COMMUNICATIONS, DATA, CONSUMER DIVISION. Mezzanine High-Speed High-Density Connectors GIG-ARRAY and MEG-ARRAY Electrical Performance Data

Transcription

1 COMMUNICATIONS, DATA, CONSUMER DIVISION Mezzanine High-Speed High-Deity Connectors GIG-ARRAY and MEG-ARRAY Electrical Performance Data

2 FCI: SETTING THE STANDARD FOR CONNECTORS With operatio in 30 countries, FCI is a leading manufacturer of connectors. Our 13,500 employees are committed to providing customers with high-quality, innovative products for a wide range of coumer and industrial applicatio. 2

3 CONTENTS Preface...4 Product Datasheets...5 SECTION 1 Introduction: Assumptio And Conditio 1.1 Definition Of Reference Planes Risetime Convention Connector Impedance Definition Description Of The Mezzanine Link Link Build-Up Connection Diagram Mezzanine PCB Parameters Eye Patter: Performance Figure...16 SECTION 2 Mezzanine Connector Electrical Comparison 2.1 High Speed Electrical Performance - Summary Table...17 SECTION 3 MEG-Array Connector System 3.1 Introduction Connector Performance Configuration Differential Impedance Single Ended Impedance Differential Attenuation Propagation Delay Crosstalk Eye Diagrams...25 SECTION 4 GIG-Array Connector System 4.1 Introduction Connector Performance Configuration Differential Impedance Differential Attenuation Propagation Delay Crosstalk Eye Diagrams SECTION 5 Dimeional Outline Tables & Mated Height Base Part Number Selector 5.1 MEG-Array Connector System GIG-Array Connector System...37 SECTION 6 Additional Web Links 6.1 MEG-Array Connector System GIG-Array Connector System

4 PREFACE Today s communication technology requires the tramission of increasingly higher data rates, driving the need for enhanced hardware to preserve signal integrity in these systems. The system designer is challenged to maximize system performance by balancing three interacting components to maximize system performance: Integrated circuit chips Multi-layer boards Interconnect systems FCI recognizes that the interconnection of complex subsystems is a crucial factor in the design of data and communicatio equipment. To meet evolving high-speed performance requirements, we have developed a compreheive line of two-piece mezzanine connectors. These interconnects provide several levels of performance versus signal deity across a wide range of board-to-board stack heights to eure the proper price and performance objectives are met for a system design. The basic level of performance is provided by the MEG-Array connector system. These connectors are designed for single ended, as well as differential applicatio for stack heights between 4 and 14mm. The GIG-Array connector family offers enhanced performance for differential applicatio where a board-to-board spacing of 15 to 40mm is needed. This manual is designed to assist the designer with the selection of the optimal mezzanine connector solution to meet a defined application need. Section 1 introduces some important terms and concepts used throughout the manual. Section 2 is a summary table comparing the electrical performance for selected stack heights in the two connector families Sectio 3 and 4 present more detailed measured data that characterizes the high-speed electrical performance of the MEG-Array and GIG-Array connector families. Section 5 contai Dimeional Outline Tables Section 6 lists Web Links to additional technical documents for these connector families We hope you will find this guide to be helpful in selecting the proper FCI Mezzanine connectors to meet your application requirements. 4

5 BOARD TO BOARD CONNECTORS MEG-ARRAY CONNECTOR SYSTEM DESCRIPTION The MEG-Array connector is designed to meet the needs of 10Gb/s applicatio requiring up to 528 signal pi per connector. The combination of multiple stack heights (4mm to 14mm) and multiple sizes (81 signals to 528 signals) allows for optimal design flexibility while yielding less than 1% cross-talk performance when configured differentially. FCI has produced the MEG-Array Connector System since 1996, shipping over 10 billion BGA contact interfaces illustrating FCI s extended tradition as the premier BGA interconnect innovator and supplier. FCI s patented BGA design is supported by fully automated quality control systems featuring 100% ipectio of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-of-the-art manufacturing facility. FEATURES & BENEFITS RoHS Compliant (Lead-Free) Ball Grid Array (BGA) termination for process friendly attachment.050" x.050" BGA interface pitch optimizes routing and electrical performance Stack Heights available from 4mm to 14mm (2mm increments) Connector sizes of 81 signals to 528 signals providing 80 usable signals per linear cm (205 signals per linear inch) allow for optimization of board space and signal requirements 10 Gb/s differential pair performance at less than 1% cross-talk meets the needs of high speed mezzanine applicatio Meets Telcordia GR-1217-CORE and NPS specificatio for utilization in telecom applicatio Demotrated solder joint reliability of greater than 22 years life (per IPC-SM-785) is unmatched for a BGA mezzanine connector Polarized design assures proper mating of the connector Back to Back testing connector (Interposer) available upon special request TARGET MARKETS / APPLICATIONS Communicatio Tramission Access Switching Optics Networking Data Servers Storage I & I Industrial controls & equipment Analytical & diagnostic Medical 5

6 MEG-ARRAY CONNECTOR SYSTEM MATERIALS Housing: Liquid Crystal Polymer Contact: Copper Alloy Plating: Au over Ni SnPb Solderballs: 63Sn/37Pb Ø 0.76mm Pb-Free Solderballs: 95.5 Sn/4 Ag/0.5 Cu MECHANICAL PERFORMANCE Durability: 50 Cycles Telcordia GR-1217-CORE, NPS Documents Contact Wipe: 0.80mm Nominal IPC-SM-785 Solder Joint Reliability: 22.1 year product end-of-life ELECTRICAL PERFORMANCE Current Rating: 0.45 A / Contact <30 C T (100% Energized) 2.0 A < 30 C T (Single Contact Energized) Low Level Contact Resistance: See product specification GS for performance results of specific stack heights Dielectric Withstanding Voltage: 200 VAC max. Iulation resistance: 1000 mω min. Differential impedance (Z 0 ), Propagation Delay, Near-End Cross-Talk, S21 (iertion loss) and S11 (return loss): For performance of various stack heights, please refer to the FCI high speed website. SPECIFICATIONS Product specificatio: GS Application specification: GS Meets requirements of Telcordia GR-1217-CORE issue I Meets requirements of NPS (25 year life expectancy) (supporting test reports can be obtained at: PACKAGING Tape and Reel MORE DATA Spice files, IGES and ProE files, signal integrity data and additional information available at: Standard MEG-Array plugs and receptacles shipped with a cap for product protection as well as for use by automated pick and place equipment. (Actual cap color: natural) MEG-ARRAY CONNECTOR SIZES Feature 81 Position 100 Position 200 Position 240 Position 300 Position 400 Position 528 Position Description (9x9) (10x10) (10x20) (8x30) (10x30) (10x40) (12x44) Housing Length Housing Width BGA/Pad Length BGA/Pad Width All Dimeio in mm. 6

7 MEG-ARRAY MATED HEIGHTS - BASE PART NUMBER SELECTOR Size Type 4.0mm 6.0mm 8.0mm 10.0mm 12.0mm 14.0mm 81 Position Plug (9x9) 0mm Receptacle mm 100 Position Plug (10x10) 0mm Receptacle mm 200 Position Plug (10x20) 0mm 0mm 0mm 6mm 6mm 6mm Receptacle mm 6mm 8mm 4mm 6mm 8mm 240 Position Plug (8x30) 0mm 0mm Receptacle mm 6mm 300 Position Plug (10x30) 0mm 0mm 0mm 6mm 6mm 6mm Receptacle mm 5.5mm 8mm 4mm 5.5mm 8mm (5.5mm) (11.5mm) 400 Position Plug (10x40) 0mm 0mm 0mm 6mm 6mm 6mm Receptacle mm 6mm 8mm 4mm 6mm 8mm 528 Position Plug (12x44) 0mm Receptacle mm MEG-ARRAY INTERCONNECT PART NUMBERS PLUGS # of Positio Description Contact Area Finish Part Numbers (in microinches) SnPb BGA RoHS Compliant Pb-Free BGA 81 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 100 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 200 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 240 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 300 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 400 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 528 0mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 7

8 MEG-ARRAY CONNECTOR SYSTEM MEG-ARRAY INTERCONNECT PART NUMBERS RECEPTACLES # of Positio Description Contact Area Finish Part Numbers (in microinches) SnPb BGA RoHS Compliant Pb-Free BGA 81 4mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 100 4mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 200 4mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 8mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 240 4mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 300 4mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 5.5mm 15 Au LF 30 Au LF 8mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 400 4mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 8mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF 528 6mm 15 Au LF 30 Au LF 50 Au (Telcordia) LF *All connectors are supplied with a pre-italled pickup cap. 8

9 BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY connector is designed to meet the needs of up to 10Gb/s applicatio requiring up to 296 signal pi per connector. FCI s long tradition as a BGA connector innovator assures expertise and reliability in the GIG- ARRAY BGA design. The combination of multiple stack heights (15mm to 40mm) and multiple sizes (200 signals to 296 signals) utilizing a 100-Ohm differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance. FCI has produced BGA mezzanine connectors since 1996, shipping over 10 billion BGA contact interfaces demotrating FCI s exteive experience as the premier BGA interconnect innovator and supplier. FCI s patented BGA design is supported by fully automated quality control systems featuring 100% ipectio of assembly coplanarity, solder sphere size and location, as well as critical-tofunction terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-ofthe-art manufacturing facility. FEATURES & BENEFITS RoHS compliant (Lead-Free) optio are available Optimized design for utilization in high-deity, high-speed mezzanine applicatio Ball Grid Array (BGA) termination for process friendly attachment 1mm x 0.65mm BGA interface pitch optimizes routing and electrical performance Stack Heights available from 15mm to 40mm provide mezzanine design flexibility Connector sizes of 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements 100 Ohm differential pair matched impedance assures coistent high speed performance Up to 10 Gb/s differential pair performance Very low cross-talk (VLC) design of less than 1% allows for required signal integrity performance Dual beam signal contacts provide two points of contact increasing product reliability Polarized design assures proper mating of the connector TARGET MARKETS / APPLICATIONS Communicatio Tramission Access Switching Optics Networking Data Servers Storage I & I Industrial controls & equipment 9

10 GIG-ARRAY CONNECTOR SYSTEM MATERIALS Housing: Liquid Crystal Polymer Contact: High Strength Copper Alloy Plating: Au over Ni SnPb Solderballs: 63Sn/37Pb Ø 0.76mm Pb-Free Solderballs: 95.5 Sn/4 Ag/0.5 Cu MORE DATA Spice files, signal integrity data, drawings and more available at: MECHANICAL PERFORMANCE Durability: 25 Cycles Contact Wipe: 2.00mm Nominal Telcordia GR-1217-CORE IPC-SM-785 Solder Joint Reliability Passed 6000 cycle solder joint reliability ELECTRICAL PERFORMANCE Current Rating: 1A / Contact <30 C T Low Level Contact Resistance: < 20mΩ for 15mm mated height < 32mΩ for 35mm mated height Dielectric Withstanding Voltage=500 VAC Withstanding Voltage=167 VAC max. Propagation Delay: 100 ps for 15mm mated height 200 ps for 35mm mated height Differential Impedance: 100 ± 10%Ω Near-End 100pS: < 3% SPECIFICATIONS Product specificatio: GS Application specification: GS PACKAGING Trays EYE-PATTERN CONTACT STRIPLINE STRUCTURE A Ground Contact B Signal Contact C Differential Pair D 20mm GIG-ARRAY Measured Eye Pattern at 10 Gb/s E Mask Opening: 25% Amplitude 40% Period 10

11 GIG-ARRAY CONNECTOR SIZES Description 200 Positio* 296 Positio* Housing Length mm mm BGA Pad Length mm mm Number of Signal Contacts Number of Ground Contacts Number of BGA Balls Fully Shielded Differential Pairs Continuous Differential Pairs GIG-ARRAY MATED HEIGHTS - BASE PART NUMBER SELECTOR Plug Height** 200 Positio* 10mm 12mm 13mm 15mm 20mm 25mm Receptacle 5mm 15 mm 17mm 18mm 20mm 25mm 30mm Height** mm 25 mm 27mm 28mm 30mm 35mm 40mm Plug Height** 296 Positio* 10mm 12mm 13mm 15mm 20mm 25mm Receptacle 5mm 15 mm 17mm 18mm 20mm 25mm 30mm Height** mm 25 mm 27mm 28mm 30mm 35mm 40mm *Signal contacts only, ground contacts not included **Base part number listed under connector height 11

12 GIG-ARRAY CONNECTOR SYSTEM GIG-ARRAY INTERCONNECT PART SYSTEM PLUGS Number of Description Contact Area Finish Part Numbers Positio* (in microinches) SnPb BGA RoHS Compliant Pb-Free BGA mm 30 Au LF 12mm 30 Au LF 13mm 30 Au LF 15mm 30 Au LF 20mm 30 Au LF 25mm 30 Au LF mm 30 Au LF 12mm 30 Au LF 13mm 30 Au LF 15mm 30 Au LF 20mm 30 Au LF 25mm 30 Au LF RECEPTACLES Number of Description Contact Area Finish Part Numbers Positio* (in microinches) SnPb BGA RoHS Compliant Pb-Free BGA 200 5mm 30 Au LF 15mm 30 Au LF 296 5mm 30 Au LF 15mm 30 Au LF *Signal contacts only, ground contacts not included All connectors are supplied with a pre-italled pickup cap. 12

13 NOTES 13

14 INTRODUCTION: ASSUMPTIONS & CONDITIONS This manual describes the high-speed electrical performance of the MEG-Array and GIG-Array connectors. Throughout the document, a number of assumptio and conventio are used. This introduction summarizes the following conventio and assumptio: Definition of reference planes Risetime convention Definition of connector impedance Description of the mezzanine link 1.1 DEFINITION OF REFERENCE PLANES The electrical performance of a pc board is determined by its design (such as board material, trace widths, trace lengths and via hole dimeio) and varies for each application. The measured performance of the board-stacking connectors includes the effects of the test boards and SMA connectors. Figure 1-1 shows the location of the reference planes where measured data was captured. SMA's 1.3 CONNECTOR IMPEDANCE DEFINITION The term connector impedance can have different meanings. It is quite common to grossly simplify the connector and state that it has an impedance of x. This can mean the average impedance of the connector, as measured using a TDR in a specific test configuration, is x. It may also mean that one specific cross-section of the connector has an impedance of x when analyzed with a specific 2-D quasi-static field solver. Without further clarification, the term connector impedance is ambiguous. Even a high-performance mezzanine connector can disrupt the field pattern of propagating energy at high frequencies. The geometry changes associated with via structures and within the connector itself contribute to the field pattern distortion. Typically, the geometric complexity of a multi-pin connector and its attachment to a pc board results in several field pattern distortio, or impedance mismatches that can be represented as lumped elements, either capacitive or inductive. The approach herein is to observe the TDR profile of the entire interconnection link, including all via and board effects. The profile is then characterized for its maximum and minimum impedance deviation at a given risetime. Figures 1-2 thru 1-5 illustrate this approach. Reference Planes Header Receptacle Figure 1-1. Definition of Reference Planes Per this definition all risetimes specified are the risetimes at the input reference plane. 1.2 RISETIME CONVENTION The risetimes shown in this document are at a convention of 10%-90% of signal amplitude. The results obtained with a 100ps 10-90% risetime will always be worse than the results obtained with a 100ps 20-80% risetime. A 10-90% risetime of 100ps corresponds to a 20-80% risetime of 69ps. Similarly, a 20-80% risetime of 100ps corresponds to a 10-90% risetime of 145ps. 14

15 INTRODUCTION: ASSUMPTIONS & CONDITIONS Figure 1-2 shows calibration traces that are equivalent to 2 times the length of any trace in the connector measurement area. By shorting the input SMA you are able to locate the beginning of the SMA / Board traition as shown in Figure 1-3. The figure defines this point to be at If you perform the same procedure on the output SMA you will be able to locate the end of the SMA / Board traition as shown in Figure 1-4. The short on the output is located at INPUT Figure 1-2 Test PCB OUTPUT Figure 1-4 Short at output of calibration SMA The measurement details the discontinuity caused by the via traition where the connector attaches. It is easy to find the discontinuity associated with the via by determining the difference in time between the input and output shorts and then dividing it by two. Using figures 1-3 and 1-4 you can see that the total delay is 100ps and thus the traition to the connector is located at ps, or roughly 5.1 as shown in Figure 1-5. Figure 1-5 TDR measurement on empty board Figure 1-3 Short at input of calibration SMA The size of this discontinuity will depend on the impedance of the mated connectors, as well as the impedance of their footprints. The impedance of the footprint depends on board features, such as the layer on which the corresponding signal trace is routed, the size of any via stubs, pad size and antipad size. 15

16 INTRODUCTION: ASSUMPTIONS & CONDITIONS 1.4 DESCRIPTION OF MEZZANINE LINK LINK BUILD-UP The mezzanine link used in testing is shown in Figure 1-6. A number of channels on the header side are connected to a number of channels on the receptacle side. All connectio are point to point, and signals propagate from the header board to the receptacle board. Header Figure 1-6 Mezzanine Link SMA's Receptacle EYE PATTERNS: PERFORMANCE FIGURE An eye pattern is a good indication of the receiver s ability to interpret signals correctly. It includes the effects of link loss, ISI (intersymbol interference), tramitter jitter, and system noise. To quantify the eye opening, we will use a performance mask based on the following two performance metrics (Figure 1-7) Normalized maximum eye opening height This height is the maximum eye opening height divided by the amplitude of the input signal. Normalized mask width when height is 25% of differential amplitude (W(H = 25%)). This represents the mask width (when the mask height is 25% of the differential amplitude) divided by the bit time CONNECTION DIAGRAM An interconnection link is defined as the path from the input test connection, through a short length of PCB, one connector footprint, a mated pair of mezzanine connectors, a second connector footprint, and a second short length of PCB, to the output test connection. Each mezzanine connector has unique tramission and reflection properties. A mezzanine connector system is typically comprised of two unique connectors; a plug and a receptacle. The contact design, although unique to the individual connector, is typically repeated by the number of positio in the connector. A connector section including only a few positio needs to be tested, as their performance is representative of the rest of the contacts MEZZANINE PCB PARAMETERS For the measurements reported in this booklet, the header and receptacle boards were fabricated with the same pad, via and trace design. All connectio were made by edge coupled differential striplines. All traces were designed to have a 100 Ω differential impedance. Only one board material was used for this testing: Rogers 4003 (Er=3.38 and d = ). The length of the traces on each board were 1.5 inches +/-.01. This is the trace length from the SMA to the BGA pad on each board. W = 40% & H = 25% Figure 1-7 Definition of performance figures for evaluating eye openings. In this booklet, we will use a mask height of 25% and a mask width of 40% as the acceptance criteria for all eye pattern measurements. 16

17 MEZZANINE ELECTRICAL COMPARISON 2.1 HIGH SPEED ELECTRICAL PERFORMANCE - SUMMARY TABLE Product Type Differential Differential*** 10 Gb/s** Propagation Multiactive Differential and Stack Height Impedance Iertion Eye Delay NEXT Pairs Per Tr = 100pS Loss (S21) Tr = 100pS Linear inch 4mm MEG-Array 91.0 / GHz Pass 24.21ps <1% 39 10mm MEG-Array / GHz Pass 54.33ps <1% 39 14mm MEG-Array / GHz Pass 70.50ps <1% 39 15mm GIG-Array / GHz Pass 53.23ps <1.24% 51* 20mm GIG-Array 93.5 / GHz Pass 87.57ps <1.13% 51* 25mm GIG-Array 93.0 / GHz Pass ps <1.14% 51* 30mm GIG-Array / GHz Pass ps <1.25% 51* 35mm GIG-Array / GHz Pass ps <1.25% 51* * Denotes fully shielded differential pairs. 79 differential pairs per linear inch can be attained if the differential pairs are continuous. ** Reference Section For Acceptance Criteria *** Frequency at which iertion loss reaches 3dB 17

18 MEG-ARRAY CONNECTOR SYSTEM 3.1 INTRODUCTION This section presents differential electrical performance data for the 4, 10 and 14mm MEG-Array connector stack heights. This data includes impedance, iertion loss, return loss, propagation delay and crosstalk. 3.2 CONNECTOR PERFORMANCE CONFIGURATION Figure 3-2 4mm stack 70ps Figure 3-1 shows the configuration used for testing performed with differential pairs. Rows A, C, E and G, as well as Colum 1, 4 and 7 were dedicated to ground. Each of the signal rows included 2 differential pairs. Note that the ground contacts on the odd rows can be used for low speed signals. ROW A B C D E F G COLUMN Figure 3-3 4mm stack 100ps Figure 3-1 Configuration used for testing. Column = Connector Length; Row = Connector Width. Reference Section 5.1 for Length & Width Convention DIFFERENTIAL IMPEDANCE The minimum and maximum connector impedance is determined for different risetimes of the injected step signal. Figures 3-2 thru 3-13 shows the impedance graphically at 70, 100, 150 and 200ps risetimes for each stack height, respectively. Table 3-1 summarizes the data. Figure 3-4 4mm stack TABLE 3-1 DIFFERENTIAL IMPEDANCE (OHMS) Stack Height Min Max Rise Time (ps) 4mm mm mm Figure 3-5 4mm stack 200ps 18

19 MEG-ARRAY CONNECTOR SYSTEM Figure mm stack 70ps Figure mm stack 70ps Figure mm stack 100ps Figure mm stack 100ps Figure mm stack Figure mm stack 150ps Figure mm stack 200ps Figure mm stack 200ps 19

20 MEG-ARRAY CONNECTOR SYSTEM SINGLE ENDED IMPEDANCE The minimum and maximum single ended connector impedance is determined for different risetimes of the injected step signal. Figures 3-15 thru 3-26 show the impedance profiles for risetimes of 70ps 200ps. Figure 3-14 shows the layout used for the single ended measurements. Table 3-2 summarizes the data. Figure mm stack 70ps Figure 3-14 Single Ended Test Configuration TABLE 3-2 SINGLE ENDED IMPEDANCE (OHMS) Stack Height Min Max Rise Time (ps) 4mm mm mm Figure mm stack 100ps Figure mm stack Figure mm stack 200ps 20

21 MEG-ARRAY CONNECTOR SYSTEM Figure mm stack 70ps Figure mm stack 70ps Figure mm stack 100ps Figure mm stack 100ps Figure mm stack Figure mm stack Figure mm stack 200ps Figure mm stack 200ps 21

22 MEG-ARRAY CONNECTOR SYSTEM 3.4 DIFFERENTIAL ATTENUATION The attenuation of differential pair S7 and S8 (from Figure 3-1) for each stack height is shown in Figures 3-27 thru Figure 3-27 Differential Attenuation of 4mm stack height Figure 3-28 Differential Attenuation of 10mm stack height Figure 3-29 Differential Attenuation of 14mm stack height 22

23 MEG-ARRAY CONNECTOR SYSTEM 3.5 PROPAGATION DELAY The propagation delay is the time needed for a signal to propagate through a connector pair. It is calculated as the difference in time between the tramitted signal and input signal at a signal level equal to 50% of the input amplitude. Figures 3-30 thru 3-32 summarize the data for the 4,10 and 14mm stack heights. TABLE 3-3 PROPAGATION DELAY Stack Height 4mm 10mm 14mm Time ps ps ps Figure mm stack height Delay Figure mm stack height Delay Figure mm stack height Delay 23

24 MEG-ARRAY CONNECTOR SYSTEM 3.6 CROSSTALK Single-pair active crosstalk is the crosstalk measured at one pair when a signal is injected onto a second pair. The backward or near-end crosstalk is the crosstalk measured at the same end as the injected signal. The forward or far-end crosstalk is measured at the end opposite the injected signal. The forward crosstalk is so small in the mezzanine connectors that the values are negligible. Likewise, the single active horizontal and diagonal coupling is also negligible. Therefore, only the near-end multi-pair active crosstalk is presented. The multi-pair active crosstalk is the maximum crosstalk that can be measured at one pair of the connector when a signal is injected in other neighboring pairs of the connector. The multi-pair active crosstalk is calculated as the sum of the absolute values of the single-pair active crosstalk. This mea that the multi-pair active crosstalk must be interpreted as the absolute worst-case value. Figures 3-33 the 3-35 show Multi-Active NEXT for MEG-Array at 4mm, 10mm and 14mm board-to-board heights. Figure 3-33 Multi_Active 100ps 4mm stack height Figure 3-34 Multi_Active 100ps 10mm stack height Figure 3-35 Multi_Active 100ps 14mm stack height 24

25 MEG-ARRAY CONNECTOR SYSTEM 3.7 EYE DIAGRAMS Figures 3-36 through 3-39 show the reference eye pattern and eye patter for MEG-Array at 4mm, 10mm and 14mm board-to-board heights. The impact of trace width, trace length, board material, and vias is included in all of these results. The eye diagrams presented are that of the test configuration outlined in Sectio thru of this booklet. The input for the differential eye pattern was a 800mVp-p 27-1 PRBS signal at 10Gb/s. The signal was launched from the header side of the mezzanine link. The mask amplitude was 25% (200 mvp-p) of the input signal and the mask width was set to 40% (40 ps) of the input signal. Figure Gb/s Reference Eye Figure mm stack Gb/s Figure mm stack Gb/s Figure mm stack Gb/s 25

26 GIG-ARRAY CONNECTOR SYSTEM 4.1 INTRODUCTION This section presents differential electrical performance data for the 15, 20, 25, 30 and 35mm GIG-Array connector stack heights. This data includes impedance, iertion loss, return loss, propagation delay and crosstalk. 4.2 CONNECTOR PERFORMANCE CONFIGURATION Figure 4-1 shows the configuration used for all of the testing performed. Rows A, C, E and G, as well as Colum 1, 4 and 7 were dedicated to ground. Each of the signal rows included 2 differential pairs. Note that the ground contacts on the odd rows can be used for low speed signals. ROW A B C D E F G COLUMN Figure 4-1 Configuration used for testing. Column = Connector Length; Row = Connector Width. Reference Section 5.2 for Length & Width Convention. 4.3 DIFFERENTIAL IMPEDANCE The minimum and maximum connector impedance is determined for different risetimes of the injected step signal. Figures 4-2 thru 4-21 shows the impedance graphically at 70, 100, 150 and 200ps risetimes for each each stack height, respectively. Table 4-1 summarizes the data. TABLE 4-1 DIFFERENTIAL IMPEDANCE (OHMS) Stack Height Time Rise Time (ps) 15mm mm mm mm mm

27 GIG-ARRAY CONNECTOR SYSTEM Figure mm stack 70ps Figure mm stack 70ps Figure mm stack 100ps Figure mm stack 100ps Figure mm stack Figure mm stack Figure mm stack 200ps Figure mm stack 200ps 27

28 GIG-ARRAY CONNECTOR SYSTEM Figure mm stack 70ps Figure mm stack 70ps Figure mm stack 100ps Figure mm stack 100ps Figure mm stack Figure mm stack Figure mm stack 200ps Figure mm stack 200ps 28

29 GIG-ARRAY CONNECTOR SYSTEM Figure mm stack 70ps Figure mm stack 100ps Figure mm stack Figure mm stack 200ps 29

30 NOTES 30

31 GIG-ARRAY CONNECTOR SYSTEM 4.4 DIFFERENTIAL ATTENUATION The attenuation of differential pair S7 and S8 (from figure 4-1) for each stack height is shown in Figures 4-22 thru Figure 4-22 Differential Attenuation of 15mm stack height Figure 4-25 Differential Attenuation of 30mm stack height Figure 4-23 Differential Attenuation of 20mm stack height Figure 4-26 Differential Attenuation of 35mm stack height Figure 4-24 Differential Attenuation of 25mm stack height 31

32 GIG-ARRAY CONNECTOR SYSTEM 4.5 PROPAGATION DELAY The propagation delay is the time needed for a signal to propagate through a connector pair. It is calculated as the difference in time between the tramitted signal and input signal at a signal level equal to 50% of the input amplitude. Figures 4-27 thru 4-31 summarize the data for the 15, 20, 25, 30 and 35mm stack heights. TABLE 4-2 PROPAGATION DELAY Stack Height Time 15mm 53.23ps 20mm 87.57ps 25mm ps 30mm ps 35mm ps Figure mm stack height Delay Figure mm stack height Delay Figure mm stack height Delay Figure mm stack height Delay Figure mm stack height Delay 32

33 GIG-ARRAY CONNECTOR SYSTEM 4.6 CROSSTALK Single-pair active crosstalk is the crosstalk measured at one pair when a signal is injected onto a second pair. The backward or near-end crosstalk is the crosstalk measured at the same end as the injected signal. The forward or far-end crosstalk is measured at the end opposite the injected signal. The forward crosstalk is so small in the mezzanine connectors that the values are negligible. Likewise, the single active horizontal and diagonal coupling is also negligible. Therefore, only the near-end multi-pair active crosstalk is presented. The multi-pair active crosstalk is the maximum crosstalk that can be measured at one pair of the connector when a signal is injected in other neighboring pairs of the connector. The multi-pair active crosstalk is calculated as the sum of the absolute values of the single-pair active crosstalk. This mea that the multi-pair active crosstalk must be interpreted as the absolute worst-case value. Figures 4-32 thru 4-36 show crosstalk at 15mm, 20mm, 25mm, 30mm and 35mm board-to-board heights. Figure 4-34 Multi_Active 100ps 25mm stack height Figure 4-32 Multi_Active 100ps 15mm stack height Figure 4-35 Multi_Active 100ps 30mm stack height Figure 4-33 Multi_Active 100ps 20mm stack height Figure 4-36 Multi_Active 100ps 35mm stack height 33

34 GIG-ARRAY CONNECTOR SYSTEM 4.7 EYE DIAGRAMS Figures 4-37 thru 4-42 show the reference eye pattern as well as the output eye pattern at 10Gb/s at 15mm, 20mm, 25mm, 30mm and 35mm board-to-board heights. The impact of trace width, trace length, board material, and vias is included in all of these results. The eye diagrams presented are that of the test configuration outlined in Sectio thru of this manual The input for the differential eye pattern was a 800mVp-p PRBS signal at 10Gb/s. The signal was launched from the header side of the mezzanine link. The mask amplitude was 25% (200 mvp-p) of the input signal and the mask width was set to 40% (40 ps) of the input signal. Figure mm stack 10Gb/s Figure Gb/s Reference Eye Figure mm stack 10Gb/s 34

35 GIG-ARRAY CONNECTOR SYSTEM Figure mm stack 10Gb/s Figure mm stack 10Gb/s Figure mm stack 10Gb/s 35

36 DIMENSIONAL OUTLINE TABLES 5.1 MEG-ARRAY CONNECTOR SYSTEM MEG-ARRAY CONNECTOR SIZES Feature 81 Position 100 Position 200 Position 240 Position 300 Position 400 Position 528 Position Description (9x9) (10x10) (10x20) (8x30) (10x30) (10x40) (12x44) Housing Length Housing Width BGA/Pad Length BGA/Pad Width All Dimeio in mm. MEG-ARRAY MATED HEIGHTS - BASE PART NUMBER SELECTOR Size Type 4.0mm 6.0mm 8.0mm 10.0mm 12.0mm 14.0mm 81 Position Plug (9x9) 0mm Receptacle mm 100 Position Plug (10x10) 0mm Receptacle mm 200 Position Plug (10x20) 0mm 0mm 0mm 6mm 6mm 6mm Receptacle mm 6mm 8mm 4mm 6mm 8mm 240 Position Plug (8x30) 0mm 0mm Receptacle mm 6mm 300 Position Plug (10x30) 0mm 0mm 0mm 6mm 6mm 6mm Receptacle mm 5.5mm 8mm 4mm 5.5mm 8mm (5.5mm) (11.5mm) 400 Position Plug (10x40) 0mm 0mm 0mm 6mm 6mm 6mm Receptacle mm 6mm 8mm 4mm 6mm 8mm 528 Position Plug (12x44) 0mm Receptacle mm 36

37 DIMENSIONAL OUTLINE TABLES 5.2 GIG-ARRAY CONNECTOR SYSTEM GIG-ARRAY CONNECTOR SIZES Description 200 Positio* 296 Positio* Housing Length mm mm BGA Pad Length mm mm Number of Signal Contacts Number of Ground Contacts Number of BGA Balls Fully Shielded Differential Pairs Continuous Differential Pairs GIG-ARRAY MATED HEIGHTS - BASE PART NUMBER SELECTOR Plug Height** 200 Positio* 10mm 12mm 13mm 15mm 20mm 25mm Receptacle 5mm 15 mm 17mm 18mm 20mm 25mm 30mm Height** mm 25 mm 27mm 28mm 30mm 35mm 40mm Plug Height** 296 Positio* 10mm 12mm 13mm 15mm 20mm 25mm Receptacle 5mm 15 mm 17mm 18mm 20mm 25mm 30mm Height** mm 25 mm 27mm 28mm 30mm 35mm 40mm *Signal contacts only, ground contacts not included **Base part number listed under connector height 37

38 ADDITIONAL WEB LINKS 6.1 MEG-ARRAY CONNECTOR SYSTEM Technical Document Data sheet Eye pattern data Signal integrity test data Application Specification Product Specification Solder joint reliability data Test report that validates that MEG-Array system meets Telcordia GR-1217-CORE (25 Cycles) Test report that validates that MEG-Array system meets Telcordia GR-1217-CORE (200 Cycles) Test report that validates that MEG-Array system meets NPS specification Spice Models IGES & ProE Models Direct Web-Link to Document GIG-ARRAY CONNECTOR SYSTEM Technical Document Data sheet Application specification Product Specification Qualification report which includes signal integrity data, meets Telcordia GR-1217-CORE data, and solder joint reliability data Spice Models IGES & ProE Models Direct Web-Link to Document

39 NOTES 39

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