Large area cost-efficient electronics integration. Flexible Substrate Polytronische Systeme

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1 Large area cost-efficient electronics integration. Flexible Substrate Polytronische Systeme Institut Zuverlässigkeit und Mikrointegration Institutsteil München Karlheinz Bock for Hansastr. 27d, D Munich, Germany,

2 Outline Introduction Plastics Electronics manufactured in Roll to roll (reel to reel) Performance and Technology Integration Silicon does not sleep Micro-Systems in R2R Smart Plastics Outview Artist vision Source

3 Electronic Systems Packaging Technology Waves Through-Hole Wave Moore s Law Surface-Mount Wave System Volume a.u Area Array Wave HDI - Wave Packaging Gap Hetero System Integration Wave 10 NANO

4 Polymers basic material for future electronics & systems? substrates and interconnects transistors and ICs, memory sensors and aktuators MEMS Power - batteries and solar cells Displays, lighting, signage Packaging and housing Media connections - fluidics pneumatics... In-Line Processes Reel to Reel, or sheet Complete systems based on most-polymers pictures: FhG-IAP. FhG-IPMS, FhG-, Power Paper Ltd. Polytronic Systems

5 Flexible Substrates & Large Area? For production reasons Substrate handling, large volume, Material efficiency Add to existing production processes Free form factor for final product In-line integration in end product Surface integration The end product is to be flexible Reliable & Ruggedized, shatterproof Thin & rollable, Wearable & light weight, Artist view Journal

6 Summary of Process Targets for Large Area Electronics Small critical dimension (lithography) channel length high yield, higher integration scale better reproducibility small variation in FET performance good conductive wiring (thin metals) better interconnection antenna integration for wireless communication of ubiqitious systems (RFId, ambient intelligence)

7 What price... PrIntegrated Circuit Resolution of mass printing has to reach <10 μm (now 100μm), Registration has also to improve, but not so significantly as compared to resolution Material properties like conductivity and mobility have to improve by a factor of to be able to mass print electrically operational circuits Structurization accuracy (d structure / d roughness) has to improve by a factor of 100 Thickness of mass printed dielectric can only be reduced to <1μm if first two requirements are not reached, because of electrical and geometrical limitations.

Waferlevel HDI with integrated Thin (20µm) Si Chips and 5µm Cu routing High Density Interconnect Technology Processed layers : µm Metal 4 Ni contact pads 10 Dielectric 3 PI

8 Waferlevel HDI with integrated Thin (20µm) Si Chips and 5µm Cu routing High Density Interconnect Technology Processed layers : µm Metal 4 Ni contact pads 10 Dielectric 3 PI passivation 20 Metal 3 Cu routing 5 Dielectric 2 Polyimide 20 Metal 2 Cu routing 5 Dielectric 1 Polyimide 20 Metal 1 Ni contact pads 10 Separation Thermoplast 10 Mech. Carrier Si-Monitorwafer 520

9 Focus of Development coating process application field manufacturing solvent based polymer very low-cost Sensor networks wafer evaporation small molecules large area display driver digital processed end-user electronic sheets rolls

10 Dimensional Accuracy of Copper Patterning dimensional accuracy depends on - mask quality - resist process - etching process dependent on gap to next structure deviation [μm] after lithograpy after etching distance to next pattern [μm]

SHIFT - IST 507745 Smart High-Integration Flex Technologies Development of fine pitch substrates using R2R Subtractive and semiadditive processes developed

Semiadditive technique: Dry fotoresist DuPont MX5015, thickness 15μm Substrate: metallized polyimide tape with 1μm Cu Limit of pattern resolution corresponds

11 SHIFT - IST Smart High-Integration Flex Technologies Development of fine pitch substrates using R2R Subtractive and semiadditive processes developed Subtractive technique: Only for thin metal layers and/or regular pattern applicable Small single lines with large distance to next structure should be avoided Semiadditive technique: Dry fotoresist DuPont MX5015, thickness 15μm Substrate: metallized polyimide tape with 1μm Cu Limit of pattern resolution corresponds strongly to photoresist thickness with an aspect ratio of ca. 1 minimal lines and spaces of ca. 15μm 40μm pitch 30μm Semiadditive technique, Cu thickness ca. 6μm

via openings show contact between both layers SHIFT - IST 507745 Smart

12 Second conductor layer by screen printing Minimal lines and spaces of first Cu layer: 15μm Minimal lines and spaces of printed second layer: 200μm Also 50μm via openings show contact between both layers SHIFT - IST Smart High-Integration Flex Technologies screen printed lines crossing Cu lines test sheet 200x200 mm²

13 Reel-to-Reel Application Center - Equipment UV-Lithography UV exposure despooler mask alignment spooler dryer rinse resist strip rinse etch unit

14 Reel-to-Reel Application Center - Equipment

Summary: Reel-to-Reel Manufacturing of Polymer Electronics All Processes can be done from Roll to Roll UV-lithography, blading of OSC, gate isolation, screen print gate conductor, via and

15 Summary: Reel-to-Reel Manufacturing of Polymer Electronics All Processes can be done from Roll to Roll UV-lithography, blading of OSC, gate isolation, screen print gate conductor, via and interconnect Patterning Steps are done in stop&go with 200 mm steps multilayer dielectric printed via opened with solvent top wiring printed via polymer-fet gate conductor printed gate dielectric bladed semicond. polymer bladed substrate copper wet-etched

16 Automatised Test Equipment Reel-to-reel test equipped with software controlled pattern recognition and measurement Needle probe for device characterization with Keithley parameter analyzer (4 SMUs)

17 Dynamic Behavior of Polymer TFT Setup for measurement -V -V 20M 22M 100n 22M V Amplitude [db] Bode plot flexible OFET SD 40μm kHz 10kHz 100kHz 1MHz Frequency [Hz] process & device performance data see following presentation of G.Klink

Development of a polymer temperature sensor in Roll to Roll

Supply voltage (V) 53 52 51 50 49 48 20 40 60 80 100

material with positive and a material with negative

18 Development of a polymer temperature sensor in Roll to Roll Temperature threshold discrimination output 1 output 2 Supply voltage (V) Temperature ( C) - R 1 R 2 Sensor circuit + Selection of a material with positive and a material with negative temperature coefficient allows realisation of the temperature sensor R 2 R 1 -

Integration of Polymer Electronics to Systems

-0,0006x + 1,0083 92% 0 20 40 60 80 100 120

19 Integration of Polymer Electronics to Systems Antennae Logic Circuits etched copper Fused ROM for Memory printed silver 102% 100% 98% Encapsulation layout for a small scale integrated logic polymer circuit copper conductor tripped by current pulse 96% 94% y = -0,0006x + 1, % storage time 35 C/85%rH Measurement of transistor degradation in humid environment

20 Differential amplifier Interface to sensors Schematics Comparator Circuit Layout Polymer System Integration needs analog-digital interface for sensors Design, layout and processing finished, device in evaluation

21 Ultra Thin Silicon Technologies for Flexible Electronics very thin ICs down to 5μm high performance flexibel but brittle higher functionality on small area assembly effort advanced electronics applications

Development task: Eliminate standard pick

chips Smart Labels Billions of RFID tags

22 Research project BMBF-ASSEMBLE Today s situation: Smaller and Discrete devices smaller dies have to be handled in huge amounts and at extremely low costs Development task: Eliminate standard pick & place robotics and find new processes which allow self-assembly and self-interconnection of extremely small chips Smart Labels Billions of RFID tags at a price << 5 US cent would be necessary to enable single item tracking

23 Basic principle of a self-assembly process for small dies Surface patterning Dispense chip in droplet Selfalignment Selfinterconnection

24 Example: Self alignment of a thin test chip in liquid environment Chip dispensed within a droplet of water

Principle of mobile electrostatic carrier substrates Device wafer + _ Mobile electrostatic carrier Bipolar configuration: electrodes are charged oppositely

25 Principle of mobile electrostatic carrier substrates Device wafer + _ Mobile electrostatic carrier Bipolar configuration: electrodes are charged oppositely Electrostatic field remains active after disconnecting power supply Power supply 0, kv Electrostatic force between wafer and carrier: F = ε U 2 A / 8 d 2

Bumping process performed at 50 70 μm thin test wafers mobile

carrier Thin wafer on mobile-esc entering the printing machine,

26 Bumping process performed at μm thin test wafers mobile ESC Thin wafer with NiAu UBM attached onto mobile electrostatic carrier Thin wafer on mobile-esc entering the printing machine, Bumping process performed at in Berlin by R. Patzelt and D. Manessis

27 Solder ball bumping performed at 55 μm thin test wafers by means of mobile electrostatic carriers 55 μm mobile ESC Bumped wafer after solder reflow Solder balls: SnAgCu, diameter ca. 140 μm

SHIFT - IST 507745 Smart High-Integration Flex Technologies Reel-to-reel (R2R) assembly of thin chip FC

28 SHIFT - IST Smart High-Integration Flex Technologies Reel-to-reel (R2R) assembly of thin chip FC bond by use of ACA Up to now only partially bonded chips achieved backside view of a partially bonded chip

29 Chip on Cardboard: Contact to ultra-thin ICs Screen-printed antenna and IC contact

30 Printed Isoplanar Contacts on thin ICs (25μm) Chip 1 x 1 mm 2 Daisy Chain with 4 contacts Chip 2 x 2 mm 2 Chip 3 x 3 mm 2 Daisy Chain with 16 contacts Daisy Chain with 36 contacts

31 Polytronics Using Flexible Silicon ICs Full flexible solution with ultra thin silicon (20μm) Cost-effective manufacturing with reel-to-reel printing and die bonding

Receiver for the sensor data with RS232 Interface Energy harvester with energy store 13,56MHz mask

32 An Energy-Autarkic Micro Sensor System Energy-Autarkic Micro Sensor System Microcontroller with sensor Basestation Visualisation of the sensor data with a PC UV exposure Datatransmitter 868Mhz Receiver for the sensor data with RS232 Interface Energy harvester with energy store 13,56MHz mask alignment Realization of the sensor module in reel-to-reel despooler spooler technology and molding of the sensor

The measurement of temperature in an automotive

could be monitored during the operation and

33 The measurement of temperature in an automotive application Tire parameters: Temperature, rpm, inflation pressure, ID, age, heat dissipation, remaining service life The tire parameters could be monitored during the operation and warn the car driver if the driving safety is endangered

34 EL Displays, Lighting and Signage Anorganic electroluminescense material in polymer matrix RzR Screen-print (5 layers) Substrate: PET-Folie Mounted on acrylic glas panel

funktionality organic electronics Cost-effektiv Large area Polytronics Foil Sensors Data

35 Smart Plastic Integration of Peripherics with Electronics in Foils organic Displays Human Maschine Interface Data output Polymer Solar Cells Energy Anorganic Electronics (Si) High funktionality organic electronics Cost-effektiv Large area Polytronics Foil Sensors Data input Detection Bio-sensors Aktuator Layer Data output system funktions Ambient Intelligence

36 Biosystemintegration Micro Systems meets Life Sciences Polytronics Bio-Chip & Diagnostische Systeme, Lab-on-chip, Micro-Opto-Fluidic MOF, Plastik-MEMS Implantables, Bio-Compatible, Bio- Interfaces Health Care Sensors, Low Power Fluidics, Sensors, Micro Reactors MOF-structure Lifetronics - Tools & Components for Biology, Medicine & Pharmaceutics

37 Electrochemical electrodes: design CE Counter electrode WE Working electrode Electrodes on glas and plastic RE Reference electrode Design considerations: Area CE >> Area WE (pseudo) RE near WE

38 Low-Cost MEMS in R2R Lamination or web-coating or print Lithography (or printing or embossing) Printing Lamination or direct metal Printing or discrete Lamination Placement of discrete components FC discrete substrate Laser to open contacts and ports and to separate MEMS devices

39 Application: Complex Flexible System Integration and -assembly in Reel-to-Reel Solarcell Sensors - Actuators VCSEL LF Metal2 Inductance Resistor chips2 Capacitance batterie Opto-Waveguides Resistor HF chips1 Capacitance HF Metal1 Inductance Low-K substrate RF

40 Large area cost-efficient organic electronics integration Large-area multi-functional systems distributed over a large area connected in a network (sensor network), displays Wearable integrated in clothes and textiles Autarkic solar, energy scavenging Bio-medical diagnostics, bandages, implantables Low-cost systems : e.g. Disposables Smart Plastics

Processes for Flexible Electronic Systems

Processes for Flexible Electronic Systems Michael Feil Fraunhofer Institut feil@izm-m.fraunhofer.de Outline Introduction Single sheet versus reel-to-reel (R2R) Substrate materials R2R printing processes