Fundamentals about RFID in contactless ISO-cards
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1 CARDTREX EUROPE, VIENNA, OCTOBER 2016 Fundamentals about RFID in contactless ISO-cards Uwe Adamczyk, VP Sales-EMEA
2 Content Base Technologies Working principle / physics behind Applications Available antenna & inlay technology Common silicon suppliers & silicon types SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 2
3 RFID Technologies in ISO Cards Base Technologies Pure Contactless Only RF interface Hybrid Technologies Combination of o c less & dual interface o c less & c less o RF powered components Dual Interface RF Interface & Contact Interface - Transit - Access Control - Closed Loop Payment - Open Loop Payment - eid / edl Combination of: - Access Control - Crowed Tracking - Closed loop payment - Open loop payment - Open Loop Payment - Transit - Access Control - eid Predominant Application Fields SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 3
4 Pure Contactless / Single Transponder Solutions RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 4
5 RF Frequencies in ISO Cards frequency (Hz) LF HF UHF card operating frequencies 125 KHz MHz MHz commercial market launch units per year 200mio. 1000mio. 50mio. volume trend SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 5
6 125 KHz Low Frequency (LF) basics about LF antennas turn copper wire coil inductive coupling common application enterprise Access Control but no WW standard for data transmission (all proprietary solutions) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 6
7 125 KHz Low Frequency (LF) antenna & PRELAM technology only wire wound antenna / air-coil PRELAM mainly PVC Typical PRELAM thickness 400 micron (allowing 60% / 40% PVC/PET card structure for composite cards) no thinner PRELAM possible, due to quite thick wire wound antenna) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 7
8 125 KHz Low Frequency common IC suppliers Atmel (former Temic) (T5577 read/write) EM Microelectronics (EM 4200 read-only // EM4450 read/write) NXP (Hitag-1 / Hitag-2 / Hitag-S) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 8
9 13.56 MHz High Frequency (HF) basics about HF antennas inductive coupling 4 7 turn coil common application transit / automatic fare collection (AFC) payment, open & closed loop egovernment (eid / epp / edl ) corporate access control hotel, leisure & entertainment world-wide standards: ISO ISO SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 9
10 13.56 MHz High Frequency (HF) antenna & PRELAM technology wire wound antenna / air-coil o high durability (++) o limited possibilities for antenna tuning (--) air-coil wire embedded antenna o high durability (CU wire (flexibility) / no bridge) (++) o precise antenna tuning via length & pitch (++) o high flexibility design / format changes (++) o low impact on card surface (++) o available on most substrates (PVC / PET-G / PC) (++) o Typical PRELAM thickness (module) 400 micro with migration towards 310 micron wire embedded SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 10
11 13.56 MHz High Frequency etched antenna (subtractive technology) o only on PET substrate adhesion challenges (--) o bridge as potential failure cause (--) o antenna tuning on batch level complicate (--) o antenna traces visible in card-print (--) o no module visibility (++) o lead time & set-up cost for customized formats (--) o low cost in high volume (++) o very thin inlay possible (direct die attach) (++) etched antenna bridge, required for etched, printed & additive HF antennas SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 11
12 13.56 MHz High Frequency printed antenna o high flexibility on substrate type (++) (even paper possible!) o very thin PRELAM possible (direct die attach) (++) o no module visibility (++) o high cost due to silver paste (--) o antenna tuning on batch level complicate (--) o bridge as potential failure cause (--) o durability of antenna tracks (--) printed antenna additive antenna (additive / galvanic technology) o high investment & set-up cost (--) o high flexibility on substrate type (++) o good RF-performance = low production UPH (--) o bridge as potential failure cause (--) o antenna tuning on batch level complicate (--) o no module visibility (++) o theoretically low cost per unit in (very) high volume (++) o very thin PRELAM possible (direct die attach) (++) additive antenna SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 12
13 13.56 MHz High Frequency (HF) common IC suppliers payment closed loop : Sony (Felica), NXP (Mifare- & SmartMX-Family) Infineon (SLE77- / SLE78-Family) payment open loop : Infineon (SLE77- / SLE78-Family), NXP (SmartMX-Family) Samsung (S3), ST (ST 23,31), Inside (MicroPass) transit / automatic fare collection: NXP (Mifare- & SmartMX-Family), Sony (Felica), ST (Calypso), Infineon (SLE66- / SLE77- / SLE78- / CIPURSE-Family) access control: NXP (Mifare-Family), Inside (PicoPass), Legic (prime / advant-family) eid (ISO card): NXP (SmartMX-Family), Infineon (SLE77- / SLE78-Family) ST (ST23- / ST31-Family) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 13
14 MHz Ultra High Frequency basics about UHF antennas dipole antennas EM backscatter (Electro Magnetic Waves) common application government ID toll collection parking access in leisure & entertainment crowd control future: secure access?? but no WW harmonized frequency: USA: 915 MHz (4W EIRP) EU: 869 MHz (0,5W / 2W ERP) Japan: MHz SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 14
15 MHz Ultra High Frequency (UHF) antenna & inlay technology etched Al antenna - solid PET inlay o low cost (++) o only on PET substrate (--) o lamination challenges due to PET substrate (--) o logistics / lead times for customized formats (--) o antenna traces in print (--) etched Al antenna - PET inlets o low cost (++) o fair lamination properties with small antennas (++) o easier logistics compared to solid PET inlay (++) o antenna traces in print (--) printed antenna o flexible on substrates (PVC, PC, PET-G) mono-block structure (++) o high cost due to silver paste (--) o no antenna traces in print (++) etched antenna PVC surrounding structure etched antenna inlet SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED printed antenna 18 October 2016 Page 15
16 MHz Ultra High Frequency additive antenna o High set-up cost (--) o different substrates (++) o logistics / lead times for customized formats (--) o in high volume competitive to etched antennas (++) o antenna traces in print (--) wire embedded antenna o relatively high cost (--) o antenna-design limitation (--) o different substrates (PVC, PC, Teslin, PET-G) (++) o no traces in print (++) o short lead times for customized formats (++) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 16
17 MHz Ultra High Frequency common IC suppliers Impinj (Monza family) NXP (UCODE family; new: UCODE DNA secure UHF!) Alien (Higgs family) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 17
18 Dual Interface Technology (13.56 MHz only!) RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 18
19 OVERVIEW DUAL-INTERFACE TECHNOLOGY Technologies Mill & Fill DIF PRELAM Inductive Coupling Direct Connect Interconnection Technologies Conductive Glue, Tape, Paste, Polymer Thermo Compression Bond (TC) None Soldering, TC-Bonding Antenna Technologies Embedded Wire Embedded Wire & Pad Etched Antenna Printed Antenna SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 19
20 MILL & FILL TECHNOLOGY Electrical interconnection Conductive tape (ACF) Conductive paste Conductive polymer module contact plate conductive media High volume process Available via most major vendors No supply chain restrictions Good electrical performance card body IC antenna Aging of interconnection & potential loss of RF interface Challenging process control SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 20
21 DIF-PRELAM TECHNOLOGY (DDI) Electrical / mechanical connection TC bonding Soldering Low cost on equipment side Very good RF performance High electrical reliability High quality optical card appearance Challenging implementation into card manufacturing process Requires good yield control on card manufacturing side SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 21
22 AUTOMATED SOLDERING PROCESS Electrical / mechanical connection Laser soldering Hot soldering High electrical reliability Very good RF performance High investment for equipment Relatively slow process SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 22
23 INDUCTIVE COUPLING TECHNOLOGY (CoM) Inductive coupling CoM antenna Low cost on equipment side Easy to implement by every card manufacturer High electrical reliability Cost & time savings in approval process (TA/LOA) High throughput & easy scalable CoM module back-side of CoM module CoM inlay Reduced RF performance Card durability (delamination) * Restricted art work / card design * Restricted supply chain (IP & business models) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED * Depending on inlay / antenna technology 18 October 2016 Page 23
24 COMMON ICs FOR DUAL INTERFACE APPLICATIONS Infineon: SLE77 / SLE78-Family (Solid Flash) NPX: SmartMX P5- / P60-Family (EEPROM; Flash-version coming) STM: ST21- / ST31-Family (EEPROM; Flash version coming) SAMSUNG: S3CT9KW (EEPROM) Inside Secure: Micropass 6323/6303 (EEPROM) SMARTRAC TECHNOLOGY GROUP ALL RIGHTS RESERVED 18 October 2016 Page 24
25 Hybrid Technologies (multiple ICs) RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 25
26 Dual-Frequency 125 KHz (LF) & MHz (HF) Migration of legacy access control systems from LF to HF Common inlay technologies: HF wire embedding / LF coil-winding HF coil winding / LF coil winding HF wire embedding / HF wire embedding RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 26
27 Dual-Interface MHz (HF) & 125 khz (LF) High end access control logical & physical (migration) (i.e. FIPS 201 CACC) Common inlay technologies: HF wire-embedding / LF air-coil RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 27
28 Dual-Frequency MHz (HF) & MHz (HF) combination of 2 technologies in 1 Card (e.g. employee ID card for access payment, etc.) even combinations on one antenna possible! further technologies (contact module embedding / 4-line embossing) possible! RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 28
29 Dual-Frequency MHz (HF) & 860/960 MHz (UHF) Future market for hotel, leisure & entertainment (i.e. tracking & payment; tracking & access; gated-access & building access) Common inlay technologies: HF wire embedding / UHF printed or etched HF air-coil / UHF printed or etched HF / UHF combo-card (today) HF / UHF dual-frequency IC (e.g. EM4423) (tomorrow) RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 29
30 Powered Components RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 30
31 13.56 MHz (HF) & MHz powered components Dual-Interface with Dynamic-CVV Dual-Interface with RF-powered LED RIGHTS RESERVED SMARTRAC TECHNOLOGY GROUP ALL 18 October 2016 Page 31
32 Thank you very much!
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