M C C. MT200CB18T2 MT200CB16T Amp THYRISTOR/DIODE. Features. MODULE 800~1800 Volts. Applications. Circuit

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1 Features pplications omponents 2736 Marilla Street Chatsworth!"# $%!"# Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix designates RoHS Compliant. See ordering information) International standard package Heat transfer through aluminum oxide DBC ceramic isolated metal baseplate Glass passivated chip Simple Mounting Power Converters Lighting Control DC Motor Control and Drives Heat and temperature control B C D MT2CB8T2 MT2CB12T2 MT2CB16T2 MT2CB18T2 MODULE 8~18 Volts M6 2 mp THYRISTOR/DIODE T2 O P Q E F G H K LR M I N Circuit DIMENSIONS DIM INCHES MM MIN MX MIN MX B C D E F G H I J K L M N.32X.11.8X2.8 O P Q R J NOTE Revision: 1 of 6 216/1/1

2 Module Type TYPE VRRM/VDRM VRSM MT2CB8T2 MT2CB12T2 MT2CB16T2 MT2CB18T2 8V 12V 16V 18V 9V 13V 17V 19V Diode Maximum Ratings ID Output Current(D.C.) Tc=85 2 IFSM Surge forward current t=1ms Tvj =45 68 i 2 t Circuit Fusing Consideration s Visol Isolation Breakdown Voltage(R.M.S) a.c.5hz;r.m.s.;1min 3 V Tvj Operating Junction Temperature -4 to +125 Tstg Storage Temperature -4 to +125 Mt Mounting Torque To terminals(m6) 3±15% Nm Ms To heatsink(m6) 5±15% Nm Weight Module(pproximately) 165 g Thermal Characteristics Rth(j-c) Thermal Impedance, max. Junction to Case.8 /W Rth(c-s) Thermal Impedance, max. Case to Heatsink.5 /W Electrical Characteristics Symbol Item Conditions Values Min. Typ. Max. Units VFM Forward Voltage Drop, max. T=25 IF = V IRRM Repetitive Peak Reverse Current, max. Tvj =25 VRD=VRRM Tvj =125 VRD=VRRM.5 9 m m Revision: 2 of 6 216/1/1

3 Thyristor Maximum Ratings I TV verage On-State Current Sine 18 o ;Tc=85 2 I TSM i 2 t Surge On-State Current Circuit Fusing Consideration T VJ =45 t=1ms, sine T VJ =125 t=1ms, sine T VJ =45 t=1ms, sine T VJ =125 t=1ms, sine Visol Isolation Breakdown Voltage(R.M.S) a.c.5hz;r.m.s.;1min 3 V Tvj Operating Junction Temperature -4 to +13 Tstg Storage Temperature -4 to +125 Mt Mounting Torque To terminals(m6) 3±15% Nm Ms To heatsink(m6) 5±15% Nm di/dt Critical Rate of Rise of On-State Current T VJ = T VJM, 2/3V DRM,I G =5m Tr<.5us,tp>6us Thermal Characteristics Rth(j-c) Thermal Impedance, max. Junction to Case.16 /W Rth(c-s) Thermal Impedance, max. Case to Heatsink.1 /W 2s 2 /us dv/dt Critical Rate of Rise of Off-State Voltage, min. T J =T VJM,2/3V DRM linear voltage rise 1 V/us a Maximum allowable acceleration 5 m/s 2 Electrical Characteristics Symbol Item Conditions Values Min. Typ. Max. Units V Peak On-State Voltage, max. T=25 I T = V I RRM /I DRM V TO Repetitive Peak Reverse Current, max. / Repetitive Peak Off-State Current, max. On state threshold voltage T VJ =T VJM,V R =V RRM,V D = V DRM For power-loss calculations only (T VJ =125 ) 4 m.85 V r T Value of on-state slope resistance. max T VJ =T VJM 1.5 mω V GT Gate Trigger Voltage, max. T VJ =25, V D =6V 3 V I GT Gate Trigger Current, max. T VJ =25, V D =6V 2 m V GD Non-triggering gate voltage, max. T VJ =125,V D =2/3V DRM.25 V I GD Non-triggering gate current, max. T VJ =125, V D =2/3V DRM 1 m I L Latching current, max. T VJ =25, R G = 33 Ω 3 1 m I H Holding current, max. T VJ =25, V D =6V 15 4 m tgd Gate controlled delay time T VJ =25, I G =1, dig/dt=1/us 1 us tq Circuit commutated turn-off time T VJ =T VJM 1 us Revision: 3 of 6 216/1/1

4 Performance Curves 3 3 W sin DC 2 rec.3 rec.6 rec.12 DC 18 sin.18 rec rec.6 6 rec.3 P TV I TVM ITV Tc Fig1. Power dissipation Fig2.Forward Current Derating Curve.3 / W Zth(j-S) 6 5HZ.1 Zth(j-C) 3.11 t 1.1 Fig3. Transient thermal impedance 1 1 ms 1 Fig4. Max Non-Repetitive Forward Surge Current Revision: 216/1/1 4 of 6

5 Performance Curves M C C 6 Typ max. 2 I T V V 2. Fig5. Forward Characteristics 1 V 1/2 MT2CB2T2 2V;2Ω T vj V GT PG(tp) V G V GD125 I GT.1 I GD125.1 IG Fig6. Gate trigger Characteristics Revision: 216/1/1 5 of 6

6 Ordering Information : Device Packing Part Number-BP Bulk: 8PCS/BOX ;8PCS/CTN ***IMPORTNT NOTICE*** Corp. reserves the right to make changes without further notice to any product herein to make corrections, modifications, enhancements, improvements, or other changes. Corp. does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights,nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Corp. and all the companies whose products are represented on our website, harmless against all damages. ***LIFE SUPPORT*** MCC's products are not authorized for use as critical components in life support devices or systems without the express written approval of Corporation. ***CUSTOMER WRENESS*** Counterfeiting of semiconductor parts is a growing problem in the industry. (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from uthorized MCC Distributors who are listed by country on our web page cited below. Products customers buy either from MCC directly or from uthorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. Revision: 6 of 6 216/1/1