Overcoming Obstacles to Closing Timing for DDR and Beyond. John Ellis Sr. Staff R&D Engineer Synopsys, Inc.
|
|
- Bernice McLaughlin
- 5 years ago
- Views:
Transcription
1 Overcoming Obstacles to Closing Timing for DDR and Beyond John Ellis Sr. Staff R&D Engineer Synopsys, Inc.
2 Agenda Timing budgets Mbps? Static vs. Dynamic Uncertainty Sources Benefits of Deskew Technologies Reducing Dynamic Uncertainty Crosstalk, ISI and Reflections Package Power Delivery Conclusions 2
3 DDRn Timing DDR Interfaces are Source Synchronous Total delay doesn t matter (within reason) Delay difference or Skew is Critical Strobe (DQS) Set up Hold Vref ASIC DRAM1 DRAM2 Strobe Data (DQ) Delay of DQ must tightly match the delay of differential DQS Optimal Strobe placement maximizes Set up and Hold Data Vref (Data Write Shown) 3
4 Three Regions of Uncertainty Host Launch signals in quadrature during Write Operations, Center Strobe within Data during Reads SDRAM Receive signals during Writes, launch edge-aligned during Reads Interconnect Maintain alignment and signal integrity between Host and SDRAM Power delivery 90 Strobe Write Strobe Read Data Launched 90 Out of Phase with Strobe Data Received Edge- Aligned with strobe 4
5 Uncertainty Contributors within the Host Signal skew between Data and Strobe within the PHY Clock Skew with in the PHY Across silicon process and line width variation Jitter from source clock or DLL if applicable Delay differences between rising and falling edges. Granularity of delay line structures 5
6 SDRAM Consumes ~50% of the Available Read and Write Budgets at 1600Mbps+ Set Up and Hold Output Skew and Hold Skew Factor 6
7 Agenda Timing budgets Mbps? Static vs. Dynamic Uncertainty Sources Benefits of Deskew Technologies Reducing Dynamic Uncertainty Crosstalk, ISI and Reflections Package Power Delivery Conclusions 7
8 Static Uncertainty Static uncertainty is timing uncertainty that does not vary with switching patterns or number of signals switching Example Routing skew between DQ and DQS Skew: PCB, PHY, Internal Clock Skew Deskew can remove most static uncertainty Training sequence implemented Bits are first aligned Strobe is placed in center of newly constructed eye. 8
9 Dynamic Uncertainty Dynamic uncertainty will vary with switching patterns. Example Crosstalk, ISI, SSO pushout, reflections from modal impedance changes Cannot be reliably deskewed since it can vary on a bit by bit basis. ISI A Q Crosstalk SSO Pushout 9
10 Agenda Timing budgets Mbps? Static vs. Dynamic Uncertainty Sources Benefits of Deskew Technologies Reducing Dynamic Uncertainty Crosstalk, ISI and Reflections Package Power Delivery Conclusions 10
11 Dynamic Uncertainty Crosstalk. Timing Impact of Cross section No coupling Odd Mode Even Mode In Stripline: Signals will travel at the same velocities no matter what coupling modes are excited because of the uniform dielectric. In Microstrip: Different coupling modes will travel at different velocities because of the impact of the mixed dielectric cross section. Stripline Microstrip 11
12 Different Modes Yield Different Flight Times No Coupling Odd Mode Even Mode Odd coupled arrives 27ps earlier Even coupled arrives 31ps later Total uncertainty is 59 ps 12
13 Longer Length = Greater Divergence ODD EVEN 59ps 2 routed length yields 59ps of uncertainty ODD 2 Routed Length EVEN 148ps 6 routed length yields 148ps of uncertainty 6 Routed Length 13
14 Striplines Have Equal Mode Velocities Whether uncoupled or Even or Odd coupled, mode velocities are the same in stripline. 148ps ODD 6 Microstrip EVEN Total divergence in 6 of stripline ~30ps EVEN ODD and UNCOUPLED 30ps 6 Stripline 14
15 Options for Reducing Timing Divergence Increased spacing equals increase isolation Increased soldermask thickness yields more uniform dielectric constant No Coupling Odd Mode Even Mode 15
16 Intersymbol Interference and DDR Signaling 2 Vs. 6 1 Load Vs. 2 Loads 554ps 525ps 554ps 500s Routed lengths on DDR signals are relatively short, < 6 typically. Fly-by Address can be considerably longer The number of SDRAM loads will have a larger ISI effect on the interface. 16
17 Termination Mismatch can be a Significant Contributor 468ps 525ps 17
18 ISI and Reflections lead to Uncertainty at the Vref Level 95ps 39ps 24ps 19ps 22ps 24ps 18
19 Switching Modes also Impact PCB Impedance 59Ω TDR traces 71Ω 49Ω 19
20 How SSO Impacts Timing 303ps 294ps 73ps 257ps 230ps 20
21 Use DDR Devices as a Guide for Power Ratios DDR3 SDRAM Device Try to match the via/ball count to the number of power/ground pad connections as closely as possible 21
22 Carry Ratios Through Entire Connection 1/2 the number of connections as a minimum should be the goal. It is important that the via/ball connections be regularly spaced around the die to minimize the size of the current loops. Place signal trace vias near vias from the reference layer to minimize current loop size and resulting crosstalk 22
23 Agenda Timing budgets Mbps? Static vs. Dynamic Uncertainty Sources Benefits of Deskew Technologies Reducing Dynamic Uncertainty Crosstalk, ISI and Reflections Package Power Delivery Conclusions 23
24 In Summary As data rates exceed 1600Mbps, the SDRAM requirements will consume ~50% of the budget. Deskew solutions are available, but they will only correct for static offsets between the data and its related strobe. They don t work on dynamic contributors. Good interconnect design can retrieve a great deal of margin. Pay attention to modal effects especially in microstrip configurations. Pay attention to package power/ground to signal ratios as well as placement of vias and balls to control inductance. 24
25 25 Predictable Success
TITLE. Capturing (LP)DDR4 Interface PSIJ and RJ Performance. Image. Topic: Topic: John Ellis, Synopsys, Inc. Topic: malesuada blandit euismod.
TITLE Topic: o Nam elementum commodo mattis. Pellentesque Capturing (LP)DDR4 Interface PSIJ and RJ Performance malesuada blandit euismod. Topic: John Ellis, Synopsys, Inc. o o Nam elementum commodo mattis.
More informationModeling System Signal Integrity Uncertainty Considerations
white paper Intel FPGA Modeling System Signal Integrity Uncertainty Considerations Authors Ravindra Gali High-Speed I/O Applications Engineering, Intel Corporation Zhi Wong High-Speed I/O Applications
More informationPDS Impact for DDR Low Cost Design
PDS Impact for DDR3-1600 Low Cost Design Jack W.C. Lin Sr. AE Manager jackl@cadence.com Aug. g 13 2013 Cadence, OrCAD, Allegro, Sigrity and the Cadence logo are trademarks of Cadence Design Systems, Inc.
More informationTABLE OF CONTENTS 1 Fundamentals Transmission Line Parameters... 29
TABLE OF CONTENTS 1 Fundamentals... 1 1.1 Impedance of Linear, Time-Invariant, Lumped-Element Circuits... 1 1.2 Power Ratios... 2 1.3 Rules of Scaling... 5 1.3.1 Scaling of Physical Size... 6 1.3.1.1 Scaling
More informationPHY DESIGN RECOMMENDATIONS FOR PCB LAYOUT
PHY DESIGN RECOMMENDATIONS FOR PCB LAYOUT Ron Raybarman s-raybarman1@ti ti.com Texas Instruments Topics of discussion: 1. Specific for 1394 - (Not generic PCB layout) Etch lengths Termination Network Skew
More informationThe number of layers The number and types of planes (power and/or ground) The ordering or sequence of the layers The spacing between the layers
PCB Layer Stackup PCB layer stackup (the ordering of the layers and the layer spacing) is an important factor in determining the EMC performance of a product. The following four factors are important with
More informationDatasheetDirect.com. Visit to get your free datasheets. This datasheet has been downloaded by
DatasheetDirect.com Your dedicated source for free downloadable datasheets. Over one million datasheets Optimized search function Rapid quote option Free unlimited downloads Visit www.datasheetdirect.com
More informationHigh Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug
JEDEX 2003 Memory Futures (Track 2) High Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug Brock J. LaMeres Agilent Technologies Abstract Digital systems are turning out
More informationSource: Nanju Na Jean Audet David R Stauffer IBM Systems and Technology Group
Title: Package Model Proposal Source: Nanju Na (nananju@us.ibm.com) Jean Audet (jaudet@ca.ibm.com), David R Stauffer (dstauffe@us.ibm.com) Date: Dec 27 IBM Systems and Technology Group Abstract: New package
More informationHow to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model
How to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model HSD Strategic Intent Provide the industry s premier HSD EDA software. Integration of premier
More informationDesignCon Signal and Power Integrity for a 1600 Mbps DDR3 PHY in Wirebond Package
DesignCon 2011 Signal and Power Integrity for a 1600 Mbps DDR3 PHY in Wirebond Package June Feng, Rambus Inc. [Email: jfeng@rambus.com] Ralf Schmitt, Rambus Inc. Hai Lan, Rambus Inc. Yi Lu, Rambus Inc.
More informationDDR4 memory interface: Solving PCB design challenges
DDR4 memory interface: Solving PCB design challenges Chang Fei Yee - July 23, 2014 Introduction DDR SDRAM technology has reached its 4th generation. The DDR4 SDRAM interface achieves a maximum data rate
More informationCost-minimized Double Die DRAM Packaging for Ultra-High Performance DDR3 and DDR4 Multi-Rank Server DIMMs
Cost-minimized Double Die DRAM Packaging for Ultra-High Performance DDR3 and DDR4 Multi-Rank Server DIMMs Richard Crisp 1, Bill Gervasi 2, Wael Zohni 1, Bel Haba 3 1 Invensas Corp, 2902 Orchard Parkway,
More informationDRAM System Signaling and Timing
CHAPTER 9 DRAM System Signaling and Timing In any electronic system, multiple devices are connected together, and signals are sent from one point in the system to another point in the system for the devices
More informationConsiderations in High-Speed High Performance Die-Package-Board Co-Design. Jenny Jiang Altera Packaging Department October 2014
Considerations in High-Speed High Performance Die-Package-Board Co-Design Jenny Jiang Altera Packaging Department October 2014 Why Co-Design? Complex Multi-Layer BGA Package Horizontal and vertical design
More information100 MHz 2-Way SMP Pentium II Xeon Processor/Intel 440GX AGPset AGTL+ Layout Guidelines
E AP-829 APPLICATION NOTE 100 MHz 2-Way SMP Pentium II Xeon Processor/Intel 440GX AGPset AGTL+ Layout Guidelines June 1998 Order Number: 243775-001 Information in this document is provided in connection
More informationPI3DPX1207B Layout Guideline. Table of Contents. 1 Layout Design Guideline Power and GROUND High-speed Signal Routing...
PI3DPX1207B Layout Guideline Table of Contents 1 Layout Design Guideline... 2 1.1 Power and GROUND... 2 1.2 High-speed Signal Routing... 3 2 PI3DPX1207B EVB layout... 8 3 Related Reference... 8 Page 1
More informationTMS320C6474 DDR2 Implementation Guidelines
TMS320C6474 Implementation Guidelines Ronald Lerner... ABSTRACT This document provides implementation instructions for the interface contained on the C6474 DSP. Contents 1 Prerequisites... 2 2 C6474 Supported
More informationTechnical Note. GDDR6: Design Guide. Introduction. TN-ED-04: GDDR6 Design Guide. Introduction
TN-ED-04: GDDR6 Design Guide Introduction Technical Note GDDR6: Design Guide Introduction GDDR6 is a high-speed synchronous dynamic random-access (SDRAM) memory designed to support applications requiring
More informationECE 497 JS Lecture - 22 Timing & Signaling
ECE 497 JS Lecture - 22 Timing & Signaling Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Announcements - Signaling Techniques (4/27) - Signaling
More informationSignal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane 1
, pp.119-128 http//dx.doi.org/10.14257/ijca.2018.11.7.10 Signal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane 1 Moonjung Kim Institute of IT Convergence Technology, Dept.
More informationHigh Speed Clock Distribution Design Techniques for CDC 509/516/2509/2510/2516
High Speed Clock Distribution Design Techniques for CDC 509/516/2509/2510/2516 APPLICATION REPORT: SLMA003A Boyd Barrie Bus Solutions Mixed Signals DSP Solutions September 1998 IMPORTANT NOTICE Texas Instruments
More information1 Introduction External Component Requirements AC Coupling Capacitors on high speed lanes... 2
PI3TB212 PI3TB212 Thunderbolt Application Information Table of Contents 1 Introduction... 2 2 External Component Requirements... 2 2.1 AC Coupling Capacitors on high speed lanes... 2 2.2 Pull-down Resistor
More informationRelationship Between Signal Integrity and EMC
Relationship Between Signal Integrity and EMC Presented by Hasnain Syed Solectron USA, Inc. RTP, North Carolina Email: HasnainSyed@solectron.com 06/05/2007 Hasnain Syed 1 What is Signal Integrity (SI)?
More informationHigh-Speed Circuit Board Signal Integrity
High-Speed Circuit Board Signal Integrity For a listing of recent titles in the Artech House Microwave Library, turn to the back of this book. High-Speed Circuit Board Signal Integrity Stephen C. Thierauf
More informationAdjusting Signal Timing (Part 1)
TECHNICAL PUBLICATION Adjusting Signal Timing (Part 1) Douglas Brooks, President UltraCAD Design, Inc. October 2003 www.mentor.com ABSTRACT It is becoming a routine requirement for PCB designers to tune
More informationAutomotive PCB SI and PI analysis
Automotive PCB SI and PI analysis SI PI Analysis Signal Integrity S-Parameter Timing analysis Eye diagram Power Integrity Loop / Partial inductance DC IR-Drop AC PDN Impedance Power Aware SI Signal Integrity
More informationTexas Instruments DisplayPort Design Guide
Texas Instruments DisplayPort Design Guide April 2009 1 High Speed Interface Applications Introduction This application note presents design guidelines, helping users of Texas Instruments DisplayPort devices
More informationMultilayer PCB Stackup Planning
by Barry Olney In-Circuit Design Pty Ltd Australia This Application Note details tried and proven techniques for planning high speed Multilayer PCB Stackup configurations. Planning the multilayer PCB stackup
More informationHigh-Speed Digital System Design Fall Semester. Naehyuck Chang Dept. of EECS/CSE Seoul National University
High-Speed Digital System Design 4190.309 2008 Fall Semester Naehyuck Chang Dept. of EECS/CSE Seoul National University naehyuck@snu.ac.kr 1 Traditional demand Speed is one of the most important design
More informationA Co-design Methodology of Signal Integrity and Power Integrity
DesignCon 2006 A Co-design Methodology of Signal Integrity and Power Integrity Woong Hwan Ryu, Intel Corporation woong.hwan.ryu@intel.com Min Wang, Intel Corporation min.wang@intel.com 1 Abstract As PCB
More informationHOW SMALL PCB DESIGN TEAMS CAN SOLVE HIGH-SPEED DESIGN CHALLENGES WITH DESIGN RULE CHECKING MENTOR GRAPHICS
HOW SMALL PCB DESIGN TEAMS CAN SOLVE HIGH-SPEED DESIGN CHALLENGES WITH DESIGN RULE CHECKING MENTOR GRAPHICS H I G H S P E E D D E S I G N W H I T E P A P E R w w w. p a d s. c o m INTRODUCTION Coping with
More informationECEN720: High-Speed Links Circuits and Systems Spring 2017
ECEN720: High-Speed Links Circuits and Systems Spring 2017 Lecture 9: Noise Sources Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements Lab 5 Report and Prelab 6 due Apr. 3 Stateye
More informationSystem Co-Design and Co-Analysis Approach to Implementing the XDR Memory System of the Cell Broadband Engine Processor
System Co-Design and Co-Analysis Approach to Implementing the XDR Memory System of the Cell Broadband Engine Processor Realizing 3.2 Gbps Data Rate per Memory Lane in Low Cost, High Volume Production Wai-Yeung
More informationCyclone III Simultaneous Switching Noise (SSN) Design Guidelines
Cyclone III Simultaneous Switching Noise (SSN) Design Guidelines December 2007, ver. 1.0 Introduction Application Note 508 Low-cost FPGAs designed on 90-nm and 65-nm process technologies are made to support
More informationThe Challenges of Differential Bus Design
The Challenges of Differential Bus Design February 20, 2002 presented by: Arthur Fraser TechKnowledge Page 1 Introduction Background Historically, differential interconnects were often twisted wire pairs
More informationOptimizing On Die Decap in a System at Early Stage of Design Cycle
Optimizing On Die Decap in a System at Early Stage of Design Cycle Naresh Dhamija Pramod Parameswaran Sarika Jain Makeshwar Kothandaraman Praveen Soora Disclaimer: The scope of approach presented is limited
More informationSignal Integrity Design of TSV-Based 3D IC
Signal Integrity Design of TSV-Based 3D IC October 24, 21 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr 1 Contents 1) Driving Forces of TSV based 3D IC 2) Signal Integrity Issues
More informationHigh-Speed PCB Design und EMV Minimierung
TRAINING Bei dem hier beschriebenen Training handelt es sich um ein Cadence Standard Training. Sie erhalten eine Dokumentation in englischer Sprache. Die Trainingssprache ist deutsch, falls nicht anders
More informationTECHNICAL NOTE TN DDR2 DESIGN GUIDE FOR TWO-DIMM SYSTEMS DDR2-533 MEMORY DESIGN GUIDE FOR TWO-DIMM UNBUFFERED SYSTEMS
TECHNICL NOTE DDR2-533 MEMORY DESIGN GUIDE FOR TWO-DIMM UNBUFFERED SYSTEMS Overview DDR2 memory busses vary depending on the intended market for the finished product. Some products must support four or
More informationPCB Routing Guidelines for Signal Integrity and Power Integrity
PCB Routing Guidelines for Signal Integrity and Power Integrity Presentation by Chris Heard Orange County chapter meeting November 18, 2015 1 Agenda Insertion Loss 101 PCB Design Guidelines For SI Simulation
More informationPCB Trace Impedance: Impact of Localized PCB Copper Density
PCB Trace Impedance: Impact of Localized PCB Copper Density Gary A. Brist, Jeff Krieger, Dan Willis Intel Corp Hillsboro, OR Abstract Trace impedances are specified and controlled on PCBs as their nominal
More informationEMC problems from Common Mode Noise on High Speed Differential Signals
EMC problems from Common Mode Noise on High Speed Differential Signals Bruce Archambeault, PhD Alma Jaze, Sam Connor, Jay Diepenbrock IBM barch@us.ibm.com 1 Differential Signals Commonly used for high
More informationLogic Analyzer Probing Techniques for High-Speed Digital Systems
DesignCon 2003 High-Performance System Design Conference Logic Analyzer Probing Techniques for High-Speed Digital Systems Brock J. LaMeres Agilent Technologies Abstract Digital systems are turning out
More informationThe data rates of today s highspeed
HIGH PERFORMANCE Measure specific parameters of an IEEE 1394 interface with Time Domain Reflectometry. Michael J. Resso, Hewlett-Packard and Michael Lee, Zayante Evaluating Signal Integrity of IEEE 1394
More informationOptimization of Wafer Level Test Hardware using Signal Integrity Simulation
June 7-10, 2009 San Diego, CA Optimization of Wafer Level Test Hardware using Signal Integrity Simulation Jason Mroczkowski Ryan Satrom Agenda Industry Drivers Wafer Scale Test Interface Simulation Simulation
More informationSchematic-Level Transmission Line Models for the Pyramid Probe
Schematic-Level Transmission Line Models for the Pyramid Probe Abstract Cascade Microtech s Pyramid Probe enables customers to perform production-grade, on-die, full-speed test of RF circuits for Known-Good
More informationSINCE the performance of personal computers (PCs) has
334 IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: EXPRESS BRIEFS, VOL. 57, NO. 5, MAY 2010 Multi-Slot Main Memory System for Post DDR3 Jaejun Lee, Sungho Lee, and Sangwook Nam, Member, IEEE Abstract This
More informationDifferential Pair Routing
C O L U M N BEYOND DESIGN Differential Pair Routing by Barry Olney IN-CIRCUIT DESIGN PTY LTD, AUSTRALIA A differential pair is two complementary transmission lines that transfer equal and opposite signals
More information1Gbps to 12.5Gbps Passive Equalizer for Backplanes and Cables
19-46; Rev 2; 2/8 EVALUATION KIT AVAILABLE 1Gbps to 12.Gbps General Description The is a 1Gbps to 12.Gbps equalization network that compensates for transmission medium losses encountered with FR4 and cables.
More informationMicrocircuit Electrical Issues
Microcircuit Electrical Issues Distortion The frequency at which transmitted power has dropped to 50 percent of the injected power is called the "3 db" point and is used to define the bandwidth of the
More informationPlane Crazy, Part 2 BEYOND DESIGN. by Barry Olney
by Barry Olney column BEYOND DESIGN Plane Crazy, Part 2 In my recent four-part series on stackup planning, I described the best configurations for various stackup requirements. But I did not have the opportunity
More informationFPGA World Conference Stockholm 08 September John Steinar Johnsen -Josse- Senior Technical Advisor
FPGA World Conference Stockholm 08 September 2015 John Steinar Johnsen -Josse- Senior Technical Advisor Agenda FPGA World Conference Stockholm 08 September 2015 - IPC 4101C Materials - Routing out from
More informationMeasurement of Laddering Wave in Lossy Serpentine Delay Line
International Journal of Applied Science and Engineering 2006.4, 3: 291-295 Measurement of Laddering Wave in Lossy Serpentine Delay Line Fang-Lin Chao * Department of industrial Design, Chaoyang University
More informationDDR4 SI/PI Analysis Using IBIS5.0
DDR4 SI/PI Analysis Using IBIS5.0 Socionext Inc. Yumiko Sugaya Asian IBIS Summit, Tokyo, Japan November 16, 2015 Outline Overview DDR4 SI/PI Analysis Issue Over Clocking issue DDR4 SI/PI Analysis Using
More informationULTRASCALE DDR4 DE-EMPHASIS AND CTLE FEATURE OPTIMIZATION WITH STATISTICAL ENGINE FOR BER SPECIFICATION
ULTRASCALE DDR4 DE-EMPHASIS AND CTLE FEATURE OPTIMIZATION WITH STATISTICAL ENGINE FOR BER SPECIFICATION Penglin Niu, penglin@xilinx.com Fangyi Rao, fangyi_rao@keysight.com Juan Wang, juanw@xilinx.com Gary
More informationEngineering the Power Delivery Network
C HAPTER 1 Engineering the Power Delivery Network 1.1 What Is the Power Delivery Network (PDN) and Why Should I Care? The power delivery network consists of all the interconnects in the power supply path
More informationI Main coupling Sub- coupling
High-speed, high-bandwidth DRAM memory bus with Crosstalk Transfer Logic (XTL) interface Hideki Osaka Toyohiko Komatsu Hitachi Ltd., Hitachi Ltd., Kanagawa, Japan Kanagawa, Japan oosaka@sdl. hitachi. co.jp
More informationSignal Integrity, Part 1 of 3
by Barry Olney feature column BEYOND DESIGN Signal Integrity, Part 1 of 3 As system performance increases, the PCB designer s challenges become more complex. The impact of lower core voltages, high frequencies
More informationA Technical Discussion of TDR Techniques, S-parameters, RF Sockets, and Probing Techniques for High Speed Serial Data Designs
A Technical Discussion of TDR Techniques, S-parameters, RF Sockets, and Probing Techniques for High Speed Serial Data Designs Presenter: Brian Shumaker DVT Solutions, LLC, 650-793-7083 b.shumaker@comcast.net
More informationHIGH-SPEED LOW-POWER ON-CHIP GLOBAL SIGNALING DESIGN OVERVIEW. Xi Chen, John Wilson, John Poulton, Rizwan Bashirullah, Tom Gray
HIGH-SPEED LOW-POWER ON-CHIP GLOBAL SIGNALING DESIGN OVERVIEW Xi Chen, John Wilson, John Poulton, Rizwan Bashirullah, Tom Gray Agenda Problems of On-chip Global Signaling Channel Design Considerations
More informationCircuit Design for a 2.2 GByte/s Memory Interface
Circuit Design for a 2.2 GByte/s Memory Interface Stefanos Sidiropoulos Work done at Rambus Inc with A. Abhyankar, C. Chen, K. Chang, TJ Chin, N. Hays, J. Kim, Y. Li, G. Tsang, A. Wong, D. Stark Increasing
More informationAsian IBIS Summit, Tokyo, Japan
Asian IBIS Summit, Tokyo, Japan Satoshi Nakamizo / 中溝哲士 12 Nov. 2018 Keysight Technologies Japan K.K. T h e d a t a e y e i s c l o s i n g 1600 3200 6400 Memory channel BW limited Rj improving slowly
More information25Gb/s Ethernet Channel Design in Context:
25Gb/s Ethernet Channel Design in Context: Channel Operating Margin (COM) Brandon Gore April 22 nd 2016 Backplane and Copper Cable Ethernet Interconnect Channel Compliance before IEEE 802.3bj What is COM?
More informationpolarinstruments.com
Controlled Impedance Design System for Multiple Dielectric PCBs Boundary Element Method Field Solver models multiple dielectric pcbs and local resin rich areas Si8000m Impedance goal seeking shortens design
More informationEffective Routing of Multiple Loads
feature column BEYOND DESIGN Effective Routing of Multiple Loads by Barry Olney In a previous Beyond Design, Impedance Matching: Terminations, I discussed various termination strategies and concluded that
More informationAn Engineer s Guide to Automated Testing of High-Speed In ter faces
An Engineer s Guide to Automated Testing of High-Speed In ter faces For a list ing of re cent ti tles in the Artech House Mi cro wave Li brary, turn to the back of this book. An Engineer s Guide to Automated
More informationCROSSTALK DUE TO PERIODIC PLANE CUTOUTS. Jason R. Miller, Gustavo Blando, Istvan Novak Sun Microsystems
CROSSTALK DUE TO PERIODIC PLANE CUTOUTS Jason R. Miller, Gustavo Blando, Istvan Novak Sun Microsystems 1 Outline 1 Introduction 2 Crosstalk Theory 3 Measurement 4 Simulation correlation 5 Parameterized
More informationDemystifying Vias in High-Speed PCB Design
Demystifying Vias in High-Speed PCB Design Keysight HSD Seminar Mastering SI & PI Design db(s21) E H What is Via? Vertical Interconnect Access (VIA) An electrical connection between layers to pass a signal
More informationJANUARY 28-31, 2013 SANTA CLARA CONVENTION CENTER. World s First LPDDR3 Enabling for Mobile Application Processors System
JANUARY 28-31, 2013 SANTA CLARA CONVENTION CENTER World s First LPDDR3 Enabling for Mobile Application Processors System Contents Introduction Problem Statements at Early mobile platform Root-cause, Enablers
More informationEE273 Lecture 16 Wrap Up and Project Discussion March 12, 2001
EE273 Lecture 16 Wrap Up and Project Discussion March 12, 2001 William J. Dally Computer Systems Laboratory Stanford University billd@csl.stanford.edu 1 Logistics Final Exam Friday 3/23, 8:30AM to 10:30AM
More informationAries Kapton CSP socket
Aries Kapton CSP socket Measurement and Model Results prepared by Gert Hohenwarter 5/19/04 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...
More informationEnsuring Signal and Power Integrity for High-Speed Digital Systems
Ensuring Signal and Power Integrity for High-Speed Digital Systems An EMC Perspective Christian Schuster Institut für Theoretische Elektrotechnik Technische Universität Hamburg-Harburg (TUHH) Invited Presentation
More informationIntro. to PDN Planning PCB Stackup Technology Series
Introduction to Power Distribution Network (PDN) Planning Bill Hargin In-Circuit Design b.hargin@icd.com.au 425-301-4425 Intro. to PDN Planning 1. Intro/Overview 2. Bypass/Decoupling Strategy 3. Plane
More informationImpedance Matching: Terminations
by Barry Olney IN-CIRCUIT DESIGN PTY LTD AUSTRALIA column BEYOND DESIGN Impedance Matching: Terminations The impedance of the trace is extremely important, as any mismatch along the transmission path will
More informationCACTI-IO Technical Report
CACTI-IO Technical Report Norman P. Jouppi, Andrew B. Kahng, Naveen Muralimanohar, Vaishnav Srinivas HP Laboratories HPL-2013-79 Keyword(s): IO; Interconnect; SERDES; PHY; Memory bus; DDR; LPDDR Abstract:
More informationSystem Co-design and optimization for high performance and low power SoC s
System Co-design and optimization for high performance and low power SoC s Siva S Kothamasu, Texas Instruments Inc, Dallas Snehamay Sinha, Texas Instruments Inc, Dallas Amit Brahme, Texas Instruments India
More informationTITLE. Image. Topic: Topic: Hee-Soo o LEE, Keysight Technologies Cindy Cui, Keysight Technologies
TITLE Topic: Accurate o Nam elementum Statistical-Based commodo mattis. Pellentesque DDR4 Margin Estimation using malesuada SSN blandit Induced euismod. Jitter Model Topic: Hee-Soo o LEE, Keysight Technologies
More informationMatched Length Matched Delay
by Barry Olney column BEYOND DESIGN Matched Delay In previous columns, I have discussed matched length routing and how matched length does not necessarily mean matched delay. But, all design rules, specified
More informationRiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in Serial ATA Generation 1 Applications. Revision Date: March 18, 2005
RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in Serial ATA Generation 1 Applications Revision Date: March 18, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed in conjunction
More informationLecture/s 10+11 Interconnects SLIDE 1 ENEE 359a Digital Electronics Interconnects Prof. blj@eng.umd.edu Credit where credit is due: Slides contain original artwork ( Jacob 2004) as well as material taken
More informationAnalysis of Laddering Wave in Double Layer Serpentine Delay Line
International Journal of Applied Science and Engineering 2008. 6, 1: 47-52 Analysis of Laddering Wave in Double Layer Serpentine Delay Line Fang-Lin Chao * Chaoyang University of Technology Taichung, Taiwan
More informationAries QFP microstrip socket
Aries QFP microstrip socket Measurement and Model Results prepared by Gert Hohenwarter 2/18/05 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4
More informationChapter 12 Digital Circuit Radiation. Electromagnetic Compatibility Engineering. by Henry W. Ott
Chapter 12 Digital Circuit Radiation Electromagnetic Compatibility Engineering by Henry W. Ott Forward Emission control should be treated as a design problem from the start, it should receive the necessary
More informationDesign Considerations for Highly Integrated 3D SiP for Mobile Applications
Design Considerations for Highly Integrated 3D SiP for Mobile Applications FDIP, CA October 26, 2008 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr Contents I. Market and future direction
More information08-027r2 Toward SSC Modulation Specs and Link Budget
08-027r2 Toward SSC Modulation Specs and Link Budget (Spreading the Pain) Guillaume Fortin, Rick Hernandez & Mathieu Gagnon PMC-Sierra 1 Overview The JTF as a model of CDR performance Using the JTF to
More informationQUADSPLITTER AND IN-LINE QUADSPLITTER
QUADSPLITTER AND IN-LINE QUADSPLITTER technical characteristics specifications temperature rating: -55 c to + 5 c corrosion: MIL-STD-0 Method 0, Test Condition B shock: MIL-STD-0 Method, Test Condition
More informationDesign Considerations for High-Speed RS-485 Data Links
Design Considerations for High-Speed RS-485 Data Links Introduction The trend in high-speed data networks continues to push for higher data rates over longer transmission distances, and under ever-harsher
More informationControlled Impedance Test
Controlled Impedance Test by MARTYN GAUDION The increasing requirement for controlled impedance PCBs is well documented. As more designs require fast data rates, and shrinking dies on new silicon mean
More informationMeasuring Hot TDR and Eye Diagrams with an Vector Network Analyzer?
Measuring Hot TDR and Eye Diagrams with an Vector Network Analyzer? Gustaaf Sutorius Application Engineer Agilent Technologies gustaaf_sutorius@agilent.com Page 1 #TDR fit in Typical Digital Development
More informationECEN689: Special Topics in High-Speed Links Circuits and Systems Spring 2012
ECEN689: Special Topics in High-Speed Links Circuits and Systems Spring 2012 Lecture 5: Termination, TX Driver, & Multiplexer Circuits Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements
More informationValidation Report Comparison of Eye Patterns Generated By Synopsys HSPICE and the Agilent PLTS
Comparison of Eye Patterns Generated By Synopsys HSPICE and the Agilent PLTS Using: Final Inch Test/Eval Kit, Differential Pair - No Grounds Configuration, QTE-DP/QSE-DP, 5mm Stack Height (P/N FIK-QxE-04-01)
More informationImpedance-Controlled Routing. Contents
Impedance-Controlled Routing Contents Do I Need Impedance Controlled Routing? How do I Control the Impedances? Impedance Matching the Components What Determines the Routing Impedance? Calculating the Routing
More informationPhil Lehwalder ECE526 Summer 2011 Dr. Chiang
Phil Lehwalder ECE526 Summer 2011 Dr. Chiang PLL (Phase Lock Loop) Dynamic system that produces a clock in response to the frequency and phase of an input clock by varying frequency of an internal oscillator.
More informationPI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products
PI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products Introduction The differential trace impedance of HDMI is specified at 100Ω±15% in Test ID 8-8 in HDMI Compliance Test Specification Rev.1.2a and
More informationHigh-speed Serial Interface
High-speed Serial Interface Lect. 9 Noises 1 Block diagram Where are we today? Serializer Tx Driver Channel Rx Equalizer Sampler Deserializer PLL Clock Recovery Tx Rx 2 Sampling in Rx Interface applications
More informationIntegrating 10G Serial onto a Large Digital CMOS ASSP: Taking 10G from Lab to Production
DesignCon 2004 Integrating 10G Serial onto a Large Digital CMOS ASSP: Taking 10G from Lab to Production Edward Priest, Cortina Systems Mario Moy, Cortina Systems Robert Badal, Cortina Systems George Hare,
More informationCOMMUNICATIONS, DATA, CONSUMER DIVISION. Mezzanine High-Speed High-Density Connectors GIG-ARRAY and MEG-ARRAY Electrical Performance Data
COMMUNICATIONS, DATA, CONSUMER DIVISION Mezzanine High-Speed High-Deity Connectors GIG-ARRAY and MEG-ARRAY Electrical Performance Data FCI: SETTING THE STANDARD FOR CONNECTORS With operatio in 30 countries,
More informationAbsence of Insertion Loss Anti-Resonance In Shielded Pairs Having High Skew
Absence of Insertion Loss Anti-Resonance In Shielded Pairs Having High Greg Vaupotic Principal Engineer Background Allegedly, within-pair skew causes resonances (actually anti-resonances) to be present
More informationAccomplishment and Timing Presentation: Clock Generation of CMOS in VLSI
Accomplishment and Timing Presentation: Clock Generation of CMOS in VLSI Assistant Professor, E Mail: manoj.jvwu@gmail.com Department of Electronics and Communication Engineering Baldev Ram Mirdha Institute
More information