2N3819. N-Channel JFET. Vishay Siliconix. V GS(off) (V) V (BR)GSS Min (V) g fs Min (ms) I DSS Min (ma)
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1 N9 N-Channel JFET V GS(off) (V) V (BR)GSS Min (V) g fs Min I DSS Min (ma) 5 Excellent High-Frequency Gain: Gps MHz Very Low Noise: MHz Very Low Distortion High ac/dc Switch Off-Isolation High Gain: A V A Wideband High Gain Very High System Sensitivity High Quality of Amplification High-Speed Switching Capability High Low-Level Signal Amplification High-Frequency Amplifier/Mixer Oscillator Sample-and-Hold Very Low Capacitance Switches The N9 is a low-cost, all-purpose JFET which offers good performance at mid-to-high frequencies. It features low noise and leakage and guarantees high gain at MHz. Its TO-AA (TO-9) package is compatible with various tape-and-reel options for automated assembly (see Packaging Information). For similar products in TO-AF (TO-7) and TO- (SOT-) packages, see the N/NA/SST data sheet. TO-AA (TO-9) S G D Top View Gate-Source/Gate-Drain Voltage V Forward Gate Current ma Storage Temperature to 5 C Operating Junction Temperature to 5 C Lead Temperature ( / from case for sec.) C Power Dissipation a mw Notes a. Derate. mw/ C above 5 C Document Number: 7 S Rev. D,-Jun- 7-
2 N9 Static Limits Parameter Symbol Test Conditions Min Typ a Max Unit Gate-Source Breakdown Voltage V (BR)GSS I G = A, V DS = V 5 5 Gate-Source Cutoff Voltage V GS(off) V DS = 5 V, I D = na Saturation Drain Current b I DSS V DS = 5 V, V GS = V ma V GS = 5 V, V DS = V. na Gate Reverse Current I GSS T A = C. A Gate Operating Current c I G V DG = V, I D = ma Drain Cutoff Current I D(off) V DS = V, V GS = V Drain-Source On-Resistance r DS(on) V GS = V, I D = ma 5 Gate-Source Voltage V GS V DS = 5 V, I D = A Gate-Source Forward Voltage V GS(F) I G = ma, V DS = V.7 Dynamic Common-Source Forward Transconductance c g fs VDS = 5 V Common-Source Output Conductance c V GS = V f = khz f = MHz. 5.5 V pa V ms f = khz 5 5 S Common-Source Input Capacitance C iss. Common-Source Reverse Transfer Capacitance C rss V DS = 5 V, V GS = V, f = MHz.7 Equivalent Input Noise Voltage c e n V DS = V, V GS = V, f = Hz Notes a. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. NH b. Pulse test: PW s, duty cycle %. c. This parameter not registered with JEDEC. pf nv Hz Drain Current and Transconductance vs. Gate-Source Cutoff Voltage 5 On-Resistance and Output Conductance vs. Gate-Source Cutoff Voltage I DSS Saturation Drain Current (ma) g fs I DSS I V DS = 5 V, V GS = V g V DS = 5 V, V GS = V f = khz r DS(on) Drain-Source On-Resistance ( Ω ) r DS r I D = ma, V GS = V DS = V, V GS = V f = khz gos Output Conductance ( S) V GS(off) Gate-Source Cutoff Voltage (V) V GS(off) Gate-Source Cutoff Voltage (V) 7- Document Number: 7 S Rev. D,-Jun-
3 N9 I G Gate Leakage na na na pa pa pa T A = 5 C T A = 5 C Gate Leakage Current 5 ma. ma ma 5 ma. ma ma I 5 C I 5 C Common-Source Forward Transconductance vs. Drain Current 5 C V DS = V f = khz 5 C. pa V DG Drain-Gate Voltage (V). Output Characteristics 5 Output Characteristics V GS(off) = V V GS = V. V. V. V. V. V. V V GS = V. V 9. V. V.9 V. V.5 V. V V DS Drain-Source Voltage (V) V DS Drain-Source Voltage (V) Transfer Characteristics Transfer Characteristics V GS(off) = V V DS = V V DS = V 5 C 5 C 5 C 5 C Document Number: 7 S Rev. D,-Jun- 7-
4 N9 Transconductance vs. Gate-Source Voltage V GS(off) = V 5 C 5 C V DS = V f = khz Transconductance vs. Gate-Source Voltgage 5 C 5 C V DS = V f = khz On-Resistance vs. Drain Current Circuit Voltage Gain vs. Drain Current r DS(on) Drain-Source On-Resistance ( Ω ) V GS(off) = V V A V Voltage Gain g fs R L A V R L Assume V DD = 5 V, V DS = 5 V R L V I D V GS(off) = V V.. 5 Common-Source Input Capacitance vs. Gate-Source Voltage. Common-Source Reverse Feedback Capacitance vs. Gate-Source Voltage C iss Input Capacitance (pf) f = MHz V DS = V V DS = V f = MHz.. V DS = V. V DS = V. C rss Reverse Feedback Capacitance (pf) 7- Document Number: 7 S Rev. D,-Jun-
5 N9 T A = 5 C V DS = 5 V V GS = V Input Admittance b is T A = 5 C V DS = 5 V V GS = V Forward Admittance g is g fs b is T A = 5 C V DS = 5 V V GS = V Reverse Admittance b rs T A = 5 C V DS = 5 V V GS = V Output Admittance b os. g rs Equivalent Input Noise Voltage vs. Frequency V DS = V Output Conductance vs. Drain Current V DS = V f = khz en Noise Voltage nv / Hz I D = 5 ma Output Conductance ( S) 5 C 5 C I D = I DSS k k k f Frequency (Hz). Document Number: 7 S Rev. D,-Jun- 7-5
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Rev.._ N-CHANNEL POWER MOS FET FOR SWITCHING S-9NSUA Features The S-9NSUA is an N-channel power MOS FET that realizes a low on-state resistance and ultra high-speed switching characteristics. It is suitable
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20V 3.2 A N-Channel MOSFET 20V 3.2 A N-Channel MOSFET Features Low on-resistance R DS(ON) = 60 mω (Typ.) @ V GS = 4.5V, ID = 3.2A High current drive I D = 3.2 ma Low gate drive 8V Low threshold 1.0 V (Typ.)
More informationTSMT5. Embossed Tape Reel size (mm) 180 lapplication Type Tape width (mm) 8 Load switch, DC/ DC conversion Basic ordering unit (pcs) 3000
QS5U27 2.5V Drive Pch+SBD MOSFET Datasheet V DSS -20V R DS(on) (Max.) 340mΩ I D ±1.5A P D 1.25W loutline TSMT5 lfeatures 1) The QS5U27 combines Pch MOSFET with a Schottky barrier diode in a single TSMT5
More informationACE2020M N-Channel 200-V MOSFET
Description ACE2020M uses advanced trench technology to provide excellent R DS(ON). This device particularly suits for low voltage application such as power management of desktop computer or notebook computer
More informationDual N-channel Enhancement-mode Power MOSFETs
Dual N-channel Enhancement-mode Power MOSFETs Simple Drive Requirement Low Gate-charge RoHS-compliant halogen-free SO- package BV DS(ON) D DSS 3V mω Fast Switching Performance I 7.6A R D D Description
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Rev.3._ N-CHANNEL POWER MOS FET FOR SWITCHING S-9N32SMA The S-9N32SMA is an N-channel power MOS FET that realizes a low on-state resistance and ultra high-speed switching characteristics. It is suitable
More informationTSM V N-Channel MOSFET
SOT-23 Pin Definition: 1. Gate 2. Source 3. Drain PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 60 156 @ V GS = 10V 3 192 @ V GS = 4.5V 2.1 Features Advance Trench Process Technology High Density Cell
More information10V Drive Nch MOSFET. Data Sheet RSJ400N06. 1/ Rev.A. Dimensions (Unit : mm) Structure Silicon N-channel MOSFET
V Drive Nch MOSFET RSJ400N06 Structure Silicon N-channel MOSFET Dimensions (Unit : mm) LPTS. 4.5.3 Features ) Low on-resistance. 2) High current 3) High power Package 3. 3.0 9.0.0.24 2.54 5.08 0.78 0.4
More informationTaiwan Goodark Technology Co.,Ltd
TGD N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationS2 6 1 S1 3 D2 2 G1. Pin configuration (Top view) Parameter Symbol 10 S Steady State Unit Drain-Source Voltage V DS +20 Gate-Source Voltage V GS 6
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RQ5L015SP Pch -60V -1.5A Middle Power MOSFET Datasheet V DSS -60V R DS(on) (Max.) I D P D 280mΩ ±1.5A 1W lfeatures 1) Low on - resistance. 2) High Power small mold Package (TSMT3). 3) Pb-free lead plating
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RRQ020P03 Pch -30V -2A Middle Power MOSFET Datasheet V DSS -30V R DS(on) (Max.) 160mΩ I D ±2A P D 1.25W lfeatures 1) Low on - resistance. 2) High Power small mold Package (TSMT6). 3) Pb-free lead plating
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P-channel 20V - 0.065Ω - 4.2A - SOT-223 2.5V - Drive STripFET II Power MOSFET General features Type V DSS R DS(on) I D STN5PF02V 20V
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General Description These N-Channel enhancement mode power field effect transistors are using trench DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance,
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G S D PN PN PN TO-92 This device is designed for low current DC and audio applications. These devices provide excellent performance as input stages for sub-picoamp instrumentation or any high impedance
More informationFeatures. Symbol Parameter Rating Units V DS Drain-Source Voltage 20 V V GS Gate-Source Voltage ±10 V
General Description These N-Channel enhancement mode power field effect transistors are using trench DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance,
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More informationUNISONIC TECHNOLOGIES CO., LTD
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More informationTHERMAL RESISTANCE RATINGS THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case R θjc 6 C / W Junction-to-Ambient R θja 42 C / W STATIC
N- & annel Enhancement Mode P3ND5G PRODUCT SUMMARY V (BR)DSS R DS(ON) I D annel 3 mω 5A annel -3 36mΩ -9A G D S G D S D/D SG S G G : GATE D : DRAIN S : SOURCE ABSOLUTE MAXIMUM RATINGS (T C = 5 C Unless
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SOT-23 Pin Definition: 1. Gate 2. Source 3. Drain PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 55 @ V GS =-4.5V -3.2-20 80 @ V GS =-2.5V -2.7 130 @ V GS =-1.8V -2.0 Features Advance Trench Process Technology
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N-CHANNEL 100V - 0.115 Ω - 13A IPAK/DPAK LOW GATE CHARGE STripFET II POWER MOSFET TYPE V DSS R DS(on) I D STD10NF10 100 V
More informationV DSS = -60V. R DS(on) = 0.50Ω I D = -1.8A SOT-223. Absolute Maximum Ratings. Thermal Resistance. HEXFET Power MOSFET
HEXFET Power MOSFET l Surface Mount l Available in Tape & Reel l Dynamic dv/dt Rating l Repetitive Avalanche Rated l P-Channel l Fast Switching l Ease of Paralleling l Lead-Free Description Third Generation
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