Industry trends are boosting Jet Printing. Nico Coenen Global Sales Director Jet Printing

Transcription

1 Industry trends are boosting Jet Printing Nico Coenen Global Sales Director Jet Printing

2 Agenda What is Jet Printing Market Overview Industry Trends Typical Applications 2

3 What is Jet Printing

4 What is Jet Printing? Jet Printing at high frequency while moving over the board at high speed Jet Print Head Solder paste and SMA (Surface Mount Adhesive) Dot volumes 5-20 nl Unique in the industry 4

5 5 Jet Printing solder paste

6 Jet printing 3 basic elements Print head MY600 Jet printer Software control 6

7 The print head in details The MY600 Cassette Cassette has ID chip and barcode on the cartridge The right paste for the right job Paste/glue within due date Low paste level warning Temperature control Maintains local paste temperature at 30 o C Closed system Low solder paste waste Environmentally friendly Cassette Holder Ejector Cartridge Filter box 7

8 The print head paste 8

9 Market overview

10 The electronics industry segments Total: 1,678 BUSD CAGR Geographic distribution Computer 490 BUSD 2.7% Communications 482 BUSD 3.1% Consumer 147 BUSD 3.5% Automotive 178 BUSD 6.5% Industrial/Medical 253 BUSD 5.8% Military/Aerospace 128 BUSD 2.8% Asia/ROW Americas Europe Japan Asia/ROW Americas Europe Japan Asia/ROW Americas 7% 5% 17% 14% 16% 4% Europe Japan 9% Asia/ROW Americas Europe Japan 16% 19% Asia/ROW 17% Americas Europe 28% Japan 5% Asia/ROW Americas Europe Japan 11% 19% 3% 34% 18% 29% 20% 50% 67% 57% 71% 66% Source and copyright: Prismark April

11 PCB assembly market Americas Americas 17% 16% China 45% 12% Europe China 45% 12% Europe 7% Japan 19% Asia/ROW Total: 86 BUSD -of which equipment: 5 BUSD 7% Japan 20% Asia/ROW Total: 112 BUSD Region CAGR Segments Americas 4.2% Industrial/Medical, Military/Aerospace, Infrastructure Europe 5.4% Industrial/Medical, Automotive, Infrastructure Japan 5.4% Automotive, Consumer Asia/ROW 6.5% Mobile, Consumer, Automotive China 5.4% Computer, Mobile, Consumer, Automotive Source and copyright: Prismark April

12 Market dynamics and trends Electronics products and effect on PCB assembly Decreasing cost for electronics Cost per placement Higher speed lines Higher utilization, quality & yield (DPMO, reject rates, etc.) Build to order Higher mix and shorter batches NPI turn around time Logistics and material handling Functionality increases and miniaturization More complex boards broad band PCBs Semicon assembly new packaging needs Higher accuracy Increasing safety and reliability requirements Higher quality & yield (DPMO, reject rates, etc.) Higher accuracy 12

13 Electronics Components To be mounted in PCB assembly Value, BUSD Billion Units Passives Discretes ICs ,314 10,401 9, , , CAGR Value Units Passives +5.0% +7.5% Discretes +3.8% +5.9% ICs +5.2% +5.9% Source and copyright: Prismark April

14 Array package pitch trends Excludes Small Die DCA, Display Driver and RF Modules Bn Units 70 (Excludes Small Die DCA, Display Drivers, and RF Modules) Kc bp-pitch trends 60 DCA in Module mm mm mm mm mm 1.27mm Note: Sub 0.5mm was 2% of overall volume in By 2018 this will increase to 28% or 19Bn units Source and copyright: Prismark April

15 Passive component size reduction Market Share 60% Kc bp-passive 50% % 30% 20% 10% 0805 and larger % Source and copyright: Prismark April Trn 2.2 Trn 4.5 Trn 8 Trn Units Units Units Units

16 PCBA & SCA slowly merging Accuracy / Quality SCA PCBA <1 µm 5µm 15µm Die packaging System packaging High-end SMT 35µm Traditional SMT 5000 cph Speed 16

17 Technology Trends

18 Strong technology trends drive need for new capabilities on equipment Stencil printers Technology drivers miniaturization mixing large and small components higher density boards 3D electronics and boards new semiconductor packaging new LED technology hybrid packaging/devices flexible boards Dispensers difficult to do everything on the board very slow, not cost effective accuracy is challenging 18

19 Opportunity for jet printing replacing both stencil printers and dispensers Examples 1. high-end electronics low to mid volume Stencil printer 2. high volume SMT smart phone board Stencil printer Dispensing Dispensing Stencil printer 3. semiconductor LED technology Dispensing Dispensing Dispensing Dispensing 19

20 Which stencil to use? Do I need to compromise? 20

21 21

22 perfect volume control mix small and large parts 22

23 3D print examples Each solder joint can be optimized for: solder paste volume, position, height, shape, pad coverage 23

24 Flexible & thin boards - Panels Board stretch and alignment Boards are aligned and any stretch is compensated for by using board fiducials Board warpage Laser height sensor maps board surface Control software ensures the the print head travels with constant jet height over the board 24

25 Jet printing challenging boards With jet printing, you can easily handle multi-level PCB s 25

26 Pin-in-paste Enough solder to cover the pins 26

27 Jet print on mounted boards Typical applications shielding and repair. Excellent position accuracy even at larger jet printing heights. Result depends on dot size and distance to board. 27

28 MY500 in high volume production (add-on) Use the jet printer after the screen printer to add volume or add solder paste to challenging board designs. No need for stepped stencils, special coating, preforms etc. Step 1. Screen print full board Step 2. Add volume with MY500 Step 1. Screen print all pads except cavities. Step 2. Jet print in the board cavities 28

29 Alpha confirms solder joint quality with add-on JP-500 jetted before and after Re-flow. 29

30 Industry trends Industry 4.0 Lights out factory 4the Industrial Revolution 30

31 Definition Industry 4.0 First programmable logic control system th Industrial revolution On the basis of cyber-physical production systems (CPPS), merging of real and virtual worlds Industry 4.0 First mechanical weaving loom 1784 First assembly line nd Industrial revolution trough introduction of mass production with the help of electrical energy 3rd Industrial revolution trough application of electronics and IT to further automate production Industry 3.0 Industry 2.0 Degree of complexity 1 st Industrial revolution trough introduction of mechanical production facilities with the help of water and steam power Industry 1.0 End of 18the century Beg. Of 20the century Beginning of 1970 Today 31

32 Smart Factory Cyber Physical Production Systems (CPPS) Internet of : Things Data Service People 32

33 How does Jet printing serve Industry 4.0 Electronics products and effect on PCB assembly Automation Automatic changeover possible without human intervention for lot size 1 Software driven Easy to communicate with other devices, programs received from engineers desk Closed Loop Integrated 2D inspection and repair 33

34 Conclusions Exciting times with 4the industrial revolution Industry trends pushes PCBA further Jet Printing will be part of this 34

35 Thank You