0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections

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Brooke O’Brien’
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0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections FX11 Series Stacking height : 2mm Stacking height : 2.5mm, 3mm Features 1.

Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. 3.

Metal Fittings for dded Strength Metal fittings provide for greater adhesion to the board, which protects the connector against sheaning forces.

1 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections FX11 Series Stacking height : 2mm Stacking height : 2.5mm, 3mm Features 1. Low Profile Design The boardtoboard mating height of 2mm, 2.5mm and 3mm suits smaller, thinner case designs. (Fig.2) 2. Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle Signal:1 Ground rrangement Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1) 4. Metal Fittings for dded Strength Metal fittings provide for greater adhesion to the board, which protects the connector against sheaning forces. The unique connector design provides a connection between the fitting and the ground plate for a stronger ground. 5. Suited to HighDensity pplications The signal contact pitch of 0.5mm affords a compact connector, and reduces mounting space on the board. 6. Structure Prevents Solder Wicking solder gap has been designed into the contact SMT portion to prevent solder wicking. (Fig.3) 7. High Contact Reliability Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm, 3mm height) for signal contacts. 8. Optional Ground Plate n alternate style is also available without the ground plate. The space provided by the absence of the ground plate is filled with additional signal contacts. 10 Signal : 1 Ground rrangement Housing Metal fitting 0.5mm 0.75mm Ground plate and metal fitting make contact Stacking Height Variation Ground Plate Signal contact 0.75mm Note: 2.0mm type product cannot be used or interchanged with the 2.5mm or 3.0mm type product. Structure Prevent Solder Wicking Fig.1 Fig.2 Fig.3 Signal Integrity Features InsertionLosstoCrosstalk Ratio (ICR) The insertionlosstocrosstalk ratio (ICR) with five differential FEXT aggressors meets the extrapolated IEEE802.3ap specification to 10 + Gbps. Differential Impedance The differential impedance is 100 +/ 10ø for FX11 at 50 ps rise time(20% to 80%). ICR(dB) ICR 3mm(Without GND) ICR IEEEspec Frequency(GHz) Z(ø) Impedance 3mm(Without GND) FX11 3mm DifferentialTDR Time(ns) In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information e 1

2 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections BStacking height variation With ground plate Receptacle FX11L#*S / *SV Header FX11L#*P / *SV 2mm Receptacle FX11#*S / *SV Header FX11#*P / *SV 2.5mm FX11#*P / *SV0.5 3mm Without ground plate Receptacle Receptacle FX11L#*SSV FX11#*SSV Header Header Note 1: The thickness of the solder paste is not included in the stacking height. Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other. BCross section of mating Stacking height : 2mm Stacking height : 2.5mm, 3mm FX11L#*PSV 2mm FX11#*PSV 2.5mm FX11#*PSV0.5 3mm (Shown for stacking height 2.5mm type.) 2

3 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Stacking height : 2mm Product Specifications Rating Rated current Rated voltage V C Operating temperature range Operating humidity range 55 to +85ç Relative humidity 95% or less (No condensation) Storage temperature range Storage humidity range 10 to +60ç (Note 1) 40 to 70% (Note 1) Item Requirements 1. Insulation resistance 100Mø or greater 2. Withstanding voltage No flashover or breakdown 3. Contact resistance 60mø or less 4. Vibration resistance No electrical discontinuity for 1μs or greater No damaged, cracked or loose parts 5. Shock resistance 6. Humidity resistance 7. Temperature cycle 8. Mating cycles 9. Solder heat resistance Note 1 : The term storage refers to the longtermstorage status of unused items before mounting on the PCB. The operating temperature/humidity ranges apply to the unmated state after board mounting. Materials / Finish Part Insulator Contacts Ground plate Metal fitting Metal plate Type With Ground Plate Type Without Ground Plate 1 Series name : FX11L 4 2 Form Symbol : With guide post 3 No electrical discontinuity for 1μs or longer No damaged, cracked or loose parts Contact resistance of 70mø or less, insulation resistance of 100Mø or greater, No damaged, cracked or loose parts Contact resistance of 70mø or less, insulation resistance of 100Mø or greater, No damaged, cracked or loose parts Contact resistance of 70mø or less No damaged, cracked or loose parts No melting of resin portion which affects performance Material LCP Copper alloy Phosphor bronze Phosphor bronze Phosphor bronze B : Without guide post Number of contacts Type with ground plate Signal/Ground : 60/6, 80/8, 100/10, 0/ Type without ground plate Signal : 68, 92, 116, 140 Beige Header Receptacle Tin plating Tin plating 5 6 Measured at 100V DC 150V C applied for 1 minute Measured at 100m Frequency : 10 to 55Hz, amplitude of 0.75mm in 3 directions, 10 cycles each cceleration of 490m/s 2, 11ms duration, sine halfwave waveform, for 3 cycles in the both directions of each of the 3 axes Temperature of 40ç, humidity of 90 to 95%, duration 96h Temperature : 55ç 15 to 35ç 85ç 15 to 35ç Time : min. 2 to 3 min. min. 2 to 3 min. for 5 cycles 50 times Conditions Reflow : t the recommended temperature profile Soldering iron temperature : 360ç for 5 seconds Finish FX11L # * P / * SV (**) FX11L # * P SV (**) Engagement rea : Gold plating of 0.1μm Termination rea : Flash plating Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders. Remarks UL94V0 Connector type P : Header S : Receptacle Contact form SV : Straight SMT Blank, (71) : Tray packaging (Without pickandplace tape) (21),(91) : Embossed tape packaging (Without pickandplace tape) (22),(92) : Embossed tape packaging (With pickandplace tape) 3

4 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Header with Ground Plate 2mm stacking height FX11L60P/6SV(71) FX11L80P/8SV(71) FX11L100P/10SV(71) FX11L0P/SV(71) FX11LB60P/6SV(71) FX11LB80P/8SV(71) FX11LB100P/10SV(71) FX11LB0P/SV(71) (71) : Tray packaging (91) : Embossed tape packaging (Without pickandplace tape) (92) : Embossed tape packaging (With pickandplace tape) Signal Ground 0 0 With guideposts Without guideposts B C D E F Remarks RoHS Note Crosshatched portions, totaling n places, indicate the ground circuits. The crosshatched area inside the SMT land may come into contact with the connector contacts Not required in products without guideposts. Do not mount a part other than this product in the area of. Doing so will prevent the engagement of this and the mating connector. 4

5 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Receptacle with Ground Plate 2mm stacking height FX11L60S/6SV(71) FX11L80S/8SV(71) FX11L100S/10SV(71) FX11L0S/SV(71) FX11LB60S/6SV(71) FX11LB80S/8SV(71) FX11LB100S/10SV(71) FX11LB0S/SV(71) (71) : Tray packaging (Without pickandplace tape) (91) : Embossed tape packaging (Without pickandplace tape) (92) : Embossed tape packaging (With pickandplace tape) Signal Ground B C D E F Remarks RoHS With guideposts Without guideposts Note 1 Crosshatched portions, totaling n places, indicate the ground circuits. 2 Crosshatched portions, 2 places on both sides, indicate the metal fittings. 3 The crosshatched area inside the SMT land may come into contact with the connector contacts 4 Not required in products without guideposts. 5

6 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Header without Ground Plate 2mm stacking height FX11L68PSV(**) FX11L92PSV(**) FX11L116PSV(**) FX11L140PSV(**) FX11LB68PSV(**) FX11LB92PSV(**) FX11LB116PSV(**) FX11LB140PSV(**) ** ** 5707 ** ** ** ** ** ** Blank : Tray packaging (Without pickandplace tape) (21) : Embossed tape packaging (Without pickandplace tape) (22) : Embossed tape packaging (With pickandplace tape) Signal B C D E Remarks RoHS With guideposts Without guideposts Note 1 The crosshatched area inside the SMT land may come into contact with the connector contacts 2 Not required in products without guideposts. 3 Do not mount a part other than this product in the area of. Doing so will prevent the engagement of this and the mating connector. 6

7 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Receptacle without Ground Plate 2mm stacking height FX11L68SSV(**) FX11L92SSV(**) FX11L116SSV(**) FX11L140SSV(**) FX11LB68SSV(**) FX11LB92SSV(**) FX11LB116SSV(**) FX11LB140SSV(**) ** ** 5711 ** ** ** ** ** ** Blank : Tray packaging (Without pickandplace tape) (21) : Embossed tape packaging (Without pickandplace tape) (22) : Embossed tape packaging (With pickandplace tape) Signal B C D Remarks RoHS With guideposts Without guideposts Note 1 The crosshatched area inside the SMT land may come into contact with the connector contacts 2 Not required in products without guideposts. 7

8 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Stacking height : 2.5mm, 3mm Product Specifications Rating Rated current Rated voltage V C Operating temperature range Operating humidity range 55 to +85ç Relative humidity 95% or less (No condensation) Storage temperature range Storage humidity range 10 to +60ç (Note 1) 40 to 70% (Note 1) Item Requirements Conditions 1. Insulation resistance 100Mø or greater Measured at 100V DC 2. Withstanding voltage No flashover or breakdown 150V C applied for 1 minute 3. Contact resistance 70mø or less Measured at 100m 4. Vibration resistance No electrical discontinuity for 1μs or greater Frequency : 10 to 55Hz, amplitude of 0.75mm No damaged, cracked or loose parts in 3 directions,10 cycles each 5. Shock resistance 6. Humidity resistance 7. Temperature cycle 8. Mating cycles 9. Solder heat resistance No electrical discontinuity for 1μs or longer No damaged, cracked or loose parts Contact resistance of 80mø or less, insulation resistance of 100Mø or greater, No damaged, cracked or loose parts Contact resistance of 80mø or less, insulation resistance of 100Mø or greater, No damaged, cracked or loose parts Contact resistance of 80mø or less No damaged, cracked or loose parts No melting of resin portion which affects performance cceleration of 490m/s 2, 11ms duration, sine halfwave waveform, for 3 cycles in the both directions of each of the 3 axes Temperature of 40ç, humidity of 90 to 95%, duration 96h Temperature : 55ç 15 to 35ç 85ç 15 to 35ç Time : min. 2 to 3 min. min. 2 to 3 min. for 5 cycles 50 times Reflow : t the recommended temperature profile Soldering iron temperature : 360ç for 5 seconds Note 1 : The term storage refers to the longtermstorage status of unused items before mounting on the PCB. The operating temperature/humidity ranges apply to the unmated state after board mounting. Materials / Finish Part Insulator Contacts Ground plate Metal fitting Metal plate Type With Ground Plate Type Without Ground Plate Material LCP Copper alloy Phosphor bronze Phosphor bronze Phosphor bronze FX11 # * P / * SV 0.5 (**) FX11 # * P SV 0.5 (**) Beige Header Receptacle Tin plating Tin plating Finish Engagement rea : Gold plating of 0.1μm Termination rea : Flash plating Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders. Remarks UL94V0 Series name : FX11 Form Symbol : With guide post B : Without guide post Number of contacts Type with ground plate Signal/Ground:60/6, 80/8, 100/10 Type without ground plate Signal : 80, 100 Connector type P : Header S : Receptacle Contact form SV : Straight SMT Product height Blank : Standard 0.5 : Standard + 0.5mm Blank, (71) : Tray packaging (Without pickandplace tape) (21),(91) : Embossed tape packaging (Without pickandplace tape) (22),(92) : Embossed tape packaging (With pickandplace tape) 8

9 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Header with Ground Plate 2.5mm stacking height FX1160P/06SV(71) FX1180P/08SV(71) FX11100P/10SV(71) FX11B60P/06SV(71) FX11B80P/08SV(71) FX11B100P/10SV(71) (71) : Tray packaging (Without pickandplace tape) (91) : Embossed tape packaging (Without pickandplace tape) (92) : Embossed tape packaging (With pickandplace tape) Signal Ground B C D E F Remarks RoHS With guideposts Without guideposts 37.5 Note Crosshatched portions, totaling n places, indicate the ground circuits. The crosshatched area inside the SMT land may come into contact with the connector contacts Not required in products without guideposts. Do not mount a part other than this product in the area of. Doing so will prevent the engagement of this and the mating connector. 9

10 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Header with Ground Plate 3mm stacking height FX1160P/6SV0.5(71) FX1180P/8SV0.5(71) FX11100P/10SV0.5(71) FX11B60P/6SV0.5(71) FX11B80P/8SV0.5(71) FX11B100P/10SV0.5(71) (71) : Tray packaging (Without pickandplace tape) (91) : Embossed tape packaging (Without pickandplace tape) (92) : Embossed tape packaging (With pickandplace tape) Signal Ground B C D E F Remarks RoHS With guideposts Without guideposts Note Crosshatched portions, totaling n places, indicate the ground circuits. The crosshatched area inside the SMT land may come into contact with the connector contacts Not required in products without guideposts. Do not mount a part other than this product in the area of. Doing so will prevent the engagement of this and the mating connector. 10

11 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Receptacle with Ground Plate 2.5mm, 3mm stacking height FX1160S/6 SV(71) FX1180S/8 SV(71) FX11100S/10 SV(71) FX11B60S/6 SV(71) FX11B80S/8 SV(71) FX11B100S/10 SV(71) (71) : Tray packaging (Without pickandplace tape) (91) : Embossed tape packaging (Without pickandplace tape) (92) : Embossed tape packaging (With pickandplace tape) Signal Ground B C D E F Remarks RoHS With guideposts Without guideposts Note 1 2 Crosshatched portions, totaling n places, indicate the ground circuits. Crosshatched portions, totaling 2 places, indicate the metal fittings. 3 The crosshatched area inside the SMT land may come into contact with the connector contacts 4 Not required in products without guideposts. 11

12 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Header without Ground Plate 2.5mm stacking height FX1180PSV(**) FX11100PSV(**) FX11B 80PSV(**) FX11B100PSV(**) ** ** ** 5755 ** Blank : Tray packaging (Without pickandplace tape) (21) : Embossed tape packaging (Without pickandplace tape) (22) : Embossed tape packaging (With pickandplace tape) Signal B C D E Remarks RoHS With guideposts Without guideposts Note 1 The crosshatched area inside the SMT land may come into contact with the connector contacts 2 Not required in products without guideposts. 3 Do not mount a part other than this product in the area of. Doing so will prevent the engagement of this and the mating connector.

13 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Header without Ground Plate 3mm stacking height FX1180PSV0.5(**) ** FX11100PSV0.5(**) ** FX11B80PSV0.5(**) ** FX11B100PSV0.5(**) ** Signal Blank : Tray packaging (Without pickandplace tape) (21) : Embossed tape packaging (Without pickandplace tape) (22) : Embossed tape packaging (With pickandplace tape) B C D E Remarks RoHS With guideposts Without guideposts Note 1 The crosshatched area inside the SMT land may come into contact with the connector contacts 2 3 Not required in products without guideposts. Do not mount a part other than this product in the area of. Doing so will prevent the engagement of this and the mating connector. 13

14 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections Receptacle without Ground Plate 2.5mm, 3mm stacking height FX1180SSV(**) FX11100SSV(**) FX11B80SSV(**) FX11B100SSV(**) ** ** ** 5775 ** Blank : Tray packaging (Without pickandplace tape) (21) : Embossed tape packaging (Without pickandplace tape) (22) : Embossed tape packaging (With pickandplace tape) Signal B C D E Remarks RoHS With guideposts Without guideposts Note 1 The crosshatched area inside the SMT land may come into contact with the connector contacts 2 Not required in products without guideposts. 14

15 FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections BEmbossed Carrier Tape Dimensions Header Receptacle Insertion Connector FX11L #60P/6SV FX11L #80P/8SV FX11L # 100P/10 SV FX11L # 0P/ SV FX11L #68PSV FX11L #92PSV FX11L # 116PSV FX11L # 140PSV FX11#60P/6SV FX11#80P/8SV FX11#100P/10SV FX11#80P SV FX11#100PSV FX11#60P/6SV0.5 FX11#80P/8SV0.5 FX11#100P/10SV0.5 FX11#80P SV0.5 FX11#100PSV0.5 B C D E F Note 1 : There is no polarity in terms of embossed tape packaging for this product. Note 2 : Left figure is representative of products with ground plates. Insertion Connector FX11L #60S/6SV FX11L #80S/8SV FX11L # 100S/10 SV FX11L # 0S/ SV FX11L #68SSV FX11L #92SSV FX11L # 116SSV FX11L # 140SSV FX11#60S/6SV FX11#80S/8SV FX11#100S/10SV FX11#80S SV FX11# 100SSV B C D E F Note 1 : There is no polarity in terms of embossed tape packaging for this product. Note 2 : Left figure is representative of products with ground plates. Reel Dimensions 15

16 Powered by TCPDF ( FX11 Series 0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm HighSpeed BoardtoBoard Connections BRecommended Temperature Profile Temperature (ç) ç 200ç (MX250ç) 220ç 0 (90 to 0 sec.) (60 sec. max.) Time(sec.) Preheating(150 to 200ç) Soldering (220ç min) Note : The temperature profile indicates the maximum temperature of the connector surfaces at the highest point from the PCB mounting surface. BWashing Conditions BConnector Handling Precautions 1. llowable Creepage Dimensions at Time of Mating [Stacking height : 2mm] The effective coupling length of this product is 0.55mm for the signal portion and the ground portion. The creepage of the header and receptacle at the time of mating should be within 0.mm of the completely coupled condition. HRS test conditions Test boardglass epoxy 60mm 35mm 1.6mm thick Solder method : Reflow Solder composition : Paste,96.5%Sn/ 3%g/ 0.5%Cu Metal mask : 0.15mm thick Reflow cycles : 2 cycles The temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Organic Solvent Washing Solvent Room temperature washing Heated washing IP(Isopropyl alcohol) Water Type Washing When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins. Be careful that parts are not left with moisture remaining on them. Washing Precautions Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed. [Stacking height : 2.5mm, 3mm] The effective coupling length of this product is 1mm for the signal portion and 0.9mm for the ground portion. The creepage of the header and receptacle at the time of mating should be within 0.4mm of the completely coupled condition. 2. Compatibility 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other. 3. Retension of Boards void the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors. 4. Solder Repair Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair. This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into consideration prior to connector washing. 5. Miscellaneous Note that excessive twisting while inserting or withdrawing connectors will cause damage. The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance. 263,Nakagawa Chuoh,TsuzukiKu,YokohamaShi 28540,JPN TEL: Fax: The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 11/2017. Contents are subject to change without notice for the purpose of improvements.

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