MC10H645. 1:9 TTL Clock Driver
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1 MC :9 TT Clock Driver Description The MC10645 is a single supply, low skew, TT I/O 1:9 Clock Driver. Devices in the 600 clock driver family utilizes the PCC 28 for optimal power and signal pin placement. The device features a 24 ma TT output stage with AC performance specified into a 50 pf load capacitance. A 2:1 input Mux is provided on chip to allow for distributing both system and diagnostic clock signals or designing clock redundancy into a system. With the SE input held OW the DO input will be selected, while the input is selected when the SE input is forced IG. Features ow Skew Typically 0.65 Within Device Guaranteed Skew Spec 1.25 Part to Part Input Clock Muxing Differential EC Internal Design Single Supply Extra TT and EC Power/Ground Pi Pb Free Packages are Available* PCC FN SUFFI CASE 776 MARKING DIAGRAM MC10645G AWYYWW A W YY WW G = Assembly ocation = Wafer ot = Year = Work Week = Pb Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimeio section on page 4 of this data sheet. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. Semiconductor Components Industries, C, 2006 February, 2006 Rev. 6 1 Publication Order Number: MC10645/D
2 MC10645 TT Outputs Q6 Q7 Q8 TT Inputs Q MU Q Q Q Q2 Q3 Q5 Q E S S Q SE SE Q5 Q6 Q GE Q7 Q2 Q1 Q0 Figure 1. ogic Diagram Q8 Figure 2. Pinout: 28 ead PCC (Top iew) Table 1. PIN NAMES PIN FUTION E GE Dn Q0 Q8 SE EC CC (+5.0 ) EC Ground (0 ) TT Signal Input TT Signal Outputs TT Mux Select Table 2. PIN DESCRIPTIONS Pin Symbol Description Pin Symbol Description Q4 Q3 Q2 Q1 Q0 GE SE No Connection EC Ground Select Input (TT) E Q8 Q7 Q6 Q5 EC CC (+5.0 ) Signal Input (TT) Signal Input (TT) No Connection Table 3. TRUT TABE SE Q 2
3 MC10645 Table 4. ABSOUTE RATINGS (Do not exceed) Symbol Characteristic alue Unit E (EC) Power Supply oltage to +7.0 (TT) Power Supply oltage to +7.0 I (TT) Input oltage to +7.0 out Disabled 3 State Output 0.0 to T T stg Storage Temperature 65 to 150 C T amb Operating Temperature 0.0 to +85 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditio) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 5. DC CARACTERISTICS ( = E = 5.0 ±5%) 0 C 25 C 85 C Symbol Characteristic Min Max Min Max Min Max Unit Condition I EE Power Supply Current EC ma E Pin I CC TT ma Total all pi I CC ma O Output IG oltage I O = 3.0 ma I O = 15 ma O Output OW oltage I O = 24 ma I OS Output Short Circuit Current ma OUT = 0 NOTE: Device will meet the specificatio after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained traverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditio is not implied. Device specification limit values are applied individually under normal operating conditio and not valid simultaneously. Table 6. TT DC CARACTERISTICS ( = E = 5.0 ±5%) 0 C 25 C 85 C Symbol Characteristic Min Max Min Max Min Max Unit Condition I I Input IG oltage Input OW oltage I I Input IG Current A IN = 2.7 IN = 7.0 I I Input OW Current ma IN = O Output IG oltage I O = 3.0 ma I O = 24 ma O Output OW oltage I O = 24 ma IK Input Clamp oltage I IN = 18 ma I OS Output Short Circuit Current ma OUT = 0 NOTE: Device will meet the specificatio after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained traverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditio is not implied. Device specification limit values are applied individually under normal operating conditio and not valid simultaneously. 3
4 MC10645 Table 7. AC CARACTERISTICS ( = E = 5.0 ±5%) 0 C 25 C 85 C Symbol Characteristic Min Max Min Max Min Max Unit Condition t P t P D 0 to Output Only D 1 to Output Q0 Q C = 50 pf t P D 0 to Output D 1 to Output t skpp Part to Part Skew D 0 to Output Only t skwd * Within Device Skew D 0 to Output Only t P SE to Q Q0 Q C = 50 pf t r t f Output Rise/Fall Time 0.8 to Q0 Q8 C = 50 pf t S Setup Time SE to D NOTE: Device will meet the specificatio after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained traverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditio is not implied. Device specification limit values are applied individually under normal operating conditio and not valid simultaneously. *Within Device Skew defined as identical traitio on similar paths through a device. Table 8. DUTY CYCE SPECIFICATIONS (0 C T A 85 C; Duty Cycle Measured Relative to 1.5 ) Symbol Characteristic Min Nom Max Unit Condition PW Range of CC and C to Meet Min Pulse Width (IG or OW) at f out 50Mz CC C PW pf All Outputs ORDERING INFORMATION Device Package Shipping MC10645FN PCC Units / Rail MC10645FNG PCC 28 (Pb Free) 37 Units / Rail MC10645FNR2 PCC / Tape & Reel MC10645FNR2G PCC 28 (Pb Free) 500 / Tape & Reel For information on tape and reel specificatio, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specificatio Brochure, BRD8011/D. 4
5 MC10645 PACKAGE DIMENSIONS PCC 28 FN SUFFI CASE ISSUE E N Y BRK B (0.180) M T M S N S U (0.180) M T M S N S D M Z 28 1 W D IEW D D G (0.250) S T M S N S Z A R (0.180) M T M S N S (0.180) M T M S N S (0.180) M T M S N S C E K1 G G1 J IEW S (0.100) T SEATING PANE K F (0.180) M T M S N S (0.250) S T M S N S IEW S NOTES: 1. DATUMS, M, AND N DETERMINED WERE TOP OF EAD SOUDER EITS PASTIC BODY AT MOD PARTING INE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM T, SEATING PANE. 3. DIMENSIONS R AND U DO NOT IUDE MOD FAS. AOWABE MOD FAS IS (0.250) PER SIDE. 4. DIMENSIONING AND TOERAING PER ANSI Y14.5M, CONTROING DIMENSION: I. 6. TE PACKAGE TOP MAY BE SMAER TAN TE PACKAGE BOTTOM BY UP TO (0.300). DIMENSIONS R AND U ARE DETERMINED AT TE OUTERMOST ETREMES OF TE PASTIC BODY ECUSIE OF MOD FAS, TIE BAR BURRS, GATE BURRS AND INTEREAD FAS, BUT IUDING ANY MISMATC BETWEEN TE TOP AND BOTTOM OF TE PASTIC BODY. 7. DIMENSION DOES NOT IUDE DAMBAR PROTRUSION OR INTRUSION. TE DAMBAR PROTRUSION(S) SA NOT CAUSE TE DIMENSION TO BE GREATER TAN (0.940). TE DAMBAR INTRUSION(S) SA NOT CAUSE TE DIMENSION TO BE SMAER TAN (0.635). IES MIIMETERS DIM MIN MA MIN MA A B C E F G BSC 1.27 BSC J K R U W Y Z G K
6 MC10645 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, coequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specificatio can and do vary in different applicatio and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any licee under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicatio intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless agait all claims, costs, damages, and expees, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@oemi.com N. American Technical Support: Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center Kamimeguro, Meguro ku, Tokyo, Japan Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative. MC10645/D
7 Mouser Electronics Authorized Distributor Click to iew Pricing, Inventory, Delivery & ifecycle Information: ON Semiconductor: MC10645FN MC10645FNR2
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