NATIONAL MICROELECTRONICS CENTRE (CNM) Microelectronics Institute of Barcelona (IMB) CNM-IMB Presentation

Transcription

1 NATIONAL MICROELECTRONICS CENTRE (CNM) Microelectronics Institute of Barcelona (IMB)

2 CNM Organisation Chart SPANISH COUNCIL FOR SCIENTIFIC RESEARCH (CSIC) Board of Trustees D+T Microelectrónica, A.I.E. NATIONAL MICROELECTRONICS CENTER (CNM) MICROELECTRONICS INTITUTE OF BARCELONA (IMB) MICROELECTRONICS INSTITUTE OF MADRID (IMM) MICROELECTRONICS INSTITUTE OF SEVILLA (IMSE) LARGE SCALE FACILITY (Integrated Clean Room)

3 CNM-IMB Organisation Chart Direction Vice-direction Management Departments Large Scale Facility Administration Micro-nanosystems Systems Integration Labs of Departaments Integrated Clean Room Technological Support Units General Services Maintenance

4 CNM-IMB STAFF (2006) Researchers 53 Students 44 Clean Room 32 Support Services 13 Management, Administration & General Services 23 Visitors 6 Total Budget: 7.5 M External Funding: 63 % External Funding Splitting: EU: 28% National: 49% Industry: 23%

5 External Funding Incomming (k ) Competitive Projects National Regional EU 1, ,275 2, ,308 3, Total Projects 2,325 3,616 4,166 Industrial Contracts 1,281 1,176 1,734 Total 3,606 4,792 5,900

6 Micro-nanosystems Department Silicon-based Micro and Nanotechnologies (MNS) Micro and Nano-devices (MND) Application Specific Micro and Nanosystems Development (DAE) Systems Integration Department CNM-IMB Research Lines Power Devices and Systems Integration (IDSP) Microelectronic Circuits and Systems Design and Packaging (DECSM) Biomedical Technologies, Devices and Systems (TDSB) Micro-Nanofabrication Facility (1,000m 2 expanding to 1,500m 2 Integrated Clean Room) Equipments, processes and technologies to deal with micro/nano-processes under an integrated approach

7 Biochemical System Characterisation Laboratory Impedance analyzer measurement equipment: Solartron 1260, impedance/gain-phase Analyzer (10μHz to 32MHz). Solartron 1294 Impedance interface (10 μhz to 1MHz),100 mohm to 100 Gohm, IEC601 safety for bio-impedance test on live subjects. Solartron WBB LF-Frequency Response Analyzer System (10μHz to 1Mhz). Potentiostats measurement equipment: Solartron 12608W Electrochemical and impedance analyzer System. (2A 200nA) Autolab PGstat10 A high voltage potentciostat/galvanostat ±1A,± 30V μautolabtype II ±80mA ±12V PalmSens handheld potentiostat

8 Power Devices and Systems Laboratory Static characterization of components: Source-measurement units (up to 1100V 10A) QS and HF CV measurement equipment (-200V/200V) Semiautomatic wafer probers with hot chuck (300ºC) Curve tracers (3300 V 400 A) Dynamic characterization of components: Specific measurement circuits for: Switching times Power switching losses Short-circuit characterization Gate driving characteristics ESD and surge characterization equipments Equipment for the design, development and characterization of power systems Multichip power modules fabrication facilities (reflow oven ) Probe cards fabrication equipment

9 Thermal Characterisation Laboratory Infrared Thermography measurement equipment: AGEMA Thermovision THV-900 Macroscopic lens 40º (Vision field: 73x46 mm) Microscopic lens (Vision field: 2x1 mm) Thermal conductivity measurement system K TH measurement of materials involved in power packages Internal Infrared Laser Deflection Technique (IIR-LD) Measurement of power devices internal temperature Measurement of free carrier concentration Liquid Crystal Thermography system (ThermVIEW) Surface temperature mapping using LCs Liquid crystals from 30 to 160ºC Spatial resolution up to 0.15 µm using ultra 20x zoom lens

10 Equipments: Advanced Packaging Laboratory Manual flip-chip and SMD mounting equipment DR. TRESKY Automatic flip-chip mounting equipment DATACON 2200PPS Screen Printing equipment for solder alloys deposition and serigraphy of different paste elements for chemical sensors Hot plate PMC 732 SERIES (Tmax=400ºC) Reflow furnace with vaccum capability ATV TECHNOLGIES Gmbh SRO702 (Tmax=450ºC) Techniques: Flip-chip mounting for MCM fabrication (applications with sensors, MEMS, power devices or low signal ICs) Power Modules assembly Deposition of solder paste and other materials by screen-printing

11 Integrated circuits and systems test laboratory Electrical and behavioral characterization of (micro)electronic circuits and systems. Spread range of applications: biomedical, sensors, RF communications, image capture and processing, Low frequency characterization Dynamic signal analyzer (up to 102KHz) Network/Spectrum Analyzer (10Hz to 500MHz) Multifunction synthesizer (0Hz to 600KHz, step 0.1Hz) RF applications characterization RF Spectrum Analyzer (9KHz to 2.9GHz) Vector Network analyzer (300KHz to 8GHz) Low Power Applications characterization Low noise current pre-amplifier Programmable current source (1nA to 100mA)

12 Physical Characterization Laboratory Physical characterisation Spreading Resistance measurement system Scanning Electron Microscope (SEM) Automatic polishing machine with multi-sample head Automatic polishing machine with two heads suitable for micro-sections Polishing machine for Spreading Resistance samples preparation Diamond saw 3 optical microscopes (with micro-measurement equipment, dark field, and interferential constant) Photomicroscope Plasma equipment for layer removal Probe system with submicron needles and Laser cutting facility Design + CAD Cadence IC package System package Mentor Analog/Mixed signal simulation Custom IC design High capacity circuit simulation Physical verification Physical optimization Static timing analysis Altera Quartus II Nios IP Synopsys System development tools Analogue simulation (Hspice) Front End and verification tools TCAD device and process simulation tools Ansys Ansys Multiphysics Flowmetrics Flowtherm Silvaco Suprem3 Athena Atlas Smart Spice

13 Electronic Systems Integration Service Prototypes production Capability of fabrication PCBs multilayer (4 layers) Through hole plating SMD/TH Components assembly Soldering Iron, De-soldering Tool, Pick and Place, Hot Air Rework Electronic Systems Design Service Development boards for embedded systems ARM, NIOS, ublaze Up to equivalent logic gates

14 The Large Scale Facility

15 Clean Room 1,000 m 2 House in house structure Class 10-10,000

16 Clean Room Equipment Thermal processes and CVD equipment Ion Implantation equipment Metallisation equipment Lithographic equipment (proximity and stepper) Nano-lithography (electron beam and nano-imprint) Focused Ion Beam (FIB) Dry etching equipment Wet etching and cleaning equipment In line test equipment Atomic force microscope

17 Technological Processes Wet and dry oxidations Ion implantation of B, P, As, N and Ar Diffusion (several ambients) CVD (Nitride, Polysilicon, Oxide, BPSG) Metallisation (Al-Si, Al-Cu, Al-Si-Cu, TaSi, Ti. Ni, Au, Pt) Polyimide Wet and dry etching Surface and bulk silicon micromachining Anodic bonding Packaging (Die bonding, Wire bonding, SMD, MCM-D) In line test (Ellipsometer, Optical interferometer, Profilemeter, Fourneedle probe) Lithography (Proximity, Step and repeat, Double side) Nanolithography (AFM, EB, nano-imprint, FIB)

18 Nanofabrication Laboratory Provide access to state-of-the art techniques for nanometer-scale fabrication and inspection Clean (class 100) Laboratory e-beam Nanolithography System (Leo Raith Elphy plus) Atomic Force Microsope (Nanoscope IV + Dimension 3100) Nanoimprint lithography (Obducat 4 NIL) Focused Ion Beam (ZEISS 1560XB (available since July 2006) All individual nanofabrication process steps are compatible with the CNM Clean Room Technologies

19 Technologies TECHNOLOGY TYPE CHARACTERISTICS APPLICATION CNM - CMOS CMOS 2 Poly - 2 Metals Analog / Digital CNM POWER Lateral and vertical DMOS Double Diffusion Power Devices SiC Power Diodes, JFETs, MOSFETs, MESFETs. High Temperature Sensors Planar and MESA Technology (2.0 µm) Power, High Temperature and Biomedical Devices CNM μsistems Si Sensors and Actuators Bulk and Surface micro-machining Microsystems CNM μsistems Pressure Sensors Piezo-resistive Low Pressure Measurements CNM - ISFET NMOS Floating Gate FETs Chemical Transducers MCM Si Substrates Active Substrates and flip-chip Multi-chip Modules CNM - TOI Si Integrated Optics Technology Dielectrics and Polymers Integrated Optical Components NANO-FABRICATION Si Nano-mechanical Structures Surface Nano-machining. Minimum feature size: 100nm Nano-mechanical and Nano-electromechanical Systems

20 Technological Support Electrical Characterisation Device Characterisation and parameter extraction (SPICE) Equipment maintenance and set up Production wafer parametric test Test structure design and characterisation New measurement techniques development Application specific system design and development (demonstrators) On-wafer electrical characterisation

21 Technological Support Design and CAD VHDL/Verilog to ASIC/FPGA: Modelling, simulation and synthesis of circuits, IPs and growing to systems on chip Support and training to users, purchases and general management of CAD CAD development for internal use Libraries and design kits development for internal and external technologies Management of external kits Back-end: P&R, delay extraction / backannotation and post layout functional and fault simulation

22 Facilities Expansion New Integrated Clean Room (Micro-Nano) 1,400 m 2 (End 2007) Clean Room Expansion Labs and Offices Building (1,400 m 2 )