Highlights of inemi 2013 Technology Roadmaps A Look at 2015 Cycle

Transcription

1 Highlights of inemi 2013 Technology Roadmaps A Look at 2015 Cycle Chuck Richardson, inemi 2014 IPC APEX EXPO March 26, 2014 Mandalay Bay Hotel, Las Vegas, NV

2 2 inemi Introduction Topics Roadmap Process 2015 / Changes From Roadmap Statistics Situation Analysis Technology Needs Strategic Concerns Paradigm Shifts Summary/Next Steps

3 International Electronics Manufacturing Initiative (inemi) is an industry-led consortium of 110 global manufacturers, suppliers, industry associations, government agencies and universities. A Non Profit Fully Funded by Member Dues; In Operation Since Visit us at About inemi Mission: Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future. 5 Key Deliverables: Technology Roadmaps Collaborative Deployment Projects Research Priorities Document Proactive Forums Position Papers

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6 Supplier Members PWB Supply Chain

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8 Roadmap Process & Scope

9 2013 Product Emulator Groups (PEGs) Emulator Consumer / Portable Office Automotive Products High-End Systems (The Cloud) Medical Products Characteristics Produced in high volumes, cost is the primary driver, hand held battery powered products are also driven by size and weight reduction Driven by the need for maximum performance over a wide range of cost targets Products that must operate in an automotive environment Products that serve the high performance computing/storage markets including networking, datacom and telecom and cover a wide range of cost and performance targets Products that must operate with high reliability and, in some cases, support life critical applications Aerospace / Defense Products that must operate reliably in extreme environments 9

10 2015 Product Emulator Descriptions Emulator Characteristics Wireless / Portable Office / Consumer Systems Produced in high volumes, cost is a primary driver, hand held battery powered products are also driven by features, size, weight reduction and battery life Driven by the need for maximum performance and lowest cost Automotive Products High-End Systems Medical Products Products that must operate in an automotive environment Products that serve the high end computing, networking, datacom and telecom markets and cover a wide range of cost and performance targets Products that must operate with high reliability and, in some cases, support life critical applications Aerospace / Defense Products that must operate reliably in extreme environments 10

11 Roadmap Development Product Sector Needs vs. Technology Evolution Product Emulator Groups TWGs Portable / Wireless Office / Consumer High-End (e.g. netcom, server) Automotive Medical Products Semiconductor Technology Prod Lifecycle Information Mgmt. Business Processes Modeling, Thermal, etc. Design Technologies Board Assembly, Test, etc. Manufacturing Technologies Comp./Subsyst. Technologies Packaging, Substrates, Displays, etc. Defense and Aerospace

12 Example Product Emulator Chapter Content Portable/Consumer Contents Consumer / Portable Product Sector... 1 Executive Summary... 1 Introduction... 3 Situation Analysis... 4 Roadmap of Quantified Key Attribute Needs Critical Issues (Infrastructure) Prioritized Technology Requirements and Trends Recommendations on Priorities and Alternative Technologies Contributors Tables Table 1. Key Parameters for Hand Held Product Sector... 12

13 Example Product Emulator Chapter Content (continued) Portable/Consumer Smartphone/Non-Smartphone Growth $Bn Total Branded: Non-Smartphones: Smartphones: CAAGR % -13.4% 15.4% $324Bn $361Bn 43 $377Bn 38 N mvc- value ship $385Bn $276Bn $146Bn $178Bn $235Bn

14 Components/ Package Example Product Emulator Chapter (continued) Portable/Consumer, Key Parameters Table 1 (12 rows of 250) Parameter Descriptions Metric Typical Product Family Utilizing Max Component I/O density Substrate Density I/O/sq.cm Average Component I/O density Substrate Density I/O/sq.cm Average Component Density Substrate Density #/sq.cm Maximum I/O per package Average I/O per package State of the Art (production volume) State of the Art (production volume) I/O per part I/O per part Max Components/sq. cm. Substrate Density #/sq.cm Max I/O for 50 mm square SCM w/ full area array Max I/O for 100 mm square MCM w/ full area array Package I/O Pitch, (area array) Package I/O Pitch for SCM (area array) Package I/O Pitch for MCM (area array) Package I/O Pitch (perimeter) State of the Art (production volume) State of the Art (production volume) Minimum Pitch (Production volume) Minimum Pitch (Production volume) Minimum Pitch (Production volume) Minimum Pitch (Production volume) # # UA UA UA UA UA mm mm mm mm

15 2013 Technology Working Groups (TWGs) Modeling, Simulation, and Design Solid State Illumination arge Area, Flexible Electronics Semiconductor Technology Photovoltaics Ceramic Substrates Connectors MEMS/ Sensors Packaging & Component Substrates Passive Components Optoelectronics Mass Storage (Magnetic & Optical) Energy Storage & Conversion Systems Test, Inspection & Measurement Thermal Management Organic PCB Board Assembly Final Assembly Customer Information Management Systems Environmentally Sustainable Electronics Red=Business Green=Engineering Purple=Manufacturing Blue=Component &

16 Modeling, Simulation, and Design Connectors RF Components & Subsystems Test, Inspection & Measurement Solid State Illumination Large Area, Flexible Electronics Semiconductor Technology Photovoltaics Ceramic Substrates MEMS/ Sensors Packaging & Component Substrates Passive Components Optoelectronics Power Conversion Systems Mass Storage (Magnetic & Optical) Energy Storage Thermal Management Organic PCB Board Assembly Final Assembly Customer Information Management Systems Environmentally Sustainable Electronics Red=Business Green=Engineering Purple=Manufacturing Blue=Component & Subsystem

17 Sample Chapter Content Optoelectronics Contents Optoelectronics...1 Executive Summary... 1 Introduction Situation (Infrastructure) Analysis Telecommunications Situation The Telecommunications Sector vs Data Communications Sector FTTX Situation Local Area Network (LAN) Situation Plastic Optical Fiber (POF) (Automotive) Situation Active Optical Cable Situation Backplane Situation On-Card Data Transmission Situation On-Chip Optical Interconnect Situation BER (Bit Error Rates) Financial and Business Status Status Summary Manufacturing Issues Manufacturing Equipment Availability Data Communication Manufacturing Process Issues Designing for Manufacturing Quality Requirements Environmental Issues Supply Chain Issues Roadmap of Quantified Key Attribute Needs Critical (Infrastructure) Issues Technology Needs Prioritized Research & Development Needs Gaps and Show Stoppers Recommendations on Potential Alternative Technologies Black Swans Appendix A Graphical Roadmap Representation Appendix B Electrons vs Photons for Data Communication Appendix C Contributors/Acknowledgments Appendix D Glossary Appendix E Optoelectronic Internet Links to Items of Interest

18 Example Chapter Content Optoelectronics (2) Tables Table 1: Summary of Critical issues, Gaps and Show Stoppers, and Technical Needs...9 Table 2: Market and Application Mapping: Product status matrix...13 Table 3: Optical Data Transmission Technology Improvements and Potential Future Improvements...21 Table 4: Distinct LAN Applications...28 Table 5: MSA Standards Overview...29 Table 6: Examples of short range, commercial POF based systems Table 7: Some of the Active Optical Cable Suppliers as of August Table 8: Recent Financial Results of Some Industry Firms...54 Table 9: Manufacturing Processes for Optical Products with Those Unique to Optical Products Highlighted...58 Table 10: Telecommunications Key Attribute Needs...70 Table 11: FTTX (X = Curb, House, Desk, Antenna, etc ) Key Attribute Needs...71 Table 12: LANS Key Attribute Needs...73 Table 13: Plastic Optical Fiber (POF) (Automotive) Key Attribute Needs...75 Table 14: Active Optical Cables (AOC) Key Attribute Needs...76 Table 15: Backplane Key Attribute Needs...78 Table 16: On-Card Key Attribute Needs...79 Table 17: In-to and Out-of Package Key Attribute Needs...80 Table 18: On-Chip Key Attribute Needs...82 Table 19: Critical Infrastructure Issues...83 Table 20: Technology Needs...86 Table 21: Research and Development Needs...88 Table 22: Gaps and Show Stoppers...89 Table 23: Potential Alternate Technologies...90 Table 24: Black Swans 91 Plus Tables 45 through 65

19 Example Chapter Content Optoelectronics (3) Figures Figure 1: Data rates vs distance with media as a parameter illustrating optical dominance when distance x data rate exceeds 100 Gb/s....1 Figure 2: The Impact of High Performance Computing on the Demand for Optical Links...3 Figure 3: A 2010 Data Center requires about 25 megawatts of power so energy saving technology is important....4 Figure 4: Traffic by data content vs year, both actual and forecast...11 Figure 5: The overview Graphic of the Optical Electronic TWG Roadmap Figure 5: Generic Data Transmission Environment...14 Figure 6: Cost Comparison of Copper vs. Optical by Distance and Bandwidth...15 Figure 7: Telecommunication System Capacity and Traffic over 5 decades Figure 8: Evolution of Telecommunications (>10Km) OE Structure...17 Figure 9: The Shannon Limit and Current Results of Data Transmission Rates Utilizing Optical Technologies...19 Figure 10: Illustrating the Loss in db/km vs Wavelength of Single Mode Fiber and showing the C band in which the Erbium Doped Fiber Amplifier provides amplification...20 Figure 11: An Upstream CATV architecture that modulates light sent from the Central office and returns in with information impressed on it...25 Figure 12: An FTTX architecture that transmits many wavelengths and then sends one wavelength to a customer or, more often, sends each of the wavelengths to multiple customers...26 Figure 13: Evolution of Common Transceivers and Transponders Figure 14: The Evolution of Transceiver Size to Increase Panel Data Density...32 Figure 15: Improvements in Density (Gb/s/inch), Power Use and Bandwidth Density for Various Form Factors in The Order of Their Introduction...33 Figure 16: Low cost Connectorless Package of a POF Source Figure 17: The Above POF Market Chart from IGI. Plastic Optical Fiber Market & Technology Assessment Study Figure 18: Graphic from IGI. Plastic Optical Fiber in Industrial Controls Figure 19: Typical Active Optical Cable. AOCs Do Not Utilize Optical Connectors, Only Electrical Connectors at the Ends. The AOC Fiber Bundle Also Has a Small Diameter Compared to the Electrical Equivalent...39 Figure 20: A series of Charts with Data on Active Optical Cables. From IGI...40 Figure 21: An Optical Backplane concept with both electrical and optical connectors between the cards and backplane...41 Figure 22: FlexPlane Optical Backplane by Molex...42 Figure 23: Reflex Photonics Implementation of Optical Interconnect to supplement an Electrical Backplane...43 Figure 24: A Drawer from the IBM Blue Waters Super Computer...44 Figure 25: The BlueWaters Rack Structure that holds Drawers Figure 26: A Basic Method to Implement On-Card Optical IO...45 Figure 27: Provides Some MicroPOD details; close ups of the bottom BGA pattern; a top view without the 45 o connector and ribbon fiber; an array of MicroPODS with the ribbon fiber and connector illustrating the fiber management 46

20 Sample Chapter Content Optoelectronics (4) Figure 28: A close up of the top of the MicroPOD with and without the 45 o connector and ribbon fiber...46 Figure 29: AIO-TXN-40G 40 Gb/s Surface Mount Transceiver Figure 30: An On-Card Optical Electronic Data Transmission Approach from IBM. August Figure 31: 8-Inch eaoc for Next Generation Ultrabooks, Tablets and Smartphones Figure 32: In-to and Out-of Chip SiP Package, Photo Courtesy of Reflex Photonics Inc Figure 33: Hyper Dense Optical Module from Reflex Photonics...49 Figure 34: Optical On-Card using In-to & Out-of Package Technology...50 Figure 35: Two Approaches for Waveguide Coupling Figure 36: Proposed Methods of Coupling Light Into and Out of Optical Substrates...51 Figure 37: One Current View of the Place for Optical vs Copper On-Chip Interconnect...53 Figure 38: Transceiver Shipments in units/year...55 Figure 39: Overview of the Optical Industry Financial Situation Highlighting the Limited R&D Investment Available...56 Figure 40: Transceiver Revenue by Major Market Segments Historically and as Forecast by Light Counting...57 Figure 41: FTTX Transceiver Revenue historically and forecast by Standard from Light Counting...57 Figure 42: The decline in transceiver prices over the decade ending in Figure 43: Forecast Annual AOC Revenue...58 Figure 44: A Planar Lightwave Circuit, A Passive Device that Requires No Power...64 Figure 45: A Photonic Integrated Circuit Built with a Technology That Is Compatible with CMOS Fabrication...64 Figure 46: Manufacturing Process for One Product

21 Semiconductors Organic Printed Circuit Boards Interconnect Substrates Ceramic inemi / ITRS / MIG/PSMA Packaging TWG inemi / MIG / ITRS MEMS TWG inemi / IPC / EIPC / TPCA Organic PWB TWG inemi Passives TWG inemi Board Assembly TWG inemi Roadmap inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage

22 Roadmap > 650 participants > 350 companies/organizations 18 countries from 4 continents 20 Technology Working Groups (TWGs) 6 Product Emulator Groups (PEGs) > 1900 pages of information Roadmaps the needs for

23 Opportunity to network and share ideas with the entire supply chain: 1) Industry drivers are specified in 6 different product areas (chapters). 2) 20 different technology areas are represented as chapters. 3) Cross cutting issues abound and are discussed during roadmap development as applicable. 4) Discussions within and between chapter participants typically uncover issues of common gaps and solutions. 5) Participation typically leads to a great deal of learning and understanding. 6) Roadmap participation can be of great benefit to personal growth and contribute to the person s job skills. 7) An opportunity to learn team building skills. 8) Become proficient in methods for sharing information for development of published technical information. 9) A forum for improving communication skills. 10) Project management skill enhancement is possible through chapter leadership. 11) Face to face meetings are held in conjunction with industry shows whenever possible to aid learning. 12) Opportunity to form lasting relationships with team members. Open discussion on 2015 inemi Roadmap for anyone interested in participating or learning more about the 2015 process. Thursday from 11:00 am -12:00 pm in room South Pacific H.

24 Situation Analysis

25 Situation Analysis: Technology Consumers demand for thin multifunctional products has led to increased pressure on alternative high density packaging technologies. High-density 3D packaging has become the major technology challenge SiP: Technology driver for small components, packaging, assembly processes and for high density substrates New sensors and MEMs: Expected to see exponential growth driven by portable products Motion gesture sensors expanding use of 2D-axis & 3D-axis gyroscopes Segment maturing, encouraging industry collaboration 3D IC with TSV: Driven by Performance and Size requirements 25

26 Technology Needs

27 27 Technology Needs New MEMS driven by Automotive, Medical and Cell Phone applications Thermal Management for Portable Products Development of viable rework process for Pb-free soldering Cooling Solutions for Portable Electronics (3D-TSV) Reliability Evaluation and functional testing of MEMS Testing of Energy Managed modules Functional Testing of Complex SIPs Low Temperature Processing

28 Expanded Rework Section (SnPb) Area Array and Non-Standard Package Rework Soldering Parameter Units Process Maximum package size Minimum package size Smallest type of discretes being reworked Minimum reworkable pitch Target delta T across solder joints Typical rework profile length (time) mm mm (Imperial) 0201 (Imperial) (Imperial) 0201 metric 0201 metric mm C <10 <10 <10 <10 <10 min 8 6 to 8 6 to 8 6 to 8 6 to 8 SnPb Time Above Liquidus (TAL) Number of allowable area array reworks at a specific location Type of rework (Conv./IR/Other) (Other is Laser and Vapor Phase Rework) sec # % 85/15 85/15 85/15 80/20 70/20/10 Type redress approach (Non Contact/SolderWick) % 20/80 20/80 20/80 30/70 40/60 Type of medium deposit for BGA component rework (Paste on PCB/Paste on Part/Flux only) (See Note) % 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20 28

29 Expanded Rework Section (Pb-Free) Maximum package size Minimum package size mm mm Smallest type of discretes being reworked (Imperial) 0201 (Imperial) (Imperial) 0201 metric 0201 metric Pb-free Minimum reworkable pitch Target delta T across solder joints Typical rework profile length (time) Time Above Liquidus (TAL) Number of allowable area array reworks at a specific location Type of rework (Conv./IR/Other) (Other is Laser and Vapor Phase Rework) Type redress approach (Non Contact/Solder Wick) mm C <10 <10 <10 <10 <10 min sec # % 85/15 85/15 85/15 80/20 70/20/10 % 20/80 20/80 20/80 30/70 40/60 Type of medium deposit for BGA component rework (Paste on PCB/Paste on Part/Flux only) (See Note) % 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20 Note: The use of solder paste or tacky flux will depend on the type of component being reworked. Paste is typically used to reduce the affect of component warpage causing Head-in-Pillow component soldering defects during BGA and PoP part rework. In terms of ease of use and speed of rework, tacky flux is used more even though it may have an affect first pass yield. The percentages mentioned for Paste versus Flux medium are for BGA rework and will vary dependent on the type of part being reworked. 29

30 Paradigm Shifts

31 Paradigm Shifts Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3- D): Increases flexibility Shortens design cycle Cloud connected digital devices have the potential to enable major disruptions across the industry: Major transition in business models New Power Distribution Systems for Data Centers Huge data centers operating more like utilities (selling data services) Local compute and storage growth may slow (as data moves to the cloud) Rent vs. buy for software (monthly usage fee model) Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more Sensors everywhere MEMS and wireless traffic! More Moore (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - More Than Moore.

32 912.1/105bp Product/Package Type Volume (Bn Units) SiP/MCP FORECAST Forecast Leading Suppliers/Players Stacked Die In Package ASE, SPIL, Amkor, STATS ChipPAC, Samsung, Micron, Hynix, Toshiba, SanDisk Stacked Package on Package Amkor, STATS ChipPAC, ASE, SPIL, TI, (PoP/PiP) Samsung, Renesas, Sony, Panasonic PA Centric RF Module RFMD, Skyworks, Anadigics, Renesas, TriQuint, Avago Connectivity Module (Bluetooth/WLAN) Murata, Taiyo Yuden, ACSIP, ALPS Graphics/CPU or ASIC MCP Intel, IBM, Fujitsu Leadframe Module NXP, STMicro, TI, Freescale, Toshiba, NEC, (Power/Other) Infineon, Renesas, IR, ON Semi TOTAL Courtesy of Prismark Partners

33 Internet Traffic Forecast Traffic by data content vs year, both actual and forecast. H-S= High Speed Traffic; AAA=Advanced Architecture Traffic Source: International Gatekeepers Inc. report "North American Network Traffic Forecast April, 2011"

34 34 Data Center Energy Conservation Critical A 2010 Data Center requires about 25 megawatts of power so energy saving technology is important.

35 GLOBAL MEDICAL ELECTRONICS MARKET SUMMARY Others 24% Diagnostics and Imaging 29% Others 24% Diagnostics and Imaging 26% CAAGR 4.4% Patient Monitoring 19% Medical Therapy 28% Patient Monitoring 21% Medical Therapy 29% TOTAL: $91Bn TOTAL: $113Bn Diagnostics and Imaging Medical Therapy Patient Monitoring Others Diagnostic instruments that provide high resolution pictures of structures inside the body. Example: MRI, X-ray, ultrasound Equipment used in the treatment of specific medical conditions Example: defibrillator, hearing aid Instruments used to measure and monitor a patients vital signs and other functions. Example: blood glucose, ECG All other electronics used for medical applications Example: surgical tools, test & analytical, medical IT, biochips, RFID k bes-med summary

36 TELE HEALTH AND BODY AREA NETWORKS Tele-health systems range from standalone monitors to personal alarms. Bluetooth-based body sensor networks can autonomously monitor vital signs and, in the future, deliver precise drug doses autonomously. An electronic monitoring system replaces a labor service such as a home health care attendant, nurse, or an assisted living abode. Prismark estimates that the hardware value was approximately $1.2Bn in Prismark expects growth rates in excess of 20% over the next ten years. TUNSTALL TELECARE SYSTEM /169rd MEDTRONIC MINILINK GLUCOSE SENSOR

37 inemi/itrs Collaboration Present/Future

38 ITRS / inemi Roadmap Comparison The ITRS is focused on semiconductor technology and has been a Technology Push roadmap that looks at the progress of technology and asks what products subsequently can be developed. The ITRS roadmap has utilized Moore's Law and heuristic equations as its foundation. With the options for scaling shrinking, a More-than- Moore approach is needed. The ITRS collaborates with the inemi Roadmap in several areas to drive product attribute needs down to the semiconductor technology level. The Packaging and MEMS chapters of both roadmaps are developed by a common set of leaders and subsets of participants. The inemi Technology Roadmap is focused on the business & technology areas (26) associated with the electronics industries global supply chain. It is a Market Pull roadmap that defines desired product attributes & asks what technologies are needed to support them. inemi s large OEM membership is a benefit and an advantage in needs identification. The inemi Roadmap collaborates with 13 other organizations including the IPC and ITRS in developing it s chapters. The roadmap is the starting point of the inemi process for identifying technology or business gaps. The inemi gap identification process is distinctive and sets the inemi roadmap apart from others.

39 Design and System Drivers ITRS-iNEMI Domain Space Market requirements inemi (emulators) Tech requirements ITRS (Drivers) Chip level System level *Source: ITRS Design/System Drivers TWG Chairman, Dr. Juan-Antonio Carballo

40 Present ITRS (International Technology Roadmap For Semiconductors) shares leadership and participants with the inemi Roadmap Packaging & Component Substrates TWG and the MEMS TWG. The ITRS is fully updated bi-annually and tables annually. The ITRS Packaging chapter focuses on semiconductor fabrication and packaging while the inemi chapter focuses on the impacts of semiconductor packaging and component substrates evolution on assembly and test issues. Some inemi PEGs (Product Emulator Groups) provide key attribute drivers for the ITRS Design and System Drivers ITWGs (International Technology Working Groups). The ITRS completed their 2012 table updates and are now working their 2013 total roadmap update becoming the input for the inemi 2015 Roadmap. inemi and the ITRS co-hosted (with IPC participating) a one-day workshop on April 24 th, 2013 in Lyon, France. 40

41 Future Develop graphic to show holistic links For these linked TWGs provide URL links in roadmap chapters Leverage ITRS semiconductor focus and inemi system focus to facilitate collaboration between key chapters to help effect a holistic approach to technology development Emphasize need for industrial cooperation to develop optimized system solutions to today s brick walls Expand and formalize the process for inemi PEGs (Product Emulator Groups) providing key attribute drivers for the ITRS Design and System Drivers ITWGs (International Technology Working Groups). inemi and the ITRS will again co-sponsor a one-day workshop in Frankfort, Germany this April to discuss advancing the collaborative relationship in More Than Moore or heterogeneous integration in future roadmaps. The entire ITRS is available at: 41

42 Next Steps

43 Next Steps: Identify Initiatives to Close Gaps Project Completion Technology Evolution Roadmap Product Needs Global Participation Available to Market Place Competitive Solutions inemi Users & Suppliers Regional Collaboration Implementation Government Research Projects Disruptive Technology Academia Gap Analysis/ Technical Plan Industry Solution Needed No Work Required or Outsourced

44 Technical Plan for Members 5 Year Plan for Implementation Implementation Plan for Key Areas Areas selected by TC Plans developed and Prioritized by Members 2013 Plan Covers 7 Project Areas 2013 Technical Plan (inemi Members Only)

45 2013 Research Priorities Chapter 1: Introduction 2013 Research Priorities Chapter 2: Research Needs to support inemi Technology Implementation Groups (TIGs) and current Projects Chapter 3: Emerging Technologies Chapter 4: Research Priorities Summarized by Research Area Design Manufacturing Processes Materials & Reliability Sustainability Summary Chapter 5: Conclusions and Recommendations Appendixes

46 2015 Roadmap Schedule 3Q2013: Recruit Product Sector Champions, teams and refine data charts/begin 2015 Roadmap Newsletter & send 2013 PEG chapters 3/4Q13: Product Sector Champions Develop Emulators September 16, 2013 Teleconference with P.E. Group Chairs September 27, 2013 Web based meeting TWG/PEG Chairs (key attributes) October 16, 2013 SMTAI Presentation on 2015 Plans October 17, Roadmap PEG Kick-off with PEG/TWG/TC at SMTAI 2013 Roadmap chapter, format, Exec. Summary ed to each TWG chair (Word) 1/3/2014 Organizing Teleconference with TWG Chairs 1/10/2014: Feb 19, PEG Workshop/TWG Kick-off Agilent Technologies, Santa Rosa, CA Product Sector Tables Complete PEG Chapter rough drafts written Cross cut issues are initially addressed April 15, 2014 TC/PEG chapter status review meeting using WebEX May 13, 2014 Telecon With TWG Chairs, Preliminary PEG Chapters Due 46 46

47 2015 Roadmap Schedule - Continued May 27, 2014 N.A. RM WS - Open Roadmap TWG Presentations in Orlando, FL (ECTC) June 11, 2014 European Roadmap Workshop/Webinar 9:00 AM EDT June 18, 2014 Asian Roadmap Workshop/Webinar 8:00 PM EDT July 14, 2014 TWG Drafts Due for TC Review August 20-21, 2014 TC Face-to-Face Review with TWG Chairs at IBM in RTP, N.C. September 22, 2014 Final Chapters of Roadmap Due October 2, 2014 TC Briefing/SMTA at SMTAI (Rosemont, Illinois) October 31, 2014 Edit, Prepare Appendix A-D, Executive Summary November 20, 2014 Go To Press December 5, 2014 Ship to Members April TBD, 2015 Global industry roadmap presentations via webinars 47 47

48 48 Completing the 2013 inemi Roadmap Cycle 2013 inemi Roadmap Development Cycle is wrapped up! inemi Technology Plan Completed & available to members inemi Free Research Priorities Document Completed & available at Roadmap Available to Members and industry now: Order the 2013 inemi Roadmap flash drive at Individual roadmap chapters are also available as a PDF document at Also available at IPC On-line Bookstore 2015 inemi Roadmap Kickoff held February 19-20, 2014 at Agilent Technologies, Santa Rosa, CA Contact Chuck Richardson for more details at crichardson@inemi.org

49 Roadmap Contacts: Chuck Richardson Grace O Malley gomalley@inemi.org Bill Bader Bill.bader@inemi.org