ExaMAX 56Gb/s High Speed Orthogonal Connector System
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1 ExaMAX 56Gb/s High Speed Orthogonal Connector System ExaMAX high speed orthogonal connector system is designed to enable superior 56Gb/s electrical performance for increasing bandwidth requirements and the data rates used for high speed signaling. To further expand the range of applications supported by the ExaMAX connector system, Amphenol has added a 6-Pair Orthogonal right angle header connector solution. The connectors enable efficient implementation of Direct-Mate orthogonal and midplane orthogonal architectures. Orthogonal architecture solutions eliminate long, complex traces, via stub effects, simplify signal links and reduce backplane layer count. Amphenol Direct-Mate orthogonal connector system maximizes chassis cooling and airflow while improving signal integrity performance at a reduced cost. The mechanically robust connector design supports chassis alignment in a 25mm card slot configuration. The flexible connector design also enables designers to allocate rows to high speed signal, low speed signal, or integrated power. TARGET MARKETS The ExaMAX high speed connector system is offered in industry standard packaging options including a broad range of backplane, coplanar, mezzanine, cable-toboard, orthogonal midplane and orthogonal direct configurations. FEATURES Capable of supporting data rates of 25Gb/s with scalable migration path to 56Gb/s BENEFITS Supports future system performance upgrades while eliminating costly redesign burden Unique beam-on-beam interface and skew equalized leadframes Superior signal integrity performance via impedance control, low cross-talk while eliminating insertion loss resonances. Mating forces reduced by 40% compared to traditional blade and beam designs Hermaphroditic mating interface protects mating beams Durable, reliable mating interface design. Eliminates crushed pins Simple efficient 92 Ω design Supports both 85 and 100 Ω applications 2.0mm pitch delivers 76 pair per inch density Industry leading density performance Modular, 2mm hard metric connector block design Modular design capability supports applications requiring high and low speeds, power, and mechanical guidance at lowest industry costs 0.36mm PTH for signals and 0.5mm for grounds Friendly to PCB manufacturers, improving cost and yield Additional Signal Pin per IMLA Integrate High and low speed signals in the same connector Integrated guidance Superior mating performance Amphenol Information Communications and Commercial Products
2 TECHNICAL INFORMATION MATERIAL Contacts: High performance Copper Alloy Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) Tin over Nickel on press-fit tails Housings: High temperature thermoplastic, UL 94 V-0 MECHANICAL PERFORMANCE Long mating wipe of > 2mm X capture: +/-1.2mm Y capture: +/-1.1mm Mating Force: 0.45N max. per contact Unmating Force: 0.10N min. per contact ELECTRICAL PERFORMANCE Contact Resistance: <10 mω change from initial reading after environmental exposure Current Rating (with 30 C T-rise above ambient) Signal contact: 0.5A/Contact (both signal and ground contacts can carry current) ENVIRONMENTAL Telcordia GR-1217-CORE Central Office qualification completed Operating Temperature: -55 C to +85 C SPECIFICATION Amphenol Product Specification: GS Amphenol Application Specification: GS SIGNAL INTEGRITY PERFROMANCE See graphs below for Insertion Loss and power-summed crosstalk Impedance is tuned to 92 Ω making ExaMAX suitable forboth 85 Ω and 100 Ω systems Test reports are available which show the performance in both 85 Ω and 100 Ω environments OIF Specification: OIF-CEI-25G-LR TARGET MARKETS/APPLICATIONS Hubs Optical Transport Router Switches Wireless Infrastructure External Storage System Server Supercomputer Emulation Equipment Test Equipment
3 ORTHOGONAL ARCHITECTURES Orthogonal Header (RAOH) MIDPLANE ORTHOGONAL Header DIRECT-MATE ORTHOGONAL (eliminating midplane) Daughter Card (RAR) orthogonal architecture reduces electrical length between switch chips and I/O transceivers Airflow Improvement: boards can block airflow needed to cool chassis Connector Quantity: Requires four connectors Connectivity: Provides connectivity through a shared via structure enabling data transfer from front to rear cards. Header (VH) and (VR) are aligned on opposite sides of midplane and share same PC Hole Routing: Orthogonal Header (RAOH) 90 rotation results in shorter channel lengths between transmitter and receiver simplifying routing; Reduces or eliminates the need for complex routing Board Layers: Requires fewer board layers Signal Loss: Orthogonal midplane via structure can result in additional signal losses due to impedance discontinuities Thicker PCB: May result in signal integrity degradation Direct-Mate orthogonal architecture improves Signal Integrity performance while reducing applied costs Airflow Improvement: Enables direct connections from the front to rear card via open air flow chassis design; eliminates need for special plenums to cool system and rear cards; system efficiency is improved since cooling and airflow is optimized Connector Quantity: Requires two connectors Reduces cost: Eliminates midplane board and two connectors; components, cooling system, materials and testing is eliminated or reduced Mechanically Robust Connector System: Minimizes alignment challenges
4 6-PAIR ORTHOGONAL VARIATIONS See next page for part number tables Integrated Guides* 6x6 6x8 6x10 6x12 6x14 6x16 Guides* 6x6 6x8 6x10 6x12 6x14 6x16 *Hold-down options are available for connectors with integrated guides and no guides
5 ExaMAX DIRECT-MATE ORTHOGONAL: WITH INTEGRATED GUIDE PIN Product Variation Guide Pin Mating Connector PN Columns Differential Orthogonal Header (RAOH) Screw Mount (RAR) LF LF JLF JLF LF LF JLF JLF LF LF LF LF JLF JLF JLF JLF LF LF JLF JLF LF LF JLF JLF ExaMAX DIRECT-MATE ORTHOGONAL: NO GUIDE Product Variation Guide Pin Mating Connector PN Columns Differential Orthogonal Header (RAOH) Screw Mount (RAR) LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF Direct-Mate Orthogonal ( Guides) Direct-Mate Orthogonal (Guides) Direct-Mate Orthogonal Mating Orthogonal ( Guides) DMO Header 90 Mating Orientation 270 Mating Orientation
6 ExaMAX MIDPLANE ORTHOGONAL Product Variation Mating Connector System Guide Pin Columns Differential Orthogonal Header (RAOH) (VR) Header (VH) (RAR) LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF LF Orthogonal Orthogonal Header (RAOH) Header Daughter Card (RAR) Orthogonal Application Guide Pins manages power and low speed signals front card Horizontal rear cards HSBPEXAMAXORTHO0518EA4
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Distributed by: www.jameco.com 1-800-831-4242 The content and copyrights of the attached material are the property of its owner. FEATURES AND SPECIFICATIONS Features and enefits Exceeds Category 5 performance
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