Semiconductor and LED Markets. Jon Sabol Vice President and General Manager Semiconductor and LED Division
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1 Semiconductor and LED Markets Jon Sabol Vice President and General Manager Semiconductor and LED Division
2 Semiconductor & LED Investing in Semiconductor and LED $ Millions % CAGR * FY06 FY07 FY08 FY09 FY10 FY11 FY12 FY13 Consumer Electronics Microfabrication Semiconductor & Components *FY13 per company guidance Semiconductor 3D packaging enables additional growth for ESI 2
3 Semiconductor & LED Emerging Technologies Targeting emerging 3D semiconductor & LED singulation markets Consumer requirements drive growth Semiconductor content in mobile devices LED general lighting Enabled by technology inflections Material changes, dimension shrinks, power requirements Addressable market growing to >$150M by
4 Semiconductor & LED Strong Foundation in Semiconductor Laser material interaction Strategic customer relationships Semiconductor fab knowledge Versatile semiconductor-class platform Proprietary lasers Semiconductor LED 4
5 Semiconductor & LED Focused on Promising Applications Consumer electronics drives demand for smaller and smarter Smaller and thinner semi packages Requires thinner wafers and complex materials Leading to 3D packaging Creating material processing challenges New opportunities for lasers to displace mechanical processes More Moore (Scaling) 1D: Few Materials & Structures 2D: Increasing Materials & Structures More than Moore (Dimensional Diversification) 3D Gate Structures, 3D doping, 3D nano-object integration 2.5D: Heterogeneous Lateral Integration, Low Density TSV 3D: Heterogeneous & Homogeneous Integration, High Density TSV, Chip Stacking 5
6 Semiconductor
7 Semiconductor Product Line Growing Need for Laser Processing CY2013 CY 2016 WW Semi $319B WW Semi $368B Sources: ESI Marketing, Gartner, IDC Forecast 7
8 Semiconductor Product Line Flexible Platform Addresses Multiple Applications 99XX Thin Film Scribing Package Micromachining Thin Wafer Dicing Enabling Advanced Semiconductor Packaging 8
9 Thin Film Scribing
10 Semiconductor Product Line Thin Film Scribing Enables Next Generation Films Enables singulation of advanced wafers Next generation materials drive need for advanced laser processes Damage & delamination issues Increased wafer size (450mm) challenges process speed One example is Low-k films Low-κ ILD Trend Solid Material Nano-porous Next Gen Delaminated Inter- Layer Dielectric Bulk Film k value Undoped SiO2 F-doped SiO2 1 st Gen low-k 2 nd Gen low-k Fragile Films 3 rd Gen low-k Next Gen Source: Microelectronics Engineering 87 (3), Source: ESI Marketing 10
11 Semiconductor Product Line Thin Film Scribing Market Segment Growth Wa afers (Millions) Next Gen Materials Current Low-κ Sources: Yole Thin Wafers Temporary Bonding Report 2012, ESI Marketing Next Generation Materials Drives Addressable Market of $25-40 Million 11
12 Semiconductor Product Line ESI Thin Film Scribing Technology Differentiation ESI Laser material expertise addressing complex material requirements High speed technology results in >2X processing speed Required for high volume manufacturing Partnering with industry leaders 35.0 Wafers per Hour >2x Typical Scribe Process ESI Proprietary Process mm 300mm 450mm 12
13 Package Micromachining
14 Semiconductor Product Line Multi-chip Packaging Enabled by Laser Singulation Evolution of Semiconductor Packaging Packaging Complex xities Fan-Out Wafer Level Packaging (FOWLP) Compound Material Processing 2.5D Silicon/Glass Interposers Dicing Debris Control timeframe D Multi-Chip Silicon Dicing & Compound Material Processing Laser Singulation Enables Compound Material Processing & Debris Control 14
15 Semiconductor Product Line ESI Package Micromachining Differentiation Interposer wafer processing Control debris Remove edge material Low thermal impact Process Flow Form wiring (RDL, TSV, µbumps) on Interposer Wafer Laser Dice Interposer Wafer Mount known good die on Interposer Wafer Mount 2.5D Interposer Chips to package substrate 9900 Differentiated Technology Enables Next Generation Applications 15
16 Semiconductor Product Line Package Micromachining Market Segment Growth Interpos ser Wafers (Millions) # of FOWLP Wafers # of Interposer Wafers Sources: Yole FOWLP & Embedded Die Report 2012, ESI Marketing Laser Processing of Chip Packages Grows to $15-30M Addressable Market 16
17 Thin Wafer Dicing
18 Semiconductor Product Line Thin Wafers Required for Advanced Packaging Memory & mobile requirements drive need for advanced packaging 64Gb + memory, form factor, power Advanced packaging enabled by thinner wafers Chip stacking, thermal control Lasers required to dice ultrathin wafers 9900 in evaluation with leading semiconductor customers 18
19 Semiconductor Product Line Ultrathin Wafer Adoption Drives Growth Wafers (Millions) >50um 30-49um <30um Sources: Yole Thin Wafers Temporary Bonding Report 2012, ESI Marketing Addressable Market Grows to $60-75 Million in
20 Semiconductor Product Line Laser Technology Enables Thin Wafer Adoption Thin wafer dicing a technology challenge Mechanical saw facing multiple issues Chipping, thin film delamination, large wafer CoO ESI 9900 enables ultrathin wafers Zero overlap processing, multi-step recipe control Run rate (wafers per hour) Technology Transition 18 WPH 1-2 WPH + chipping issues 23µm 23µm 100 µm 20 µm Wafer Thickness Yole Report: Thin Wafer Market and Applications Oct 2011 Thin Device wafers Diced with
21 Semiconductor Product Line Semiconductor Summary Emerging applications grow to $100M + 3D packaging market Versatile 9900 platform addresses multiple applications Thin Film Scribing Package Micromachining Thin Wafer Dicing Evaluations underway with leading manufacturers 21
22 High Brightness LED
23 LED Product Line LED Market Summary LED market remains in overcapacity Backlight saturated Industry shift, performance to cost Adoption of General Lighting critical to LED growth Packaging transitioning to advanced materials Laser singulation growth drivers Utilization increases New wafer and package materials ESI well positioned with strong portfolio of tools 23
24 LED Product Line LED Lighting Market CY2013 CY 2016 WW LED $26B WW LED $48B Sources: ESI Marketing, McKinsey, Display Search, Yole LED Laser Singulation Market Driven by Utilization and New Materials 24
25 LED Product Line Expanding Opportunity in LED Die Singulation General Lighting drives growth Volume Breakdown Per Technology Type LED lighting market $48B in CY Growth in VLED and Flip Chip creates new laser singulation opportunities LEDs Billions of Standard VLED Flip Chip Sources: ESI Marketing, Yole and Display Search 2012 Reports Capacity Adds for Equipment Resumes in
26 LED Product Line Expanding Opportunity in LED Package Singulation Packaged LED Volume in Billions of Packages Sources: ESI Marketing, Yole Packaging 2012 Reports General Lighting, High Power Thermal management, advanced packaging materials Packaging up to 50% of LED Cost Substrate material changes drive demand for laser singulation Thermal Management and Cost are Key Packaging Drivers 26
27 LED Product Line LED Summary Backlight saturated $/lumen vs lumens/watt General Lighting drives growth Customer validated solutions for die and package applications Large worldwide ESI installed base 27
28 Semiconductor & LED Investing in Emerging Technologies Innovation in Semiconductor and LED singulation Engaged with leading customers Focused on emerging technology requirements 28
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