Challenges of Ultra-thin LGA Package for Fingerprint Sensors
|
|
|
- Sara Barnett
- 5 years ago
- Views:
Transcription
1 Challenges of Ultra-thin LGA Package for Fingerprint Sensors Jensen Tsai Deputy Director, SPIL
2 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
3 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
4 Beyond Pin and Key Wearable & IOT Cards Mobile Devices Automotive
5 Electronic Product Market Trend (CAGR) *(2014 Volume, 2018 Volume, 2014~2018 CAGR) Feature phone (505, 186, -22.0%) PC (135, 114, -6.4%) NB (157, 113, -6.4%) DVD (74, 56, -5.2%) 2018 Volume(M)Unit 6, ~ HDD (552, 637, 2.9%) Smartphone (1,361, 1,925, 9.1%) Tablet (260, 345, 7.3%) TV (202, 241, 3.6%) Automotive (87, 102, 3.8%) STB (216, 381, 12.0%) Wearable Device (19, 120, 58.5%) Network Infra C (21, 28, 6.0%) 0 Gaming (48, 50, 0.8%) C IOT (3,751, 12,775, 35.8%) CAGR(%) End Product CAGR% Major Product Category PKG Requirement Feature IoT/Wearable 35.8%/ 58.5% SMART Phone/Tablet 9.1%/7.3% Connectivity(WiFi, BT, NFC,.. ) MCU/ Memory/ Sensor/ PMIC AP & BB/LP memory/connectivity/ PMIC/ Finger Print Sensor ~ 60 Small Form & Ultra Thin PKG High Bandwidth I/O Small Form & Thin PKG Automotive 3.8% Infotainment / Entertainment High Reliability & Maturity PKG Source : Gartner
6 Fingerprint Sensor (FPS) Product Market Trend Source: Texas Instruments FPS is the most popular & CAGR increase biometric segment!
7 FPS Product Market Trend Estimate FPS in Mobile device, Units per device type, Source : IHS Source : IHS Mobile devices & Smart Cards segments have most significantly increase Fraud costs for payment cards have 5X increase 2002~2014
8 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
9 Ultra-thin LGA Package Challenges 1 Low Mold Clearance & Tolerance 4 Color Coating & Singulation 0.3mm Molding compound Chip Film Substrate 2 Low Wire Loop Height 3 Ultra-Thin Molding Thickness & Warpage Thin (0.3mm), Low mold cleanrance, coating and package shape are the challenges!
10 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
11 Thin Mold Clearance Top view EMC Mold Clearance Wire Loop (<30) SBT 90um 70um 50um 40um Mold Clearance 90um 70um 50um 40um Meet different mold clearance requirement, min mold clearance 40um!
12 Mold Clearance Measurement Measurement timing Measurement Method Top sensor sample Wire bond ~ Molding ~ 1 st meas. 2 nd meas. Marking Bottom sensor Before Molding A After Molding B Measurement Deviation Tool Thickness(um) Sample1 Sample2 Sample3 Thickness (B-A) SEM (X-section) Deviation (um) Mold clearance = B - A The measurement deviation can reduce to less than 4um
13 Mold Clearance (um) Mold Clearance Tolerance Control Clearance measurement Measurement Method :X-section Location:9 points / Strip POR Step 1 Step 2 Molding parameter optimization New mold Tooling Design Test1 Test2 lot1 lot2 lot3 lot4 lot5 lot6 Lot_ Lot Optimize molding parameter & tooling design to meet low tolerance.
14 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
15 Low Wire Loop Height Reverse Bond Ball Bond Item Catalog Illustration Au wire diameter Min Loop height 15.2um (0.6 mils) 25um Loop height deviation +/-5um Bond on pad Normal bond Reverse bond Reverse Bond X-section The Gap Between Wire and Die Surface Reverse bond is used to achieve low wire loop height.
16 Low Wire Loop Height Control Loop Height Action Cpk (Before) Cpk (After) As is To be 55±10um W/B recipe Fine-tune ±10um W/B recipe Fine-tune ±5um W/B recipe Fine-tune After recipe fine-tune, achieve low wire loop height (55, 35, 25um) & stable!!
17 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
18 Warpage (mm) Warpage Warpage Simulation Warpage Simulation Inputs Leg Leg 1 Leg 2 Leg 3 Mold Thickness A 1.2A 1.2A Die Thickness B 1.3B B Substrate Thickness C C 0.7C Warpage Simulation Warpage Measurement Leg 1 Leg 2 Leg 3 Leg 1 Leg 2 Leg 3 Thick Mold, Thin Die and thin Substrate (Leg3) has the lowest warpage.
19 Warpage Warpage Post Molding Inputs Leg Molding Compound Type Compound-1 Compound-1 Compound-2 Compound-2 Compound-2 Compound-2 Mold Thickness Thick (1.2A) Thin (A) Thick (1.2A) Thin (A) Thick (1.2A) Thin (A) Substrate Thickness Thin(0.7C) Thick (C) Thin(0.7C) Thick (C) Thin(0.7C) Thick (C) Actual Sample Measurement Leg1 Leg2 Leg3 Leg4 Leg5 Leg6 Mold Type Compound-1 Compound-2 Compound-3 Mold Thickness Thick Thin Thick Thin Thick Thin Substrate Thickness Thin Thick Thin Thick Thin Thick Molding compound type also is a key parameter for warpage performance.
20 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
21 Color Coating Process Coating Process Flow Die Bond Wire bond Molding Coating Singulation Coating-1 (base layer) Curing-1 Coating-2 (color layer) Curing-2 Coating Results (Photo) Molding Compound type also is a key parameter for warpage performance.
22 Top Layer thickness (um) Coating Hardness Control 2Layer coating Topcoat: Protect layer (Clear) Color paint 3Layer coating Topcoat: Protect layer (Clear) Midcoat: Color paint Basecoat Measurement positions Die Die SBT SBT Hardness measurement 4H 5H 2Layer-1 2Layer-2 3Layer-1 3Layer-2 Top layer stack-up is the key parameter for Hardness!!
23 Glossiness (GU) Coating Glossiness Control Topcoat: Protect layer (Clear) Midcoat:Color(Red) Basecoat : Color paint(white) Die SBT Glossiness vs. Top Layer Thickness Thin Top Layer Thickness Thick Top layer thickness is the key parameter for Glossiness!!
24 Laser Cutting Process Assembly Process Flow Die Lapping/Singulation Molding Die bond Marking Wire bond Laser cutting Laser Cutting Process Flow Loader (Strip in) CCD Alignment Laser cutting Unload (unit out) laser Machine Capability: Tolerance Capability : +/-30um UPH: Laser Cutting 1200 pcs/hour has good accuracy!!
25 Laser Cutting Results Appearance Top view: No Residue Outline Dimension Item Outline-X Outline-Y Shift-X Shift-Y Cpk Side view: Smooth and no Peeling Per Data collection result, Laser Cutting can achieve criteria with good Cpk!
26 Laser Residue Cleaning Water With chemical Sample#1 Sample#2 Sample#3 Before Cleaning Post Cleaning Judgment Reject PASS PASS PASS Laser residues could be cleaned with chemical!
27 Color Coating Sample Build Results Coating test Color Glossiness Glossiness Hardness Reflow*1 Adhesion UV Resist (GU) High White 5H Matte High Black 5H Matte High Grey 5H Matte PASS PASS Class2 PASS High Yellow 5H Matte High Blue 5H Matte High Red 5H Matte Laser Cut Appearance Chipping Final Judgment PASS PASS Accept Photo White (matte) Black (matte) Red (matte) White (high glossiness) Black (high glossiness) All samples meet Coating and Laser cutting Criteria Red (high glossiness)
28 Outline Background Package Features & Challenges Challenges & Solutions Mold Clearance Low Wire Loop Height Warpage Post Molding Coating & Singulaiton Reliability Test Results Summary
29 Reliability - Package Level Test conditions Read point SAT Function Test MSL3 + 3x reflow PASS (231/231) PASS (231/231) Ta = 130 C / 85% RH PASS PASS uhast 96 hours PreCon MSL3+ 3x reflow (231/231) (231/231) 192 hours PASS PASS (231/231) (231/231) MSL3 + 3x reflow PASS (231/231) PASS (231/231) TCT Ta = -55 to 125 C PASS PASS 500 cycles PreCon MSL3 + 3x reflow (231/231) (231/231) 1000 cycles PASS PASS (231/231) (231/231) HTSL Ta = 150 C 500 hours PASS PASS (231/231) (231/231) 1000 hours PASS PASS (231/231) (231/231) Package Level Reliability Test PASS
30 Reliability Drop Test & Bending Test Drop test Bending test Test Method Stainless Steel Ball, 25g Package Lot Lot-1 Lot-2 Lot-1 Lot-2 Sample Size Function Test SAT Inspection Pass Pass Pass Pass Pass Pass Pass Pass Both Bending test & Drop test are Pass
31 Summary Ultra-thin LGA FPS Key Challenges and Solutions Mold Clearance & Tolerance mold parameter & tooling design optimization Low Wire Loop Height Revised bond & WB recipe fine tune Ultra Thin Mold THK & Warpage Package construction & Compound selection Color coating Process & layers optimization Singulation Laser cutting to approach shape form & control Base on sample build & Reliability test data, Ultra-thin LGA FPS is a feasible and reliable package type!
32 Solution Providing Innovative Leader Contact Information:
Innovative Embedded Technologies to Enable Thinner IoT/Wearable/Mobile Devices
Innovative Embedded Technologies to Enable Thinner IoT/Wearable/Mobile Devices Jensen Tsai Deputy Director, SPIL Building a Smarter World Wearable Internet of Things Building a Smarter World Mobile Devices
Interconnection Challenge in Wire Bonding Ag alloy wire. Jensen Tsai / 蔡瀛洲, SPIL, Taiwan
1 Interconnection Challenge in Wire Bonding Ag alloy wire Jensen Tsai / 蔡瀛洲, SPIL, Taiwan 2 Content Ag Alloy Wire Type Market Ag Alloy Wire Benefits Workability and Reliability Performance IMC behavior
Stack Die CSP Interconnect Challenges Flynn Carson, Glenn Narvaez, HC Choi, and DW Son ChipPAC, Inc.
Stack Die CSP Interconnect Challenges Flynn Carson, Glenn Narvaez, HC Choi, and DW Son ChipPAC, Inc. IEEE/CPMT Seminar Overview 4 Stacked die Chip Scale Packages (CSPs) enable more device functionality
Image Sensor Advanced Package Solution. Prepared by : JL Huang & KingPak RD division
Image Sensor Advanced Package Solution Prepared by : JL Huang & KingPak RD division Contents CMOS image sensor marketing overview Comparison between different type of CMOS image sensor package Overview
Innovations Push Package-on-Package Into New Markets. Flynn Carson. STATS ChipPAC Inc Kato Rd Fremont, CA 94538
Innovations Push Package-on-Package Into New Markets by Flynn Carson STATS ChipPAC Inc. 47400 Kato Rd Fremont, CA 94538 Copyright 2010. Reprinted from Semiconductor International, April 2010. By choosing
Advances in stacked-die packaging
pg.10-15-carson-art 16/6/03 4:12 pm Page 1 The stacking of die within IC packages, primarily Chip Scale Packages (CSP) Ball Grid Arrays (BGAs) has evolved rapidly over the last few years. The now standard
MICROELECTRONICS ASSSEMBLY TECHNOLOGIES. The QFN Platform as a Chip Packaging Foundation
West Coast Luncheon January 15, 2014. PROMEX PROMEX INDUSTRIES INC. MICROELECTRONICS ASSSEMBLY TECHNOLOGIES The QFN Platform as a Chip Packaging Foundation 3075 Oakmead Village Drive Santa Clara CA Ɩ 95051
TN008. PCB Design Guidelines for 2x2 LGA Sensors. Introduction. 2x2 LGA Package Marking
PCB Design Guidelines for 2x2 LGA Sensors Introduction This technical note is intended to provide information about Kionix s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts.
SESUB - Its Leadership In Embedded Die Packaging Technology
SESUB - Its Leadership In Embedded Die Packaging Technology Sip Conference China 2018 TDK Corporation ECBC, PAF, SESUB BU Kofu, Japan October 17, 2018 Contents SESUB Introduction SESUB Process SESUB Quality
Application Bulletin 240
Application Bulletin 240 Design Consideration CUSTOM CAPABILITIES Standard PC board fabrication flexibility allows for various component orientations, mounting features, and interconnect schemes. The starting
TN019. PCB Design Guidelines for 3x2.5 LGA Sensors Revised. Introduction. Package Marking
PCB Design Guidelines for 3x2.5 LGA Sensors Revised Introduction This technical note is intended to provide information about Kionix s 3 x 2.5 mm LGA packages and guidelines for developing PCB land pattern
Compression Molding. Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications
Compression Molding Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications 1. Company Introduction 2. Package Development Trend 3. Compression FFT Molding
Thinning of IC chips
1 Thinning of IC chips Annette Teng CORWIL TECHNOLOGY CORP. 1635 McCarthy Blvd. Milpitas, CA 95135 2 CONTENT Industry Demand for thinness Method to achieve ultrathin dies Mechanical testing of ultrathin
POSSUM TM Die Design as a Low Cost 3D Packaging Alternative
POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration
The Future of Packaging and Cu Wire Bonding Advances. Ivy Qin
The Future of Packaging and Cu Wire Bonding Advances Ivy Qin Introduction Semiconductors have been around for over 70 years Packaging is playing a more and more important role, providing low cost high
Min Tao, Ph. D, Ashok Prabhu, Akash Agrawal, Ilyas Mohammed, Ph. D, Bel Haba, Ph. D Oct , IWLPC
PACKAGE-ON-PACKAGE INTERCONNECT FOR FAN-OUT WAFER LEVEL PACKAGES Min Tao, Ph. D, Ashok Prabhu, Akash Agrawal, Ilyas Mohammed, Ph. D, Bel Haba, Ph. D Oct 18-20 2016, IWLPC 1 Outline Laminate to Fan-Out
TN016. PCB Design Guidelines for 5x5 DFN Sensors. Introduction. Package Marking
PCB Design Guidelines for 5x5 DFN Sensors Introduction This technical note is intended to provide information about Kionix s 5 x 5 mm DFN (non wettable flank, i.e. standard) packages and guidelines for
Two major features of this text
Two major features of this text Since explanatory materials are systematically made based on subject examination questions, preparation
ENGAT00000 to ENGAT00010
Wideband Fixed Attenuator Family, DIE, DC to 50 GHz ENGAT00000 / 00001 / 00002 / 00003 / 00004 / 00005 / 00006 / 00007 / 00008 / 00009 / 00010 Typical Applications ENGAT00000 to ENGAT00010 Features Space
Introduction of IMS Technology for Advanced Solder Bumping on Wafers / Laminates
Introduction of IMS Technology for Advanced Solder Bumping on Wafers / Laminates Science & Technology IBM Research Tokyo Yasumitsu Orii, PhD Senju Metal Industry Co.,TW Deputy General Manager Lewis Huang
Semiconductor and LED Markets. Jon Sabol Vice President and General Manager Semiconductor and LED Division
Semiconductor and LED Markets Jon Sabol Vice President and General Manager Semiconductor and LED Division Semiconductor & LED Investing in Semiconductor and LED $ Millions 300 200 27% CAGR 100 0 * FY06
Brief Introduction of Sigurd IC package Assembly
Brief Introduction of Sigurd IC package Assembly Content Package Development Trend Product Brief Sawing type QFN Representative MEMS Product LGA Light Sensor Proximity Sensor High Yield Capability Low
AGC Glass Technology Solution to Highly Functional Display Needs
AGC Glass Technology Solution to Highly Functional Display Needs Takahiro IKEZAKI Vice President Electronics Glass General Division, AGC Electronics, Asahi Glass Co., Ltd. June 5, 2012 -Contents- AGC Strengths
QUALIFICATION PLAN PCN #: IIRA-05BPMD768. Date: Dec 18, Qualification of 132L DQFN package at ANAC assembly site. A.
QUALIFICATION PLAN PCN #: IIRA-05BPMD768 Date: Dec 18, 2013 Qualification of 132L DQFN package at ANAC assembly site. Distribution Surasit P. Rangsun K A. Navarro Irina K Wichai K. Fernando C Chaweng W.
APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS
Keywords: OLGA, SMT, PCB design APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Abstract: This application note discusses Maxim Integrated s OLGA and provides the PCB design and
Ultra-thin Die Characterization for Stack-die Packaging
Ultra-thin Die Characterization for Stack-die Packaging Wei Sun, W.H. Zhu, F.X. Che, C.K. Wang, Anthony Y.S. Sun and H.B. Tan United Test & Assembly Center Ltd (UTAC) Packaging Analysis & Design Center
SiP packaging technology of intelligent sensor module. Tony li
SiP packaging technology of intelligent sensor module Tony li 2016.9 Contents What we can do with sensors Sensor market trend Challenges of sensor packaging SiP technology to overcome challenges Overview
MASW P. SURMOUNT PIN Diode Switch Element with Thermal Terminal. Features. Description. Ordering Information 2.
Features Specified Bandwidth: 45MHz 2.5GHz Useable 30MHz to 3.0GHz Low Loss 40dB High C.W. Incident Power, 50W at 500MHz High Input IP3, +66dBm @ 500MHz Unique Thermal Terminal for
MMIC GHz Quadrature Hybrid
MMIC 3.5-10GHz Quadrature Hybrid MQH-3R510 1 Device Overview 1.1 General Description The MQH-3R510 is a MMIC 3.5 GHz 10 GHz quadrature (90 ) hybrid. Wire bondable 50Ω terminations are available on-chip.
HANA Semiconductor (Ayutthaya) Co. Ltd. Die Design Rule For Assembly Of Plastic Devices
HANA Semiconductor (Ayutthaya) Co. Ltd. Die Design Rule For Assembly Of Plastic Devices 1.0 PURPOSE : 1.1 To define the rules to be observed to facilitate review of process ability of devices prior to
Industry trends are boosting Jet Printing. Nico Coenen Global Sales Director Jet Printing
Industry trends are boosting Jet Printing Nico Coenen Global Sales Director Jet Printing Agenda What is Jet Printing Market Overview Industry Trends Typical Applications 2 What is Jet Printing What is
Flexline - A Flexible Manufacturing Method for Wafer Level Packages (Extended Abstract)
Flexline - A Flexible Manufacturing Method for Wafer Level Packages (Extended Abstract) by Tom Strothmann, *Damien Pricolo, **Seung Wook Yoon, **Yaojian Lin STATS ChipPAC Inc.1711 W Greentree Drive Tempe,
INDUSTRIAL, ELECTRONIC & ELECTRICAL IDENTIFICATION. BradyID.com. High-performance solutions for Industrial ID, Wire & Cable ID, Product ID and more.
INDUSTRIAL, ELECTRONIC & ELECTRICAL IDENTIFICATION High-performance solutions for Industrial ID, Wire & Cable ID, Product ID and more. Materials Printer Compatibility Identification Material Improve processes
Most Reliable Component for Microwave. Data sheet Rev. 00 AM4311R38A0. Analog MEMS Microphone (Rear/ Bottom type)
Rev. 00 Most Reliable Component for Microwave AM4311R38A0 (Rear/ Bottom type) ` 3 Contents Page 1. Specification Revisions 2. Description and Application 3. Marking Numbering Standards 4. Part Numbering
A new approach to static electricity countermeasures
Advanced intelligent Sensors NEW ELECTROSTATIC SENSOR EF-SSERIES A new approach to static electricity countermeasures Measurement of surface potentials while a production line is running Phone: 8.894.42
RF circuit fabrication rules
RF circuit fabrication rules Content: Single layer (ref. page 4) No vias (ref. page 4) With riveted vias (ref. pages 4,5,6) With plated vias (ref. pages 4, 5,7,8,9,10,11) Component assembly (ref. pages
ic-lfh320 obga LFH1C PACKAGE SPECIFICATION
Rev A2, Page 1/6 PACKAGE VIEW RoHS compliant SIZE 5.0 mm x 5.0 mm drb_lfh1c-lfh320_0_pack_2, 5:1 PIN CONFIGURATION PIN FUNCTIONS (top view) No. Name Function Pixel #1 4 3 2 1 A B C D drc_lfh1c-lfh320_0_pack_3c,
FBTI Flexible Bumped Tape Interposer
FBTI Flexible Bumped Tape Interposer Development of FBTI (Flexible Bumped Tape Interposer) * * * * *2 Kazuhito Hikasa Toshiaki Amano Toshiya Hikami Kenichi Sugahara Naoyuki Toyoda CSPChip Size Package
Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling
Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling Ahne Oosterhof Eastwood Consulting Hillsboro, OR ABSTRACT Using modern laser systems for the depanelization of
SNT Package User's Guide
(Small outline Non-leaded Thin package) [Target Packages] SNT-4A SNT-6A SNT-6A (H) SNT-8A SNT Package User s Guide Introduction This manual describes the features, dimensions, mountability, reliability,
2.4 GHz SMD On-Ground Antenna
2.4 GHz SMD On-Ground Antenna Mads Sager Antenna Technology Manager Commercial Products Division Template 2.2 Featuring high performance levels and easy integration to satisfy the demands of the wireless
Wire Bond Technology The Great Debate: Ball vs. Wedge
Wire Bond Technology The Great Debate: Ball vs. Wedge Donald J. Beck, Applications Manager Alberto C. Perez, Hardware and Applications Engineer Palomar Technologies, Inc. 2728 Loker Avenue West Carlsbad,
General Rules for Bonding and Packaging
General Rules for Bonding and Packaging at the Else Kooi Laboratory 3 CONTENT Rules for assembly at EKL 4 Introduction to assembly 5 Rules for Saw Lane 7 Rules for Chip Size 8 Rules for Bondpads 9 Rules
GaAs MMIC Millimeter Wave Doubler. Description Package Green Status
GaAs MMIC Millimeter Wave Doubler MMD-2060L 1. Device Overview 1.1 General Description The MMD-2060L is a MMIC millimeter wave doubler fabricated with GaAs Schottky diodes. This operates over a guaranteed
The Advantages of Integrated MEMS to Enable the Internet of Moving Things
The Advantages of Integrated MEMS to Enable the Internet of Moving Things January 2018 The availability of contextual information regarding motion is transforming several consumer device applications.
MMIC 2-18GHz 90 Splitter / Combiner. Green Status. Refer to our website for a list of definitions for terminology presented in this table.
MMIC 2-18GHz 90 Splitter / Combiner MQS-0218 1 Device Overview 1.1 General Description The MQS-0218 is a MMIC 2GHz 18GHz 90 splitter/combiner. Wire bondable 50Ω terminations are available on-chip. Passive
Die Attach Adhesives for 3D Same-Sized Dies Stacked Packages
Die Attach Adhesives for 3D Same-Sized Dies Stacked Packages Toh CH, Mehta Gaurav, Tan Hua Hong and Ong Wilson PL United Test and Assembly Center (UTAC) 5 Serangoon North Ave 5, SINGAPORE 554916 ch_toh@sg.utacgroup.com
2x2 mm LGA Package Guidelines for Printed Circuit Board Design. Figure 1. 2x2 mm LGA package marking information.
2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern
Phone Camera Module AM-6GF8808-G ASUS P/N: VENDOR P/N: AM-6GF8808-G _ MARKING: GH _ RESOLUTION: 8M (3264X2448) VERSION: 08
Phone Camera Module AM-6GF8808-G ASUS P/N: 04080-00151800 VENDOR P/N: AM-6GF8808-G _ MARKING: 2-88080-0GH _ RESOLUTION: 8M (3264X2448) VERSION: 08 Version v.08 Issued on Aus. 7, 2017 0 Version Date of
Bob Willis Process Guides
What is a Printed Circuit Board Pad? What is a printed circuit board pad, it may sound like a dumb question but do you stop to think what it really does and how its size is defined and why? A printed circuit
2007 Final Summary of the bed wood finishes testing
2007 Final Summary of the bed wood finishes testing In the Summer of 2005 we began a test of 10 different wood finishes. The purpose was to get comparative test results of how well the finishes would last
Installation Precautions
Installation Precautions 1. Lead orming (1) Avoid bending the leads at the base and ensure that the leads are fixed in place. (2) Bend the leads at a point at least 2mm away from the base. (3) orm the
Processes for Flexible Electronic Systems
Processes for Flexible Electronic Systems Michael Feil Fraunhofer Institut feil@izm-m.fraunhofer.de Outline Introduction Single sheet versus reel-to-reel (R2R) Substrate materials R2R printing processes
TAIPRO Engineering. Speaker: M. Saint-Mard Managing director. TAIlored microsystem improving your PROduct
TAIPRO Engineering MEMS packaging is crucial for system performance and reliability Speaker: M. Saint-Mard Managing director TAIPRO ENGINEERING SA Michel Saint-Mard Administrateur délégué m.saintmard@taipro.be
Ultra Fine Pitch Printing of 0201m Components. Jens Katschke, Solutions Marketing Manager
Ultra Fine Pitch Printing of 0201m Components Jens Katschke, Solutions Marketing Manager Agenda Challenges in miniaturization 0201m SMT Assembly Component size and appearance Component trends & cooperation
Specification for UV LED
Specification for UV LED SA 3535 UV 1.5W maximum power capability High heat resistance substrate Dimension : 3.85 x 3.5 x 1.9 mm Lead-free reflow soldering application RoHS compliant Vendor Customer Written
EFFECTS OF USG CURRENT AND BONDING LOAD ON BONDING FORMATION IN QFN STACKED DIE PACKAGE. A. Jalar, S.A. Radzi and M.A.A. Hamid
Solid State Science and Technology, Vol. 16, No 2 (2008) 65-71 EFFECTS OF USG CURRENT AND BONDING LOAD ON BONDING FORMATION IN QFN STACKED DIE PACKAGE A. Jalar, S.A. Radzi and M.A.A. Hamid School of Applied
Hermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films
Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1 Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production
MicroSiP TM DC/DC Converters Fully Integrated Power Solutions
MicroSiP TM DC/DC Converters Fully Integrated Power Solutions PicoStar TM Christophe Vaucourt Thies Puchert, Udo Ottl, Frank Stepniak, Florian Feckl 1 Outline Illustrate TI s recent developments in the
Photonic device package design, assembly and encapsulation.
Photonic device package design, assembly and encapsulation. Abstract. A.Bos, E. Boschman Advanced Packaging Center. Duiven, The Netherlands Photonic devices like Optical transceivers, Solar cells, LED
Obducat NIL 6. Nanoimprinting with NRF s NIL 6
Obducat NIL 6 Substrates: pieces to 6 inch, hard or soft Thermal cure with PMMA, MR I 7010 etc Alignment to about 3 microns Temperature to 300 HC Pressure 15 to 80 bars Resolution < 50 nm possible Up to
MMIC 18-42GHz Quadrature Hybrid
MMIC 18-42GHz Quadrature Hybrid MQH-1842 1 Device Overview 1.1 General Description The MQH-1842 is a MMIC 18GHz 42 GHz quadrature (90 ) hybrid. Passive GaAs MMIC technology allows production of smaller
Packaging Roadmap: The impact of miniaturization. Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007
Packaging Roadmap: The impact of miniaturization Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007 The Challenges for the Next Decade Addressing the consumer experience using the converged
DC to 28 GHz, GaAs phemt MMIC Low Noise Amplifier HMC8401
FEATURES Output power for db compression (PdB):.5 dbm typical Saturated output power (PSAT): 9 dbm typical Gain:.5 db typical Noise figure:.5 db Output third-order intercept (IP3): 26 dbm typical Supply
Mobile Electrostatic Carrier (MEC) evaluation for a GaAs wafer backside manufacturing process
Mobile Electrostatic Carrier (MEC) evaluation for a GaAs wafer backside manufacturing process H.Stieglauer 1, J.Nösser 1, A.Miller 1, M.Lanz 1, D.Öttlin 1, G.Jonsson 1, D.Behammer 1, C.Landesberger 2,
DATASHEET. Features. Related Literature. Applications ISL9021A. 250mA Single LDO with Low I Q, Low Noise and High PSRR LDO
DATASHEET ISL9021A 250mA Single LDO with Low I Q, Low Noise and High PSRR LDO FN7845 Rev 3.00 The ISL9021A is a single LDO, which provides high performance, low input voltage and high PSRR. It delivers
High Isolation SP4T SWITCH
High Isolation SP4T SWITCH NJG1699MD7 GENERAL DESCRIPTION The NJG1699MD7 is a GaAs high isolation SP4T switch MMIC. It features low insertion loss and very high isolation. It has integrated DC blocking
Session 4: Mixed Signal RF
Sophia Antipolis October 5 th & 6 th 2005 Session 4: Mixed Signal RF Technology, Design and Manufacture of RF SiP Chris Barratt, Michel Beghin, Insight SiP Insight SiP Summary Introduction Definition of
SOLDER PASTE STENCIL MANUFACTURING METHODS AND THEIR IMPACT ON PRECISION AND ACCURACY
SOLDER PASTE STENCIL MANUFACTURING METHODS AND THEIR IMPACT ON PRECISION AND ACCURACY Ahne Oosterhof Oosterhof Consulting Hillsboro, OR, USA ahne@oosterhof.com Stephan Schmidt LPKF Laser & Electronics
How to use a Touch Up Bottle & Brush
How to use a Touch Up Bottle & Brush Tech Tips General Definitions Base Color (Basecoat): A color coat requiring a clear coat. Base Color provides color and appearance, while the clear coat provides gloss
GaAs phemt MMIC Low Noise Amplifier, 0.3 GHz to 20 GHz HMC1049
Data Sheet GaAs phemt MMIC Low Noise Amplifier,. GHz to GHz HMC9 FEATURES FUNCTIONAL BLOCK DIAGRAM Low noise figure:.7 db High gain: 6 db PdB output power: dbm Supply voltage: 7 V at 7 ma Output IP: 7
Chapter 7 Introduction to 3D Integration Technology using TSV
Chapter 7 Introduction to 3D Integration Technology using TSV Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Why 3D Integration An Exemplary TSV Process
Approval Sheet for SMD LED
Approval Sheet for SMD LED 1/ 13 Reference No : Version No : Rev Customer Name : Model Name : LPAOR-SO10 Color : Orange-Red Color Issued : 01 Feb. 2010 Customer CTL Eng ring Develop. Prod. QA Sales Approved
LeBen Semiconductor Inc. PRODUCTS. 216, Doha-ri Munbaek-myeon, Jincheon-gun, Chungcheongbuk-do, , KOREA http ://
LeBen Semiconductor Inc. PRODUCTS 216, Doha-ri Munbaek-myeon, Jincheon-gun, Chungcheongbuk-do, 365-861, KOREA http :// www.lebensemi.com Company Intoduction Company name : LeBen Semiconductor Inc. President
Product Change Notification - GBNG-14WQIZ459
Product Change Notification - GBNG-14WQIZ459 Date: 07 Sep 2018 Product Category: 8-bit Microcontrollers; Capacitive Touch Sensors Affected CPNs: Notification subject: CCB 3370.001 Initial Notice: Qualification
Handling, soldering & mounting instructions
Multiple inertial measurement units: Document revision 1.2 Document release date January 2018 Document number BST-MIS-HS000-01 Technical reference code Notes 0 273 141 134 0 273 141 221 0 273 141 365 0
RoHS. Specification CUN66A1A. Drawn Approval Approval. 서식 Rev: 00
Specification RoHS CUN66A1A SVC Customer Drawn Approval Approval 1 [ Contents ] 1. Description 2. Outline dimensions 3. Characteristics of CUN66A1A 4. Characteristic diagrams 5. Binning & Labeling 6. Reel
High Isolation GaAs MMIC Doubler
Page 1 The is a balanced MMIC doubler covering 16 to 48 GHz on the output. It features superior isolations and harmonic suppressions across a broad bandwidth in a highly miniaturized form factor. Accurate,
The Future of Packaging ~ Advanced System Integration
The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop June 2013 Product Segments End Market % Share Summary 2 New Product
Chip Assembly on MID (Molded Interconnect Device) A Path to Chip Modules with increased Functionality
T e c h n o l o g y Dr. Werner Hunziker Chip Assembly on MID (Molded Interconnect Device) A Path to Chip Modules with increased Functionality The MID (Molded Interconnect Device) technology enables the
MULTILAYER CERAMIC ANTENNA (LINEAR POLARIZATION MODE) FOR 400MHz~500MHz. Product Specification 1 (Preliminary)
MULTILAYER CERAMIC ANTENNA (LINEAR POLARIZATION MODE) FOR 400MHz~500MHz Product pecification 1 (Preliminary) QUICK REFERENCE DATA Working Frequency* Bandwidth Gain VWR Polarization Azimuth Impedance 400~500MHz
INTEVAC ODLC TM PROTECTION FOR DISPLAY COVER PANEL
INTEVAC ODLC TM PROTECTION FOR DISPLAY COVER PANEL Copyright 2017 Intevac, Inc. All Rights Reserved. 2017 Intevac, Inc. All rights reserved. No part of this paper may be reproduced or copied without prior
Features. = +25 C, 50 Ohm System, Vcc = 5V
Typical Applications Prescaler for DC to X Band PLL Applications: Satellite Communication Systems Fiber Optic Point-to-Point and Point-to-Multi-Point Radios VSAT Functional Diagram v4.9 Features DIVIDE-BY-8,
Innovative pcb solutions used in medical and other devices Made in Switzerland
Innovative pcb solutions used in medical and other devices Made in Switzerland Chocolate Watches Money.PCB`s innovative pcb`s... Customer = innovation driver Need to add more parts and I/O make smaller/thinner
Screen Making For Membrane Switches
Screen Making For Membrane Switches By Wolfgang Pfirrmann, KIWO Inc. Printing membrane switches requires skill and control over the process. This industry has set fairly tight quality standards in regard
Advanced High-Density Interconnection Technology
Advanced High-Density Interconnection Technology Osamu Nakao 1 This report introduces Fujikura s all-polyimide IVH (interstitial Via Hole)-multi-layer circuit boards and device-embedding technology. Employing
2 GHz to 30 GHz, GaAs, phemt, MMIC, Low Noise Amplifier HMC8402
2 GHz to 3 GHz, GaAs, phemt, MMIC, Low Noise Amplifier HMC842 FEATURES Output power for 1 db compression (P1dB): 21. dbm typical Saturated output power (PSAT): 22 dbm typical Gain: 13. db typical Noise
Advanced Embedded Packaging for Power Devices
2017 IEEE 67th Electronic Components and Technology Conference Advanced Embedded Packaging for Power Devices Naoki Hayashi, Miki Nakashima, Hiroshi Demachi, Shingo Nakamura, Tomoshige Chikai, Yukari Imaizumi,
The Smallest Form Factor GPS for Mobile Devices
2017 IEEE 67th Electronic Components and Technology Conference The Smallest Form Factor GPS for Mobile Devices Eb Andideh 1, Chuck Carpenter 2, Jason Steighner 2, Mike Yore 2, James Tung 1, Lynda Koerber
Freescale Semiconductor Data Sheet: Technical Data
Freescale Semiconductor Data Sheet: Technical Data Media Resistant and High Temperature Accuracy Integrated Silicon Sensor for Measuring Absolute, On-Chip Signal Conditioned, Temperature Compensated and
RoHS. Specification CUN06A1B. Drawn Approval Approval. 문서명 : 제품개발 (UV PKG) 절차서
Specification RoHS CUN06A1B SVC Customer Drawn Approval Approval [ Contents ] 1. Description 2. Outline dimensions 3. Characteristics of CUN06A1B 4. Characteristic diagrams 5. Binning & Labeling 6. Reel
DATA SHEET THIN-FILM CHIP RESISTORS TF 13 series, 0.1% TC25
DATA SHEET THIN-FILM CHIP RESISTORS TF 13 series, 0.1% TC25 10 Ω TO 1 MΩ Product Specification Jul 10, 2003 V.3 FEATURES High precision High long-tem stability Low temperature coefficient. APPLICATIONS
14 GHz to 32 GHz, GaAs, MMIC, Double Balanced Mixer HMC292A
14 GHz to 32 GHz, GaAs, MMIC, Double Balanced Mixer FEATURES Passive: no dc bias required Conversion loss (downconverter): 9 db typical at 14 GHz to 3 GHz Single-sideband noise figure: 11 db typical at
SBM-120-UV. Surface Mount Series. Ultraviolet LED. SBM-120-UV Product Datasheet. Features: Table of Contents. Applications:
SBM-120-UV Surface Mount Series Ultraviolet LED Features: Table of Contents General Considerations...2 Binning Structure...3 Part Numbering...4 Ordering Information...4 Optical and Electrical Characteristics...5
Product Qualification Report
Product Qualification Report Skyworks Part Number: SKY12145-315 Product Type: HIP3 Variable Attenuator for UMTS Base Stations Report No: Approved by: Product/Package Reliability: Tom Wood Prepared by Skyworks
Technical Data Sheet 0.39" Dual Digit SMD Displays
Features Packaged in tape and reel for SMT manufacturing. Design flexibility (common cathode or anode). Categorized for luminous intensity. The thickness is thinness than tradition display. Pb free. The
GaAs, phemt, MMIC, Power Amplifier, HMC1126. Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM APPLICATIONS GENERAL DESCRIPTION
Data Sheet GaAs, phemt, MMIC, Power Amplifier, GHz to GHz FEATURES FUNCTIONAL BLOCK DIAGRAM Output power for 1 db compression (P1dB): 1. db typical Saturated output power (PSAT): 1 dbm typical Gain: 11
Comparative Analyses between Bare Cu Wire and Palladium Coated Cu Wire Performance in IC Packaging Assembly
Comparative Analyses between Bare Cu Wire and Palladium Coated Cu Wire Performance in IC Packaging Assembly Dr. Jerome Palaganas NANOTECH Solutions, Inc. jerome@satech8.com ABSTRACT Cu wirebonding has
10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate
10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate Ming-Che Hsieh, Chi-Yuan Chen*, Ian Hsu*, Stanley Lin* and KeonTaek Kang** Product and Technology Marketing / STATS ChipPAC Pte. Ltd.
2 40 GHz Ultra-Wideband Amplifier
AMT217511 Rev. 1. January 28 2 4 GHz Ultra-Wideband Amplifier Features Frequency Range: 2-4 GHz 7±1. db Nominal Gain Input Return Loss > 1 db Output Return Loss > 1 db Reverse Isolation > 3dB 5 dbm Nominal