Etching in Microsystem Technology

Transcription

1 Michael Köhler Etching in Microsystem Technology Translated by Antje Wiegand WILEY-VCH Weinheim New York Chichester Brisbane Singapore Toronto

2 Contents Preface Table of Contents Symbols Abbreviations V VII XI XV 1 Introduction 1 2 Distinctive Features of Microtechnical Etching Etching as a Fashioning Method Limits of Additive Microtechnical Pattern Generation Subtractive Pattern Generation Etch Rate and Selectivity Etch Rate and Time Request The Etching Process Transport Processes Process Velocities Isotropic and Anisotropic Etching Edge Geometry and Roughness Deviations from Ideal Geometry Edge Geometry in Isotropic Etching Fabrication of Low Slope Angles by Isotropic Etching Edge Geometries in Anisotropic Etching Fabrication of Low Slope Angles by Partially Anisotropic Etching Accuracy Monitoring of Etching Processes 26

3 VIII Contents 3 Wet-Chemical Etching Methods Etching at the Interface Solid-Liquid Preparation of the Surface Surface Condition Cleaning Digital Etching Etching of Dielectric Materials Wet Etching by Physical Dissolution Wet-Chemical Etching of Non-Metals Etching of Metals and Semiconductors Outer-Currentless Etching Selectivity in Outer-Currentless Etching Etching of Multilayer Systems Forming Local Elements Geometry-Dependent Etch Rates Geometry-Dependent Passivation Electrochemical Etching Photochemical Wet Etching Photoelectrochemical Etching Crystallographic Etching Chemical Wet Etching of Monocrystalline Surfaces Anisotropic Etching of Monocrystalline Metals Anisotropic Etching of Silicon Anisotropic Electrochemical and Photoelectrochemical Etching Porous Silicon Anisotropic Etching of Compound Semiconductors Preparation of Free-Standing Micropatterns Surface Micromachining Bulk Micromachining Porous Silicon as Sacrificial Material Dry-Etching Methods Ill 4.1 Removal at the Interface Solid-Gas Ill 4.2 Plasma-Free Etching in the Gas Phase Plasma-Free Dry Etching with Reactive Gases Photo-Assisted Dry Etching with Reactive Gases Directly-Writing Micropatterning by Laser Scanning Etching Electron-Beam-Assisted Vapour Etching Plasma Etching Methods Material Removal by Reactions with Plasma Species 122

4 Contents Plasma Generation Plasma Etching in the Barrel Reactor Plasma Etching in the Down-Stream Reactor Plasma Etching in the Planar-Plate Reactor Magnetic-Field-Biassed Plasma Etching Plasma Etching at Low Pressure and Fligh Ion Density Forming of Etch Structures in Plasma Etching Geometry Influence on Plasma Etching Plasma Jet Etching (PJE) Applications of Plasma Etching Etchig Methods with Energized Particles Sputter-Etching Reactive Ion Etching (RIE) Magnetic-Field-Enhanced Reactive Ion Etching (MERIE) Ion Beam Etching (IBE) Reactive Ion Beam Etching (RIBE) Magnetic-Field-Enhanced Reactive Ion Beam Etching (MERIBE) Chemically-Assisted Ion Beam Etching (CAIBE) Reactive Etching with Excitation from Several Sources Electron-Beam-Supported Reactive Ion Etching (EBRE) Focussed Ion Beam Etching (FIB) Nanoparticle Beam Etching (NPBE) Formation of the Structure Sidewall Geometry in Ion Beam Etching Material Defects in Etching with Energized Particles Application of Etching Methods with Energized Particles Microforming by Etching of Locally Changed Material Principle of Forming by Locally Changed Material Inorganic Resists Etching of Photosensitive Glasses Etching of Photo-Damaged Areas Etching of Areas Damaged by Ion Beams Particle Trace Etching Chosen Recipes Explaining the Collection of Recipes 179

5 X Contents 181 Ag Al Al(Ti) (Al,Ga)As Alo.s Gao. 5 P (Al,Ga,In)P (Al,In)As AlInN AI0.5 Ino.sP A1N A AsSG (Arsenosilicate Glass) Au Bi BSG (Borosilicate Glass) С (amorphous) С (Diamond) (C,H,[0,N,F,Cl,Br])-Polymere CdS CdTe (Co,Cr) (Co,Nb,Zr) Co 2 Si Cr Cu Fe (Fe,C) (Fe,Ni) GaAs (Ga,In)As (Gao.5Ino.5P GaN (Ga, Gd) References Index GaP GaSb Ge Ge x Si,. x Hf HgTe InAs (In,Ga)N InN InP InSb (In,Sn) (In x,sn y )0 In 2 Te 3 KTiOP0 4 (KTP) LiA10 2 LiGa0 2 LiNb0 3 Mg Mo MoSi 2 Nb NbN Ni (Ni,Cr) NiMnSb Pb PbS pbo.865lao.09zro.65tlo.3503 (PLZT) Pb,Zr x Ti,. x 0 3 (PZT) PSG (Phosphosilicate Glass) Pt Ru0 2 Sb Si SiC Si 3 N 4 Si0 2 Si x O y N z Sn Sn0 2 Та TaN Ta 2 O s TaSi 2 Tao.7 2 Sio. 2 8N Те Ti TiN Ti0 2 V W wo 3 WSi 2 YBa 2 Cu x (YBCO) Zn ZnO ZnS ZnSe