the contact areas may affect the electrical performance. Cleaning Precautions Residual flux or cleaning agents in the contact areas may affect the electrical performance. Please make sure a thorough cleaning operation has been completed. Connector Handling Precautions 1. Mating lengths and creepage distance The effective wipe length for this product is 1.1 mm for the signal contact and 1 mm for the ground contact. Creepage of the header and receptacle during mating should be within.5 mm of the fully mated position. 2. PCB support Note that boards should not be supported solely by the connectors themselves. Support should be in the form of spacers and screws or other suitable methods to support the boards. 3. Solder repairs During repair, the flux could wick onto the contact area of the connector and cause reduced contact reliability. In this case, make sure you understand washing conditions before washing is implemented. 4. Miscellaneous Note that excessive twisting while inserting or withdrawing connectors will cause damage. Slight color differences on the molded items may be noted. However, these color differences will not affect the connector's performance. 2

21 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Spacer Spacers are required to support the PWB s and protect the SMT solder joints. Suggested spacer style is shown below: Spacer Spacer, male-male, M3 thread The recommended spacer height corresponds to the interposer stacking height as shown in the chart below. Stacking height Recommended spacer height Remark 4mm 4.3 ±.127 mm 5mm 6mm 7mm 8mm 8mm 9mm 1mm 11mm 12mm 13mm 5.3 ±.127 mm 6 ±.127 mm 7 ±.127 mm 8 ±.127 mm 8 ±.127 mm 9 ±.127 mm 1 ±.127 mm 11 ±.127 mm 12 ±.127 mm 13 ±.127 mm 2 piece type 3 piece type 1-3mm 1-3mm Recommended spacer location Four spacers located diagonally are required. Spacers should be located 1 to 3mm from the connector to prevent excessive mechanical loading on the interconnections. If assembly will be subjected to vibration, spacer should be located to prevent resonance, and additional spacer may be required. Interposer installation Position the interposer directly over the mounting header. (Interposers have no polarity.) Fixed side (black side) of the interposer shall be mated with the mounting header (fixed side). Do not use SV2, SV3, or SV4 headers on both sides of the interposer. The wiping length on the mating side becomes shorter. Interposer Mounting header (Fixed side) Mating side (Mold color: Gray) Fixed side (Mold color: Black) Stacking height Header (Mating side) 8 mm FX1#-xP-SV Interposer Header (Fixed side) FX1#-xP-SV 9 mm FX1#-xP-SV FX1-xIP-xD(Q)-8H FX1#-xP-SV1 1 mm FX1#-xP-SV1 FX1#-xP-SV1 11 mm FX1#-xP-SV2 FX1#-xP-SV1 12 mm FX1#-xP-SV3 FX1-xIP-xD(Q)-8PH FX1#-xP-SV1 13 mm FX1#-xP-SV4 FX1#-xP-SV1 21

22 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors Interposer removal The interposer can be removed from the mounting header by hand. (No special tools are needed.) Removal and re-mating of the fixed side can reduce the extraction force of the fixed side due to wear. It is recommend to replace the interposer to a new one once removed. Multiple Mating <2-piece type> It is not recommended to use multiple 2-piece FX1 connectors on the same PWB. <3-piece type> FX1 3-piece type has multiple mating capability. If multiple connectors are used on the same PWB, they must be oriented in the same direction. It is not recommended to mix orientations. Mating tolerance (3-piece type) Due to the floating interposer, FX1 3-piece type can accept mating tolerances of up to ±.15mm tolerance in the X-axis and up to ±.15mm in the Y-axis..15mm.15mm 22

23 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors MEMO : 23

24 FX1 Series 15 + Gbps.5mm pitch Stacking Connectors USA: HIROSE ELECTRIC (U.S.A.), INC. HEADQUARTERS 2688 Westhills Court, Simi Valley, CA Phone : Fax : USA: HIROSE ELECTRIC (U.S.A.), INC. SAN JOSE OFFICE 3255 Scott Boulevard, Building 7, Suite 11 Santa Clara, CA 9554 Phone : Fax : USA: HIROSE ELECTRIC (U.S.A.), INC. CHICAGO OFFICE 58 Waters Edge Lane, Suite 25 Lombard IL 6148 Phone : Mail : inquiries@hirose.com USA: HIROSE ELECTRIC (U.S.A.), INC. DETROIT OFFICE (AUTOMOTIVE) Laurel Office Park III Laurel Park Drive Suite 253 Livonia, MI Phone : Fax : GERMANY: HIROSE ELECTRIC EUROPE B.V. NUERNBERG OFFICE Muggenhofer Str Nuernberg Phone : Fax : THE NETHERLANDS: HIROSE ELECTRIC EUROPE B.V. Hogehillweg #8 111 CC Amsterdam Z-O Phone : Fax : GERMANY: HIROSE ELECTRIC EUROPE B.V. HANOVER OFFICE Bayernstr. 3, Haus C 3855 Langenhagen, Germany Phone : Fax : GERMANY: HIROSE ELECTRIC EUROPE B.V. GERMAN BRANCH Herzog-Carl-Strasse 4 D-7376 Ostfildern (Scharnhauser Park) Phone : Fax : FRANCE: HIROSE ELECTRIC EUROPE B.V. PARIS OFFICE Regus La Garenne Colombes,Place de La Belgique, 71 Boulevard National La Garenne Colombes, 9225, France Phone : +33 () Fax : +33 (1) UNITED KINGDOM: HIROSE ELECTRIC EUROPE BV (UK BRANCH) 4 Newton Court, Kelvin Drive, Knowlhill, Milton Keynes, MK5 8NH Phone : Fax : CHINA: HIROSE ELECTRIC (SHANGHAI) CO., LTD. 161, Henderson Metropolitan, NO.3, East Nanjing Road, Huangpu District, Shanghai, China 21 Phone : Fax : CHINA: HIROSE ELECTRIC (SHANGHAI) CO.,LTD. BEIJING BRANCH A11, Ocean International Center, Building 56# East 4th Ring Middle Road, ChaoYang District, Beijing, 125 Phone : Fax : CHINA: HIROSE ELECTRIC TECHNOLOGIES (SHENZHEN) CO., LTD. Room 9-13, 19/F, Office Tower Shun Hing Square, Di Wang Commercial Centre, 52 Shen Nan Dong Road, Shenzhen City, Guangdong Province, 5188 Phone : Fax : KOREA: HIROSE KOREA CO., LTD , Jeoungwhang-Dong, Shihung-City, Kyunggi-Do Phone : ,7124 Fax : INDIA: HIROSE ELECTRIC SINGAPORE PTE. LTD. BANGALORE LIAISON OFFICE Unit No.3, Ground Floor, Explorer Building International Tech Park Whitefield Road, Bangalore 5666 Karnataka, India Phone : Fax : HONG KONG: HIROSE ELECTRIC HONGKONG TRADING CO., LTD. Room 11, West Wing, Tsim Sha Tsui Centre, 66 Mody Road, Tsim Sha Tsui East, Kowloon, Hong Kong Phone : Fax : SINGAPORE: HIROSE ELECTRIC SINGAPORE PTE. LTD. 1 Anson Road #26-1, International Plaza 7993, Singapore Phone : Fax : MALAYSIA: HIROSE ELECTRIC SINGAPORE PTE. LTD , Penang Cybercity (1164),Lintang Mayang Pasir 3,1195, Bayan Baru, Penang, Malaysia. Phone : Fax : TAIWAN: HIROSE ELECTRIC TAIWAN CO., LTD. 13 8F, No.87, Zhengzhou Rd., Taipei Phone : Fax : INDIA: HIROSE ELECTRIC SINGAPORE PTE. LTD. DELHI LIAISON OFFICE Office NO.519, Regus-Green Boulevard, Level5, Tower C, Sec62, Plot B-9A, Block B, Noida, 2131, Uttar Pradesh, India Phone : Fax : THAILAND: HIROSE ELECTRIC SINGAPORE PTE. LTD. BANGKOK OFFICE (Representative Office) Unit 473, 47th FL., 1 Empire Tower, South Sathorn Road, Yannawa, Sathorn, Bangkok 112 Thailand Phone : Fax : ,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi ,JAPAN TEL: Fax: The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 1/215. Contents are subject to change without notice for the purpose of improvements.