Henkel solutions enabling printed electronics. Dr. Crystal Yang

Transcription

1 Henkel solutions enabling printed electronics Dr. Crystal Yang

2 Agenda 1. Introduction Henkel 2. Trends in Printed Electronics 3. Novel materials enabling Printed Electronics New high speed printable silver inks with very high conductivity New water based carbon ink for high speed printing New material set for 3D formed, in-molded electronics 4. Conclusions 2

3 Three Areas of Competence A global leader in Brands and Technologies Laundry and Home Care Cosmetics / Toiletries Adhesive Technologies 3

4 Adhesive Technologies Five market driven business segments AI AT AG AE AC Packaging and Consumer Goods Transport and Metal General Industry Electronics Consumer, Craftsmen and Building Leverage expertise, technology platforms, reach across SBUs 4

5 Henkel history in Printed Electronics > 30 years a global leader in material supply for printed electronics Conductive inks and coatings Silver, silver-plated copper, carbon and transparent conductive materials for various applications Shielding paints Nickel and Copper filled inks used for EMI shielding applications Blendable Resistive (PTC) inks Inks with silver / carbon / non conductive pigment blends for printed resistors, potentiometer and heating elements Electrode ink Silver / silverchloride based inks for electrodes in biosensors, ECG electrodes and transdermal drug delivery Dielectric inks UV-curable materials for dielectric layers Electroluminescent inks For light emitting layers in EL-lamps Transparent conductive inks AgNW or nag based inks 5

6 Trends that favour Printed Electronics Now > 2017 Flexible devices ITO as transparent electrode Printed, transparent electrodes 3D shaped electronics 3D MID Printed or formed 3D structures Security and identification Mainly Al etched technology High speed printed labels using conductive inks 6

7 Trends that favour Printed Electronic Now > 2015 Wearable (medical) sensors Non integrated sensors Integrated smart sensors in textile/wristband Smart grid / e-city Non communicating, non connected devices Energy harvesting & storage, smart sensors, heaters/coolers in every day life Which Henkel solutions are needed to support these trends and drive PE forward? 7

8 How to be successful in Printed Electronics? Having the right material is not enough to be successfull in PE Need to understand each step of the value chain for each application and work with key partners in the value chain Value chain for printed electronics Ink supply Substrate Adhesive Sensor design Sensor manufacturing Side electronics Integration in final application End user Components Design Printing Assembly Integration End user Henkel is working with and bringing together key partners in the complete value chain to maximise success rate 8

9 Agenda 1. Introduction Henkel 2. Trends in Printed Electronics 3. Novel materials enabling Printed Electronics New high speed printable silver inks with very high conductivity New water based carbon ink for high speed printing New material set for 3D formed, in-molded electronics 4. Conclusions 9

10 Product highlights: summary - overview Comparison between existing commercial Ag inks and new development products Material name Sheet resistance (mohm/sq@25µ m) PET PI Coverage 10µm Times bulk Ag resistivity % Resistance increase after double crease Comments Current commercial materials Electrodag 725A Electrodag 479SS , , Standard material for membrane switch Standard material for membrane switch New materials ECI , ECI1011 2,5 2,8 8,3 3-4 > 200 Highly conductive Super highly conductive 10

11 Detailed technical approach Flexibility on PET Double crease test: 1,8 kg rolled over creased foil (both sides) 4mm roll data: roll conductive tracks around 4mm cylinder (both sides) 11

12 Agenda 1. Introduction Henkel 2. Trends in Printed Electronics 3. Novel materials enabling Printed Electronics New high speed printable silver inks with very high conductivity New water based carbon ink for high speed printing New material set for 3D formed, in-molded electronics 4. Conclusions 12

13 NEW!!! ECI7005 Water based carbon ink for high speed printing Material properties Application technology Property WIK B Sheet resistance (Ohm/sq/25µm) Viscosity 15s-1) Solids (%) 36.5 Particle size analysis (D50, μm) 13.6 High speed flexo or rotogravure printing of flex substrates or textiles ph 7.7 Application example: humidity sensor (resistance of material changes when wet) Fully disposable system printed directly on textile (1-layer) 13

14 Agenda 1. Introduction Henkel 2. Trends in Printed Electronics 3. Novel materials enabling Printed Electronics New high speed printable silver inks with very high conductivity New water based carbon ink for high speed printing New material set for 3D formed, in-molded electronics 4. Conclusions 14

15 In-Mold Electronics Key applications for in-mold electronics Interior Automotive Consoles Appliance control panel Wearable applications Key drivers for implementation: Up to 70% weight reduction of control panel Up to 30% more cost efficient 15

16 In-Mold Electronics Typcial process flow (example of Tactotek)

17 In-Mold Electronics Material opportunities for building electronic circuit: 1. Formable silver ink (WIK A) 2. Formable UV-dielectric ink (WCP A) 3. Transparent conductor (ECI5005) 4. Protection layer for transparent conductor (ECI9001) 5. Conductive adhesive compatible with -56A or low melting solder paste (LM100) 6. Technomelt for protection of flex connector and PCB board 17

18 Conclusions Henkel has been providing solutions that enable printed electronics for > 30 years Henkel has a focus on printed electronics and offers complete material solutions to its customers Value chain is very well understood and key partnerships enable Henkel to be successful in printed electronics Novel materials have been developed to allow: Cost efficient and environmental friendly high speed printing of conductive circuits Thermoformed (and in-molded) electronic circuits 18

19 Thank you!