System100Pro. Production tools for wafer processing. The Business of Science

Transcription

1 System100Pro Production tools for wafer processing The Business of Science

2 Process tools & modules Oxford Instruments' System100Pro production tools are built on 200 mm, 300 mm and multiwafer batch process modules and tool platforms which offer excellent uniformity and high-throughput processes on a range of applications. Low-damage ICP GaN etch with Cl 2 -Ar chemistry Our processes are backed by process guarantees to ensure rapid start-up during installation Oxford Instruments tools are proven in the field with over 90% uptime 1 Process tool platforms Plasmalab plasma etch and deposition, including PVD Sapphire & SiC etch for substrate growth preparation for HB LEDs: ICP etched Sapphire, no PR mask remains FlexAL atomic layer deposition (ALD) Ionfab ion beam etch and deposition Nanofab growth systems for nanowires and nanotubes Process modules Etch ICP RIE Ion beam etch (IBE/IBM, RIBE, CAIBE) Deposition PECVD ICP-CVD ALD PVD (dc/rf sputtering) Ion beam deposition (IBSD, IASD, RIBD) GaAs via: ICP etch REFLOW High rate SiO 2 waveguide PECVD: two 6 µm core splitter samples with 10 µm of BPSG overclad and reflowed 1 including planned downtime Al deposited onto an etched SiO 2 on Si structure; the metal layer follows the contour of the etched substrate very well, even into a notched trench profile

3 Production capability Wafer handling options 200 mm and 300 mm single wafer or cassette load Multi-wafer batch processing for 50 mm (2 ) to 100 mm (4 ), including cassette loading of batch carrier plates Cassette-to-cassette handling with full wafer tracking and individual wafer process control where required Hexagonal or square robotic handlers, with MESC compatibility allowing further addition of third-party modules E-chuck and/or mechanical clamping options, with He wafer backside cooling Wide temperature range substrate electrodes: -150 C to 400 C or 700 C Cleanroom interface options Ballroom Through-wall Cluster Process control Large wafer area and batch process end-pointing by optical emission spectrometry (OES) OES detects changes in etch by-products or depletion of reactive gas species Predictive chamber cleaning end-pointing Integrated with the PC2000 TM process tool software Laser end-point detection (LEPD) also available for blanket etching or where mask patterns allow, or for deposition monitoring Integrated OES control and monitoring within PC2000 process tool software: OES of SiO 2 etch

4 Process tool software Oxford Instruments PC2000 software is renowned for its clarity and ease of use, making it quick to train process operators while retaining full functionality for fab managers and service staff. The front-end visual interface which controls and monitors the process tool is configured exactly for the customer s system Ability to control a tool cluster from a single interface and PC Process recipes are written, stored and recalled through the same software, building into a process library Password-controlled user login allows different levels of user access and tasks, from one-button run operation to full system functions Continuous process and system data logging ensures traceability of each wafer and process run Fully GEM/SECS compatible Cost of ownership solutions We work with our customers to create the right package of system plus process plus support to meet your requirements and fit with your cost of ownership model. For production customers we can create a specific Service Level Agreement (SLA) package tailored to your needs. This can include, for example: Guaranteed response times for support engineer visits and technical hotline calls Choice of support coverage up to 24/7 Scheduled preventative maintenance calls Managed spares inventory options, including customer-dedicated stock, via our parts locations throughout the world Preferential spare part pricing Process training Certified maintenance training courses to train the customer s own engineers in preventative maintenance and first level troubleshooting

5 Global experience...global presence Oxford Instruments experience in supplying process solutions to both the production and research & development markets worldwide has give us one of the strongest libraries of processes and capabilities in the world, with unequalled breadth of experience in process development and support by our Applications Engineers. Working with Oxford Instruments can run from process development, through pilot production and into full production. Because our process tools use a common chamber design, processes are transferable from single-wafer process development systems to cassette-load and clustered production tools. As a global company, Oxford Instruments provides local front-line support for both tools and process through our network of international service and process support engineers based at locations in the USA, Asia and Europe, plus trained representative support for rapid response. Our engineers are backed by our centralised support management system which maintains a full history of your system.

6 Plasma Etch & Deposition Atomic Layer Deposition Molecular Beam Epitaxy Ion Beam Etch & Deposition Nanoscale Growth Systems Oxford Instruments Plasma Technology UK North End, Yatton, Bristol, BS49 4AP Tel: +44 (0) Fax: +44 (0) Germany Wiesbaden Tel: +49 (0) Fax: +49 (0) Japan Tokyo Tel: Fax: oikkpt@oxinst.co.jp Worldwide Service and Support Oxford Instruments is committed to supporting our customers success. We recognise that this requires world class products complemented by world class support. Our global service force is backed by regional offices, offering rapid support wherever you are in the world. We can provide: Tailored service agreements to meet your needs Comprehensive range of structured training courses Immediate access to genuine spare parts and accessories System upgrades and refurbishments PR China Beijing Tel: /1/2 Fax: ptsales@oichina.cn Shanghai Tel: Fax: ptsales@oichina.cn Singapore Tel: Fax: oipt.sales@oxfordinstruments.com.sg click onto for more information Oxford Instruments, at Yatton, UK, operates Quality Management Systems approved to the requirements of BS EN ISO This publication is the copyright of Oxford Instruments Plasma Technology Limited and provides outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Oxford Instruments policy is one of continued improvement. The company reserves the right to alter, without notice, the specification, design or conditions of supply of any product or service. Oxford Instruments acknowledges all trade marks and registrations. Plasmalab, FlexAL and Ionfab are registered trademarks of Oxford Instruments Plasma Technology Ltd. Oxford Instruments Plasma Technology Ltd, All rights reserved. Ref: OIPT/PROD/2008/02 USA Concord, MA TOLLFREE Tel: Fax: info@ma.oxinst.com As part of Oxford Instruments environmental policy this brochure has been printed on FSC paper.