CD40102BMS CD40103BMS CMOS 8-Stage Presettable Synchronous Down Counters

Transcription

1 December 1992 Features High Voltage Type (20V Rating) CD40102BMS: 2-Decade BCD Type CD40103BMS: 8-Bit Binary Type Synchronous or Asynchronous Preset Medium Speed Operation - f = 3.6MHz (Typ) at 10V Cascadable 100% Tested for uiescent Current at 20V Maximum Input Current of 1µA at 18V Over Full Package Temperature Range; 100nA at 18V and +25 o C Noise Margin (Over Full Package/Temperature Range) - 1V at = 5V - 2V at = 10V - 2.5V at = 15V Standardized Symmetrical Output Characteristics 5V, 10V and 15V Parametric Ratings Meets All Requirements of EDEC Tentative Standard No. 13B, Standard Specifications for Description of B Series CMOS Devices Applications Divide-By- N Counters Programmable Times Interrupt Timers Cycle/Program Counter Pinout CD40102BMS, CD40130BMS TOP VIEW EAR CARRY IN/ COUNTER ENABLE SYNCHRONOUS PRESET ENABLE CARRY OUT/ ZERO DETECT Description CD40102BMS CD40103BMS CMOS 8-Stage Presettable Synchronous Down Counters CD40102BMS and CD40103BMS consist of an 8-stage synchronous down counter with a single output which is active when the internal count is zero. The CD40102BMS is configured as two cascaded 4-bit BCD counters, and the CD40103BMS contains a single 8-bit binary counter. Each type has control inputs for enabling or disabling the clock, for clearing the counter to its maximum count, and for presetting the counter either synchronously or asynchronously. All control inputs and the CARRY-OUT/ZERO-DETECT output are active-low logic. In normal operation, the counter is decremented by one count on each positive transition of the. Counting is inhibited when the CARRY-IN/COUNTER ENABLE (/CE) inputs is high. The CARRY-OUT/ZERO-DETECT () output goes low when the count reaches zero if the /CE input is low, and remains low for one full clock period. When the SYNCHRONOUS PRESET-ENABLE () input is low, data at the AM input is clocked into the counter on the next positive clock transition regardless of the state of the /CE input. When the ASYNCHRONOUS PRESET- ENABLE () input is low, data at the AM inputs is asynchronously forced into the counter regardless of the state of the, /CE, or inputs. AM inputs 0-7 represent two 4-bit BCD words for the CD40102BMS and a single 8-bit binary word for the CD40103BMS. When the EAR () input is low, the counter is asynchronously cleared to its maximum count (99 10 for the CD40102BMS and for the CD40103BMS) regardless of the state of any other input. The precedence relationship between control inputs is indicated in the truth table. If all control inputs except /CE are high at the time of zero count, the counters will jump to the maximum count, giving a counting sequence of 100 or 256 clock pulses long. This causes the output to go low to enable the clock on each succeeding clock pulse. The CD40102BMS and CD40103BMS may be cascaded using the /CE input and the output, in either a synchronous or ripple mode as shown in Figures 16 and 17. The CD40102MS and CD40103BMS are supplied in these 16-lead outline packages: Braze Seal DIP *H4W H4X Frit Seal DIP *H1L H1F Ceramic Flatpack H6W *CD40102B Only CD40130B Only 8 9 ASYNCHRONOUS PRESET ENABLE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures INTERSIL or Copyright Intersil Corporation File Number 3351

2 Specifications CD40102BMS, CD40103BMS Absolute Maximum Ratings DC Supply Voltage Range, () V to +20V (Voltage Referenced to Terminals) Input Voltage Range, All Inputs V to +0.5V DC Input Current, Any One Input ±10mA Operating Temperature Range o C to +125 o C Package Types D, F, K, H Storage Temperature Range (TSTG) o C to +150 o C Lead Temperature (During Soldering) o C At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for 10s Maximum Reliability Information Thermal Resistance θ ja θ jc Ceramic DIP Package o C/W 20 o C/W Flatpack Package o C/W 20 o C/W Maximum Package Power Dissipation (PD) at +125 o C For T A = -55 o C to +100 o C (Package Type D, F, K) mW For T A = +100 o C to +125 o C (Package Type D, F, K)......Derate Linearity at 12mW/ o C to 200mW Device Dissipation per Output Transistor mW For T A = Full Package Temperature Range (All Package Types) unction Temperature o C TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A LIMITS PARAMETER SYMBOL CONDITIONS (NOTE 1) SUBGROUPS TEMPERATURE MIN MAX UNITS Supply Current IDD = 20V, VIN = or GND o C - 10 µa o C µa = 18V, VIN = or GND 3-55 o C - 10 µa Input Leakage Current IIL VIN = or GND = 20V o C na o C na = 18V 3-55 o C na Input Leakage Current IIH VIN = or GND = 20V o C na o C na = 18V 3-55 o C na Output Voltage VOL15 = 15V, No Load 1, 2, o C, +125 o C, -55 o C - 50 mv Output Voltage VOH15 = 15V, No Load (Note 3) 1, 2, o C, +125 o C, -55 o C V Output Current (Sink) IOL5 = 5V, VOUT = 0.4V o C ma Output Current (Sink) IOL10 = 10V, VOUT = 0.5V o C ma Output Current (Sink) IOL15 = 15V, VOUT = 1.5V o C ma Output Current (Source) IOH5A = 5V, VOUT = 4.6V o C ma Output Current (Source) IOH5B = 5V, VOUT = 2.5V o C ma Output Current (Source) IOH10 = 10V, VOUT = 9.5V o C ma Output Current (Source) IOH15 = 15V, VOUT = 13.5V o C ma N Threshold Voltage VNTH = 10V, ISS = -10µA o C V P Threshold Voltage VPTH = 0V, IDD = 10µA o C V Functional F = 2.8V, VIN = or GND o C VOH > VOL < V = 20V, VIN = or GND o C /2 /2 = 18V, VIN = or GND 8A +125 o C = 3V, VIN = or GND 8B -55 o C Input Voltage Low (Note 2) VIL = 5V, VOH > 4.5V, VOL < 0.5V 1, 2, o C, +125 o C, -55 o C V Input Voltage High (Note 2) Input Voltage Low (Note 2) Input Voltage High (Note 2) NOTES: VIH = 5V, VOH > 4.5V, VOL < 0.5V 1, 2, o C, +125 o C, -55 o C V VIL VIH = 15V, VOH > 13.5V, VOL < 1.5V = 15V, VOH > 13.5V, VOL < 1.5V 1. All voltages referenced to device GND, 100% testing being implemented. 2. Go/No Go test with limits applied to inputs. 1, 2, o C, +125 o C, -55 o C - 4 V 1, 2, o C, +125 o C, -55 o C 11 - V 3. For accuracy, voltage is measured differentially to. Limit is 0.050V max

3 Specifications CD40102BMS, CD40103BMS TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL CONDITIONS (NOTE 1, 2) Clock to Output Carry In/Counter Enable to Output Asynchronous Preset Enable to Output Clear to Output TPHL1 TPLH1 TPHL2 TPLH2 TPHL3 TPLH3 GROUP A SUBGROUPS TEMPERATURE MIN LIMITS MAX UNITS = 5V, VIN = or GND o C ns 10, o C, -55 o C ns = 5V, VIN = or GND o C ns 10, o C, -55 o C ns = 5V, VIN = or GND o C ns 10, o C, -55 o C ns TPLH4 = 5V, VIN = or GND o C ns 10, o C, -55 o C ns Transition Time TTHL = 5V, VIN = or GND o C ns TTLH 10, o C, -55 o C ns Maximum Clock Input F = 5V, VIN = or GND o C.7 - MHz Frequency 10, o C, -55 o C.52 - MHz NOTES: 1. = 50pF, RL = 200K, Input TR, TF < 20ns o C and +125 o C limits guaranteed, 100% testing being implemented. TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE MIN MAX UNITS Supply Current IDD = 5V, VIN = or GND 1, 2-55 o C, +25 o C - 5 µa +125 o C µa = 10V, VIN = or GND 1, 2-55 o C, +25 o C - 10 µa +125 o C µa = 15V, VIN = or GND 1, 2-55 o C, +25 o C - 10 µa +125 o C µa Output Voltage VOL = 5V, No Load 1, o C, +125 o C, - 50 mv -55 o C Output Voltage VOL = 10V, No Load 1, o C, +125 o C, -55 o C Output Voltage VOH = 5V, No Load 1, o C, +125 o C, -55 o C Output Voltage VOH = 10V, No Load 1, o C, +125 o C, -55 o C - 50 mv V V Output Current (Sink) IOL5 = 5V, VOUT = 0.4V 1, o C ma -55 o C ma Output Current (Sink) IOL10 = 10V, VOUT = 0.5V 1, o C ma -55 o C ma Output Current (Sink) IOL15 = 15V, VOUT = 1.5V 1, o C ma -55 o C ma Output Current (Source) IOH5A = 5V, VOUT = 4.6V 1, o C ma -55 o C ma Output Current (Source) IOH5B = 5V, VOUT = 2.5V 1, o C ma -55 o C ma

4 Specifications CD40102BMS, CD40103BMS TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE Output Current (Source) IOH10 = 10V, VOUT = 9.5V 1, o C ma -55 o C ma Output Current (Source) IOH15 =15V, VOUT = 13.5V 1, o C ma -55 o C ma Input Voltage Low VIL = 10V, VOH > 9V, VOL < 1V 1, o C, +125 o C, -55 o C - 3 V Input Voltage High VIH = 10V, VOH > 9V, VOL < 1V 1, o C, +125 o C, -55 o C Clock to Output Carry In/Counter Enable to Output Asynchronous Preset Enable to Output Clear to Output Transition Time Maximum Clock Input Frequency Minimum Setup Time Minimum /CE Setup Time Minimum Clock Pulse Width Minimum Pulse Width Minimum AM Setup Time (Synchronous Presetting) Minimum Removal Time Minimum Pulse Width TPHL1 TPLH1 TPHL2 TPLH2 TPHL3 TPLH3 7 - V = 10V 1, 2, o C ns = 15V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C ns TPLH4 = 10V 1, 2, o C ns = 15V 1, 2, o C ns TTHL1 = 10V 1, 2, o C ns TTLH1 = 15V 1, 2, o C - 80 ns F = 10V 1, o C MHz = 15V 1, o C MHz TSU = 5V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C ns TSU = 5V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C ns TW = 5V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C - 80 ns TW = 5V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C ns TSU = 5V 1, 2, o C ns = 10V 1, 2, o C - 80 ns = 15V 1, 2, o C - 60 ns TREM = 5V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C - 70 ns TW = 5V 1, 2, o C ns = 10V 1, 2, o C ns = 15V 1, 2, o C ns MIN LIMITS MAX UNITS

5 Specifications CD40102BMS, CD40103BMS TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE Input Capacitance N Any Input 1, o C pf NOTES: 1. All voltages referenced to device GND. 2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on initial design release and upon design changes which would affect these characteristics. 3. = 50pF, RL = 200K, Input TR, TF < 20ns. MIN LIMITS MAX UNITS TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE MIN MAX UNITS Supply Current IDD = 20V, VIN = or GND 1, o C - 25 µa N Threshold Voltage VNTH = 10V, ISS = -10µA 1, o C V N Threshold Voltage VTN = 10V, ISS = -10µA 1, o C - ±1 V Delta P Threshold Voltage VTP = 0V, IDD = 10µA 1, o C V P Threshold Voltage VTP = 0V, IDD = 10µA 1, o C - ±1 V Delta Functional F = 18V, VIN = or GND = 3V, VIN = or GND o C VOH > /2 Time TPHL TPLH NOTES: 1. All voltages referenced to device GND. 2. = 50pF, RL = 200K, Input TR, TF < 20ns. VOL < /2 = 5V 1, 2, 3, o C x +25 o C Limit 3. See Table 2 for +25 o C limit. 4. Read and Record V ns TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25 o C PARAMETER SYMBOL DELTA LIMIT Supply Current - MSI-2 IDD ± 1.0µA Output Current (Sink) IOL5 ± 20% x Pre-Test Reading Output Current (Source) IOH5A ± 20% x Pre-Test Reading TABLE 6. APPLICABLE SUBGROUPS CONFORMANCE GROUP MIL-STD-883 METHOD GROUP A SUBGROUPS READ AND RECORD Initial Test (Pre Burn-In) 100% , 7, 9 IDD, IOL5, IOH5A Interim Test 1 (Post Burn-In) 100% , 7, 9 IDD, IOL5, IOH5A Interim Test 2 (Post Burn-In) 100% , 7, 9 IDD, IOL5, IOH5A PDA (Note 1) 100% , 7, 9, Deltas Interim Test 3 (Post Burn-In) 100% , 7, 9 IDD, IOL5, IOH5A PDA (Note 1) 100% , 7, 9, Deltas Final Test 100% , 3, 8A, 8B, 10, 11 Group A Sample , 2, 3, 7, 8A, 8B, 9, 10, 11 Group B Subgroup B-5 Sample , 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11 Subgroup B-6 Sample , 7,

6 Specifications CD40102BMS, CD40103BMS CONFORMANCE GROUP TABLE 6. APPLICABLE SUBGROUPS (Continued) MIL-STD-883 METHOD GROUP A SUBGROUPS READ AND RECORD Group D Sample , 2, 3, 8A, 8B, 9 Subgroups 1, 2 3 NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2. TABLE 7. TOTAL DOSE IRRADIATION MIL-STD-883 TEST READ AND RECORD CONFORMANCE GROUPS METHOD PRE-IRRAD POST-IRRAD PRE-IRRAD POST-IRRAD Group E Subgroup , 7, 9 Table 4 1, 9 Table 4 TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS FUNCTION OPEN GROUND 9V ± -0.5V PART NUMBER CD40102BMS, CD40103BMS Static Burn-In , Note 1 Static Burn-In 2 Note 1 Dynamic Burn- In Note 1 Irradiation Note , 9-13, 15, 16 OSLLATOR 50kHz 25kHz - 3, 8, 15 2, , 4, 6, 11, 13 5, 7, 9, 10, 12 - NOTES: 1. Each pin except and GND will have a series resistor of 10K ± 5%, = 18V ± 0.5V 2. Each pin except and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures, = 10V ± 0.5V Functional Diagram /CE AM STAGE DOWN COUNTER 7 C0/ZD CD40102BMS, CD40103BMS

7 CD40102BMS, CD40103BMS Logic Diagrams LSD * 4 * 5 * 6 * 7 (MSB) A B TO FF1 - FF7 C * 2 * 15 * 9 * 1 FF3 FF1 FF2 FF3 TO FF1 - FF7 D * 3 /CE E MSD * 10 * 11 * 12 * 13 (MSB) A B C 14 CARRY OUT/ ZERO DETECT FF4 FF5 FF6 FF7 D E *ALL INPUTS ARE PROTECTED BY COS/MOS PROTECTION NETWORK FIGURE 1. LOGIC DIAGRAM FOR CD40102BMS

8 CD40102BMS, CD40103BMS Logic Diagrams (Continued) * 4 * 5 * 6 * 7 A B TO FF1 - FF7 C * 2 * 15 * 9 * 1 FF3 FF1 FF2 FF3 TO FF1 - FF7 D * 3 /CE E * 10 * 11 * 12 * 13 (MSB) A B C 14 CARRY OUT/ ZERO DETECT FF4 FF5 FF6 FF7 D E *ALL INPUTS ARE PROTECTED BY COS/MOS PROTECTION NETWORK FIGURE 2. LOGIC DIAGRAM FOR CD40103BMS

9 CD40102BMS, CD40103BMS TRUTH TABLE CONTROL INPUTS /CE PRESET MODE ACTION Synchronous Inhibit Counter Count Down* X Preset on next positive clock transition 1 0 X X Asynchronous Preset Asynchronously 0 X X X Clear to maximum count NOTES: 1. 0 = Low Level 1 = High Level X = Don t Care 2. Clock connected to clock input 3. Synchronous operation: changes occur on negative-to-positive clock transitions 4. AM inputs: CD40102BMS; MSD = 7, 6, 5, 4, (7 is MSB) LSD = 3, 2, 1, 0 (3 is MSB) CD40103BMS Binary; MBS = 7, LSB = 0 *At zero count, the counters will jump to the maximum count on the next clock transition to High Typical Performance Characteristics OUTPUT LOW (SINK) CURRENT (IOL) (ma) AMBIENT TEMPERATURE (T A ) = +25 o C GATE-TO-SOURCE VOLTAGE (VGS) = 15V 10V 5V OUTPUT LOW (SINK) CURRENT (IOL) (ma) AMBIENT TEMPERATURE (T A ) = +25 o C GATE-TO-SOURCE VOLTAGE (VGS) = 15V 10V 5V DRAIN-TO-SOURCE VOLTAGE (VDS) (V) FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT CHARACTERISTICS DRAIN-TO-SOURCE VOLTAGE (VDS) (V) FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT CHARACTERISTICS DRAIN-TO-SOURCE VOLTAGE (VDS) (V) AMBIENT TEMPERATURE (T A ) = +25 o C GATE-TO-SOURCE VOLTAGE (VGS) = -5V -10V -15V OUTPUT HIGH (SOURCE) CURRENT (IOH) (ma) DRAIN-TO-SOURCE VOLTAGE (VDS) (V) AMBIENT TEMPERATURE (T A ) = +25 o C GATE-TO-SOURCE VOLTAGE (VGS) = -5V -10V -15V OUTPUT HIGH (SOURCE) CURRENT (IOH) (ma) FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS

10 CD40102BMS, CD40103BMS Typical Performance Characteristics (Continued) TRANSITION TIME (tthl, ttlh) (ns) AMBIENT TEMPERATURE (T A ) = +25 o C SUPPLY VOLTAGE () = 5V LOAD CAPATANCE () (pf) 10V 15V FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF LOAD CAPATANCE PROPAGATION DELAY TIME (tphl, tplh) (ns) AMBIENT TEMPERATURE (T A ) = +25 o C SUPPLY VOLTAGE () = 5V 10V 15V LOAD CAPATANCE () (pf) FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNC- TION OF LOAD CAPATANCE ( TO ) MAXIMUM INPUT FREUENCY (f MAX) (MHz) AMBIENT TEMPERATURE (T A ) = 25 o C LOAD CAPATANCE () = 50pF SUPPLY VOLTAGE () (V) FIGURE 9. TYPICAL MAXIMUM INPUT FREUENCY AS A FUNCTION OF SUPPLY VOLTAGE POWER DISSIPATION /PACKAGE (PD) (µw) AMBIENT TEMPERATURE (T A ) = +25 o C tr, tf = 20ns RL = 200kΩ SUPPLY VOLTAGE () = 15V 10V 10V INPUT FREUENCY (fi) (khz) FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF FREUENCY 5V = 50pF = 15pF

11 CD40102BMS, CD40103BMS S D R TO GATING TO GATING FIGURE 11. DETAIL LOGIC DIAGRAM FOR FLIP-FLOPS, FF0 - FF7, USED IN LOGIC DIAGRAMS FOR CD40102BMS AND CD40103BMS K /CE CD40102BMS COUNT CD40103BMS COUNT FIGURE 12. TIMING DIAGRAM FOR CD40102BMS AND CD40103BMS

12 CD40102BMS, CD40103BMS 0 fout = fin (N + 1) 0 TIME-OUT /CE 2 /CE N N COUNT DOWN PRESET fin 7 fin FIGURE 13. DIVIDE-BY- N COUNTER FIGURE 14. PROGRAMMABLE TIMER 0 1 TO MICROPROCESSOR INTERRUPT LINE 2 /CE FROM MICROPROCESSOR DATA BUS EXT OSC PRESET TIMER (I/O COMMAND) FIGURE 15. MICROPROCESSOR INTERRUPT TIMER ENABLE /CE /CE /CE CD4071BMS* INPUT CASCADED OUTPUT *An output spike (160ns at = 5V) occurs whenever two or more devices are cascaded in the parallel-clocked mode because the clock-to-carry out delay is greater than the carry-in-to-carry out delay. This spike is eliminated by gating the output of the last device with the clock as shown. FIGURE 16. SYNCHRONOUS CASCADING ENABLE /CE /CE /CE CASCADED OUTPUT INPUT FIGURE 17. RIPPLE CASCADING

13 CD40102BMS, CD40103BMS Chip Dimensions and Pad Layouts CD40102BMS CD40103BMS Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11kÅ 14kÅ, AL. PASSIVATION: 10.4kÅ kÅ, Silane BOND PADS: inches X inches MIN DIE THICKNESS: inches inches All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop Melbourne, FL TEL: (321) FAX: (321) EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) FAX: (32) ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) FAX: (886)

14 This datasheet has been downloaded from: Datasheets for electronic components.