Most Reliable Component for Microwave. Data sheet Rev. 00 AM4311R38A0. Analog MEMS Microphone (Rear/ Bottom type)

Transcription

1 Rev. 00 Most Reliable Component for Microwave AM4311R38A0 (Rear/ Bottom type) ` 3

2 Contents Page 1. Specification Revisions 2. Description and Application 3. Marking Numbering Standards 4. Part Numbering Standards 5. Mechanical Specification and recommended land pattern 6. Block diagram 7. Acoustic & Electrical Specification 8. Acoustic & Electrical Characteristic graph 9. Recommended Soldering Profile 10. Packaging Detail 11. Reliability Specifications of 14

3 1. Specification Revisions Table 1. Revision history. Rev Date Circuit Materials, Structure, etc of 14

4 2. Description and Application 2.1 Description Surface Mount Silicon Microphone Analog MEMS(Micro Electro Mechanical System) Microphone 2.2 Applications Electrical products : Smart phone, Feature phone, Note PC, Tablets, Camcorder, Digital camera, Hands-free, Bluetooth head-set, etc 3. Marking Numbering Standards 5 Laser marking AE03A Version Manufacturing week Manufacturing year Classification (Analog/Digital) Figure 1. marking code. Table 2. Marking numbering standard. No Code Description 1 A Type(Analog MEMS mic-a, Digital MEMS mic - B) 2 E Year (2010-A, 2011-B, 2012-C, 2013-D, 2014-E...) 3 03 Week (first week-01, Second week-02,...) 4 5 A Option of parts A : Embedded capacitor +No E.B, B : ASIC Rev. C : Multi hole D : Multi hole + waterproof coating E : D+ASIC Rev. F : Hole location mark 4 of 14

5 4. Part Numbering Standards 4-1. Part number A M 4311 R 38 A Figure 2. Part numbering code. Table 3. Part numbering standard. No Code Description 1 A Output (A : Analog, D : Digital PDM) 2 M Item (M : MEMS Microphone) Dimension (4311 : 3.76 x 2.95 x 1.1mm, 3310 : 3.50 x 2.65 x 0.98mm, ) 4 R Type (T : Front[Top], R : Rear [Zero Height]) 5 38 Sensitivity (38-38dB, 42-42dB, ) 6 A Option of parts A : Embedded capacitor +No E.B, B : ASIC Rev. C : Multi hole D : Multi hole + waterproof coating E : D+ASIC Rev. F : 7 0 Rev No. 1 : ASIC Rev. E.B : Environmental Barrier 5 of 14

6 5. Mechanical Specification and recommended land pattern Table 4. Dimension. ITEM DIEMENSION Unit WIDTH 2.95 ±0.05 mm LENGTH 3.76 ±0.05 mm AE03B 2 3 HEIGHT 1.10 ±0.10 mm ACOUSTIC PORT Φ 0.25 ± 0.05 mm 6 Table 5. Pin terminal configuration. Pin No. Function 1 V DD 2 GND 3 GND 4 OUTPUT 5 GND 6 GND Recommended Solder stencil pattern Recommended land pattern AP Acoustic Port Figure 3. Dimension. 6 of 14

7 6. Block Diagram MEMS Microphone Capacitor #1 V DD BIAS BIAS Charge Pump V REG Audio Input V out MICIN PRE AMP Output Capacitor #2 of system GND Transducer ASIC Figure 4. Block Diagram. Table 6. Specifications. No. Parts Function 1 Charge pump Supply of voltage 2 V REG (Voltage regulator) Voltage stabilization 3 Preamp Impedance matching 4 Capacitor #1 AC decoupling, Voltage stabilization 5 Capacitor #2 DC decoupling 7 of 14

8 7. Acoustic & Electrical Specification - Typical test conditions : TA=25±2, Humidity=65±5% (Room temperature & humidity) - Noise Measurement with A-weighting filter (IEC 651) Table 7. Specifications. No Parameter Symbol Condition Performance Limits Min Typ Max Unit 1 Directionality Omni-directional Sensitivity S 3 Sensitivity variation Freq= 1kHz, V DD = 2V Sound pressure level = 94dB SPL 94dB V DD Range : 1.5~3.6V dbv db 4 Signal to Noise Ratio SNR Summation : 20Hz~20kHz A-weighted db(a) 5 Equivalent Input Noise EIN A-weighted Dynamic Range 7 Total Harmonic Distortion THD Derived from EIN and max Acoustic Input 94dB SPL db(a) SPL Hz Hz kHz kHz % 110dB 1kHz % 115dB 1kHz % 120dB 1kHz % 8 Power Supply Rejection PSR Power Supply V DD = 2V, 100mVp-p with 217Hz Square wave Check the 217Hz level dbv 9 Operating Voltage V DD V DC 10 Current Consumption I S V DD = 2V μa Output Characteristics 11 Output Impedance Z out Freq= 1kHz, V DD = 2V Ω 12 Output DC Offset 0.7 V Note : See Figure 5 ~ 8 8 of 14

9 Delta Sensitivity [db] Current consumption [μa] Amplitude (dbv) AM4311R38A0 8. Acoustic & Electrical Characteristic graph Test condition Sensitivity Frequency response Self noise level V DD = 2V Freq= 1kHz Sound pressure level = 94dB SPL, Noise floor V DD = 2V A-weighted Frequency band = 20Hz ~ 20kHz (sum with A-weighted factor) Frequency (Hz) Figure 5. Frequency response & Noise floor curve. Test condition Current consumption V DD Range : 1.5~3.6V Current consumption Characteristic sensitivity V DD Range : 1.5~3.6V Freq= 1kHz Sound pressure level Sensitivity = 94dB SPL V DD [V] Figure 6. Operating Voltage vs Sensitivity. 9 of 14

10 Noise Level [ db V] AM4311R38A0 8. Acoustic & Electrical Characteristic graph Test condition THD vs Frequency Sound pressure level 1) 94dB SPL ; check the (315Hz, 500Hz, 1kHz, 2kHz) level 2) 115dB SPL ; check the 1kHz level 3) 120dB SPL Limitation of 120dB SPL Limitation of 115dB SPL Limitation of 94dB SPL ; check the 1kHz level Figure 7. THD vs Frequency graph. Test condition -40 RF noise immunity -50 Input signal = RF power -5dBm -60 Limitation with 217Hz -70 AM modulation (Depth 80%) -80 Method -90 : RF output power directly conducted at V DD pin -100 Frequency : MHz, 850MHz, 900MHz, 950MHz, 1GHz, 1.5GHz 1.8GHz, 1.9GHz, 2.1GHz Figure 8. RF noise immunity. 10 of 14

11 Temperature ( ) AM4311R38A0 9. Recommended Soldering Profile T T P L T SMAX Ramp up t P t L CRITICAL ZONE T L to TP T SMIN ts Pre-heat Ramp down t 25 to Peak TIME(sec) Figure 9. Soldering profile Limits. Table 8. Soldering Profile Limits. Profile Feature Symbol Condition (Pb-free) 1 Average Ramp Rate TL to TP 1.25 /sec maximum 2 Pre heat Minimum Temperature TSMIN 150 Maximum Temperature TSMAX 200 Time (TSMIN to TSMAX) ts 60 sec to 75 sec 3 Ramp up Rate TSMAX to TL 1.25 /sec 4 Time Maintained Above Liquidous tl ~50 sec Liquidous Temperature TL Peak Temperature TP /-5 6 Time within 5 of Actual Peak Temperature tp 20 sec to 30 sec 7 Ramp-Down Rate 3 /sec maximum 8 Time 25 (t25 )to Peak Temperature 5 minute maximum Note 1. Pre-heat, ramp up and ramp down conditions according to IPC/JEDEC J-STD-020D.1 2. Do not wash after reflow, this may damage the membrane of microphone 11 of 14

12 10. Packaging Detail Carrier tape Information (unit : mm) Figure 10. Carrier tape. 12 of 14

13 10. Packaging Detail Carrier tape Information (unit : mm) (Label ) AM4311R38B1AE03B PART NO : AM4311R38B1 SPECIFICATION : ANALOG MEMS MIC LOT NO : AE03B QTY : 5,000 EA VENDOR CODE : VENDOR NAME : PARTRON Note 1. MSL 2A (IPC/JEDEC J-STD-020C) 2. REEL DIAMETER : 330±1 mm 3. Quantity Per Reel : 5,000EA 4. Label : external package & reel Figure 11. Carrier tape & Reel Reel Information (unit : mm) Figure 12. Reel. 13 of 14

14 11. Reliability Specifications - Limitation : The change in sensitivity must be less than 3dB (V DD =2.0V ; Sensitivity at 1kHz) Table 9. Test condition. [Test was performed after a lapse of two hours.] Test 조건 - Precondition +85 /85% R.H., 120hr 3 reflow cycles (max. 260 ) 1 Temperature & Humidity Resistance +85 /85% R.H., 120 hours 2 Thermal Shock -40±2 (30 min.) +125 ±2 (30 min.), 300 cycles (JESD22-A106) 3 Low Temperature Resistance -40(-10/+0), 1,000 hours (JESD22-A119) 4 High Temperature Resistance +125(-0/+10), 1,000 hours (JESD22-A103) 5 Temperature Cycle 6 ESD -25±2 (30 min.) +20 ±2 (10 min.) + 70 ±2 (30min) +20 ±2 (10min.), 5 cycles HBM(Human Body Model) CDM(Charge Device Model) MM(Machine Model) 1000V or above (JESD22-A114) 500V or above (JESD22-C101) < 200V (Class A) (JESD22-A115) Contact to Lid(can) - GND : ~±8kV, 3discharges (IEC ) Contact to I/O Pin - GND : ~ ±2kV (MIL 883E, Method ) 7 UHAST +130 /85% R.H., 33.3 psi, 96 hours (JESD22-A118) 8 Vibration 4 cycles lasting 12 minutes from 20Hz to 2kHz in X, Y, Z direction with peak acceleration of 20g. (MIL 883E, Method ,A) 9 Drop 1.52m, Steel plate, 12 times 10 Solder heat +350, 5 sec., each pad(4-point) respectively 11 Reflow 5 reflow cycles with peak temperature of +260 (JEDEC J-STD-020D) - MSL MSL 2A (IPC/JEDEC's J-STD-20) Test item of acoustic specification : Sensitivity Before test, Samples for experiment should be pre-conditioned. 14 of 14