Large Area, Flexible Electronics TWG. Chair: Dan Gamota, Jabil

Size: px
Start display at page:

Download "Large Area, Flexible Electronics TWG. Chair: Dan Gamota, Jabil"

Transcription

1 Large Area, Flexible Electronics TWG Chair: Dan Gamota, Jabil

2 Large Area Flexible Electronics Roadmap History 09/2005 inemi Stakeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG 2006 Flexible Electronics TWG formed st Edition inemi Roadmap released nd Edition inemi Roadmap released rd Edition inemi Roadmap released th Edition inemi Roadmap released th Edition inemi Roadmap released 1 st Edition Released at APEX 2007

3 Large Area Flexible Electronics Roadmap Contents

4 Roadmap Contents Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers Functional Inks: Technology Requirements Substrates: Technology Requirements Packaging/Barriers: Technology Requirements Manufacturing Platforms and Processing Equipment: Technology Requirements In-line Characterization Tools: Technology Requirements Off-line Characterization Tools: Technology Requirements Devices and Circuits: Technology Requirements Flexible Electronics: Technology Requirements Reliability: Technology Requirements Standards: Technology Requirements

5 inemi Large Area Flexible Electronics Roadmap TWG Group Participants Core group sustaining TWG (participated in multiple chapter editions) Continually seeking new participants Engaged» Singapore representatives» Germany/EU representatives» US representatives» Sought representatives from China 2015 Edition What is new? Identification of flexible hybrid electronics (FHE) based products as near-term commercialization opportunity medical, automotive, wearables/consumer. Updated sections 4

6 inemi Large Area Flexible Electronics Roadmap Drivers of Change Market Increased consumer demand for novel form factor wearable and flexible products. Growing demand by consumer electronics, automotive, and aerospace industries for touch control, lighting, sensors, low-frequency wireless devices, innovative signage, photovoltaic, and flexible displays. Commercialization and near-commercialization of flexible hybrid electronics (FHE) products which combine printed electronics with conventional electronics. 5

7 inemi Large Area Flexible Electronics Roadmap Drivers of Change Government Singapore, Japan, EU, Korea, and China continue to make wellpublicized commitments by funding multi-million dollar precompetitive and competitive technology development efforts. US - On February 10, 2015 the US Department of Defense released a solicitation for proposals to initiate and sustain a Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) as part of the National Network for Manufacturing Innovation ( 6

8 inemi Large Area Flexible Electronics Roadmap Drivers of Change Technology Flexible Hybrid Electronics - electronics components, modules, and products that comprise 1) thinned, compliant elements such as but not limited to electronic, electro-mechanical, electro-optical, electro-chemical, and electro-biological that are fabricated using traditional processes (e.g. photolithography, etching, grinding, plasma, vacuum deposition) and 2) elements that are fabricated using a printing process (e.g. gravure, flexography, needle dispensing, ink jet) which are integrated on a flexible substrate (e.g. metal, organic, or inorganic). Availability of higher performance OLED, OPV, and semiconductor (p and n type) materials: solution processable small molecule, inorganic precursors, nanoscale inorganic semiconductor materials, and other novel inorganic and organic dispersions. Commercialization/near-commercialization of enhanced barrier materials. Commercialization/near-commercialization of higher performance conductive inks, dielectric materials, and substrates. Development of large area, lower-cost manufacturing processes leveraging roll-to-roll equipment infrastructure. 7

9 inemi Large Area Flexible Electronics Roadmap Drivers of Change Standards IPC published two standards:1) IPC/JPCA-4921 Requirements for Printed Electronics Base Materials and 2) IPC/JPCA-4591 Requirements for Printed Electronics Functional Materials. Also, a design guideline was published: IPC/JPCA 2291 Design Guidelines for Printed Electronics. IEC TC119 Printed Electronics Standards Technical Committee has established several Working Groups as well as Ad-hoc Groups to identify potential standards topics. Also, TC119 has involved other organizations to act as advisors during the development of standards e.g. IPC and COLAE. IEEE maintains IEEE Test Methods for the Characterization of Organic Transistors and Materials and IEEE Standard for Test Methods for the Characterization of Organic Transistor-Based Ring Oscillators. 8

10 Shift in Roadmap Topic Participation Movement Along Supply Chain Materials Substrates Packaging Processing/ Equipment Platforms Testing Equipment Applications 2007 Roadmap greatest participation in Materials Roadmap greatest participation in Substrates and Processing Equipment Roadmap greatest participation in Processing Equipment and Applications Roadmap greatest participation in Applications and Standards Roadmap greatest participation in Applications and Standards.

11 Products and Applications Lighting & Displays Sensors Energy

inemi Roadmap Facilitates Commercialization of Large Area Flexible Electronics Applications

inemi Roadmap Facilitates Commercialization of Large Area Flexible Electronics Applications inemi Roadmap Facilitates Commercialization of Large Area Flexible Electronics Applications From Concept to Product many routes can be taken and a roadmap simplifies the process Masahiro Tsuriya, inemi

More information

inemi Flexible Electronics Roadmap

inemi Flexible Electronics Roadmap inemi Flexible Electronics Roadmap From Concept to Product many routes can be taken and a roadmap simplifies the process Daniel Gamota, Chair Margaret Joyce, Co-Chair Jie Zhang, Co-Chair Ch inemi Mission

More information

R&D Requirements from the 2004 inemi Roadmap. April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi

R&D Requirements from the 2004 inemi Roadmap. April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi R&D Requirements from the 2004 inemi Roadmap April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered Overview of inemi and the 2004 Roadmap Situation Analysis Highlights from the

More information

National Centre for Flexible Electronics

National Centre for Flexible Electronics National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances

More information

Organic & Printed Electronics. Speaker & Co-chair: Dr. Jie Zhang, Motorola Chair: Dr. Daniel Gamota, Motorola Co-chair: Dr.

Organic & Printed Electronics. Speaker & Co-chair: Dr. Jie Zhang, Motorola Chair: Dr. Daniel Gamota, Motorola Co-chair: Dr. Organic & Printed Electronics peaker & Co-chair: Dr. Jie Zhang, Motorola Chair: Dr. Daniel Gamota, Motorola Co-chair: Dr. Jan Obrzut, NIT What If?? A printing press could produce electronic products ondemand...production

More information

Nanotechnology and its effect on Electronics Manufacturing

Nanotechnology and its effect on Electronics Manufacturing Nanotechnology and its effect on Electronics Manufacturing Dr. Alan Rae Vice President, Market & Business Development, NanoDynamics, Inc. Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered

More information

GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS

GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS SMC057C August Margareth Gagliardi Project Analyst ISBN: 1-62296-338-5 BCC Research 49 Walnut Park, Building 2 Wellesley, MA 02481

More information

Holst Centre Wireless Autonomous Sensor Technologies & Flexible Electronics

Holst Centre Wireless Autonomous Sensor Technologies & Flexible Electronics February 10, 2011 Holst Centre Wireless Autonomous Sensor Technologies & Flexible Electronics Presentation overview -General overview -Research focus < 4 Holst Centre: a solid partner in research Independent,

More information

Accelerating Scale Up of Large Area Electronics

Accelerating Scale Up of Large Area Electronics Accelerating Scale Up of Large Area Electronics Duncan Lindsay Business Development Director, CPI 2015 Centre for Process Innovation Limited. All Rights Reserved. Who are CPI? CPI is a UK technology innovation

More information

Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire

Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire 2017. 04. 25 Seung-Hyun Lee, PhD Senior Researcher Dept. Printed Electronics Korea Institute

More information

Roadmap & Research Priorities Created by Alan Rae

Roadmap & Research Priorities Created by Alan Rae Roadmap & Research Priorities 2011 Created by Alan Rae Topics Background inemi operation; Source(s) and Fit of Research Roadmap Research Priorities by Research Areas Design Manufacturing Materials & Reliability

More information

Roadmap for Wearable Standards

Roadmap for Wearable Standards Roadmap for Wearable Standards Jesse S. Jur Department of Textile Engineering, Chemistry & Science next (nano-extended textiles) research group Expanding the Influence of Nanotechnology in Textiles 1 2

More information

Organic and flexible Electronics in Saxony www.invest-in-saxony.com WElCOME Organic electronics are based on the discovery that specific organic materials possess semiconducting properties. Functional

More information

ORGANIC ELECTRONICS: PHOTOLITHOGRAPHY OR PRINTING. Giles Lloyd Flex Europe Conference, 25th October 2016

ORGANIC ELECTRONICS: PHOTOLITHOGRAPHY OR PRINTING. Giles Lloyd Flex Europe Conference, 25th October 2016 ORGANIC ELECTRONICS: PHOTOLITHOGRAPHY OR PRINTING Giles Lloyd Flex Europe Conference, 25th October 2016 Organic Electronics: Photoligthography or Printing? Lithography Printing Enabling flexible TFT sheet-fed

More information

Nanotechnology Standards The New Frontier

Nanotechnology Standards The New Frontier Nanotechnology Standards The New Frontier Alan Rae VP Market & Business Devt. NanoDynamics Inc Director of Research, inemi Inc. ANSI-ISO TC229 Committee ieee Nano Standards Roadmap Committee JISSO North

More information

2017 inemi Roadmap - Highlights. Steve Payne, inemi

2017 inemi Roadmap - Highlights. Steve Payne, inemi 2017 inemi Roadmap - Highlights Steve Payne, inemi Highlights of the inemi Roadmap inemi inemi 2017 Roadmap okey Trends oiot omedical oa&d inemi Collaborative Projects Summary 2 inemi International Electronics

More information

Accelerating Growth and Cost Reduction in the PV Industry

Accelerating Growth and Cost Reduction in the PV Industry Accelerating Growth and Cost Reduction in the PV Industry PV Technology Roadmaps and Industry Standards An Association s Approach Bettina Weiss / SEMI PV Group July 29, 2009 SEMI : The Global Association

More information

Printable Electronics

Printable Electronics Printable Electronics Printable Electronics The Centre for Process Innovation From innovation to commercialisation The Centre for Process Innovation From innovation to commercialisation The High Value

More information

Roadmaps: Guides to Opportunities & Job Creation. Richard Otte President Promex Industries Inc. November 1, 2016

Roadmaps: Guides to Opportunities & Job Creation. Richard Otte President Promex Industries Inc. November 1, 2016 Roadmaps: Guides to Opportunities & Job Creation Richard Otte President Promex Industries Inc. November 1, 2016 TOPICS Promex Industries Perspective Roadmap & Promex Optical Roadmaps for Data Communications

More information

Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology

Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Scott Goodwin 1, Erik Vick 2 and Dorota Temple 2 1 Micross Advanced Interconnect Technology Micross

More information

21 st Annual Needham Growth Conference

21 st Annual Needham Growth Conference 21 st Annual Needham Growth Conference Investor Presentation January 15, 2019 Safe Harbor Statement The information contained in and discussed during this presentation may include forward-looking statements

More information

BEYOND RoHS: EFFORTS TO STRENGTHEN THE ELECTRONICS MANUFACTURING SUPPLY CHAIN

BEYOND RoHS: EFFORTS TO STRENGTHEN THE ELECTRONICS MANUFACTURING SUPPLY CHAIN BEYOND RoHS: EFFORTS TO STRENGTHEN THE ELECTRONICS MANUFACTURING SUPPLY CHAIN 0 Robert C. Pfahl, Jr. International Electronics Manufacturing Initiative (inemi) Joe Johnson Cisco Systems, Inc Outline Introduction

More information

inemi 2009 Roadmap Process Overview Chuck Richardson Productronica November 14, 2007

inemi 2009 Roadmap Process Overview Chuck Richardson Productronica November 14, 2007 inemi 2009 Roadmap Process Overview Chuck Richardson Productronica November 14, 2007 Some Definitions TWG - Technical Working Group Develops the roadmaps Presently 20 groups TIG - Technology Integration

More information

Printed Electronics. Applications

Printed Electronics. Applications Printed Electronics Research Through University-Industry Partnerships Outline Background on Printed Electronics (PE) Corporate Partnerships Raytheon UMass Lowell Research Institute (RURI) Printed Electronics

More information

EPIC s landscape on PICs (visible, short- near- and mid- IR)

EPIC s landscape on PICs (visible, short- near- and mid- IR) EPIC s landscape on PICs (visible, short- near- and mid- IR) The Future Photonics Hub Industry Day 12 September 2016 Southampton Jose Pozo Director of Technology and Innovation EPIC jose.pozo@epic-assoc.com

More information

Application Interest Group (AIG) Process Overview. Dr. Robert C. Pfahl Director of Roadmapping

Application Interest Group (AIG) Process Overview. Dr. Robert C. Pfahl Director of Roadmapping Application Interest Group (AIG) Process Overview Dr. Robert C. Pfahl Director of Roadmapping Outline Overview of IPSR AIG Process Roadmapping Technical Planning Application Interest Group (AIG) Formation

More information

Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November

Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November 2006 Forward Looking Statement The presentation today may

More information

A Perspective on Semiconductor Equipment. R. B. Herring March 4, 2004

A Perspective on Semiconductor Equipment. R. B. Herring March 4, 2004 A Perspective on Semiconductor Equipment R. B. Herring March 4, 2004 Outline Semiconductor Industry Overview of circuit fabrication Semiconductor Equipment Industry Some equipment business strategies Product

More information

Advanced Manufacturing Innovation: Tested concepts & emerging models

Advanced Manufacturing Innovation: Tested concepts & emerging models Advanced Manufacturing Innovation: Tested concepts & emerging models Krystyn J. Van Vliet Singapore- MIT Research Alliance for Research & Technology Professor Materials Science & Engineering and Biological

More information

PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES. Simon Perraud, Ph.D. Vice president for European affairs

PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES. Simon Perraud, Ph.D. Vice president for European affairs PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES Simon Perraud, Ph.D. Vice president for European affairs ABOUT LITEN Liten is the research institute of CEA devoted to clean energy

More information

2010 IRI Annual Meeting R&D in Transition

2010 IRI Annual Meeting R&D in Transition 2010 IRI Annual Meeting R&D in Transition U.S. Semiconductor R&D in Transition Dr. Peter J. Zdebel Senior VP and CTO ON Semiconductor May 4, 2010 Some Semiconductor Industry Facts Founded in the U.S. approximately

More information

Dispenser printed proximity sensor on fabric for creative smart fabric applications

Dispenser printed proximity sensor on fabric for creative smart fabric applications Dispenser printed proximity sensor on fabric for creative smart fabric applications Yang Wei, Russel Torah, Yi Li and John Tudor University of Southampton, Southampton, United Kingdom, SO17 3BJ Tel: +44(0)23

More information

Advancing Consumer Packaging Through Printable Electronics

Advancing Consumer Packaging Through Printable Electronics IPST Executive Conference, Atlanta, GA March 9-10, 2011 Advancing Consumer Packaging Through Printable Electronics Bernard Kippelen Professor, School of Electrical and Computer Engineering Director, Center

More information

NextFlex: Enabling a Domestic Manufacturing Ecosystem for Flexible Hybrid Electronics (Extended Abstract)

NextFlex: Enabling a Domestic Manufacturing Ecosystem for Flexible Hybrid Electronics (Extended Abstract) NextFlex: Enabling a Domestic Manufacturing Ecosystem for Flexible Hybrid Electronics (Extended Abstract) Benjamin J. Leever*, Eric W. Forsythe + *Air Force Research Laboratory, 2179 12th St., B652/R122,

More information

Emerging Print Technologies & Applications

Emerging Print Technologies & Applications Emerging Print Technologies & Applications By: Pivotal Resources USA, Inc. 2901 Richmond Road #353 Lexington, KY 40509 (859) 230-0093 2013 PRIMIR/NPES EMERGING PRINT TECHNOLOGIES & APPLICATIONS TABLE OF

More information

Horizon 2020 and Photonics

Horizon 2020 and Photonics Brussels, 13 December 2013 Horizon 2020 and Photonics Thomas Skordas Head of the Photonics Unit, DG CONNECT European Commission Thomas.Skordas@ec.europa.eu Horizon 2020 Horizon 2020 Budget: 78.6 B (in

More information

The Center for Emerging and Innovative Sciences University of Rochester September 5, 2013

The Center for Emerging and Innovative Sciences University of Rochester September 5, 2013 Manufacturing Technology Roadmaps for Photonics A Proposal to the NIST Advanced Manufacturing Consortia Program (AMTech) In Support of the National Photonics Initiative The Center for Emerging and Innovative

More information

ICT 29 : Development of novel materials and systems for OLED lighting

ICT 29 : Development of novel materials and systems for OLED lighting ICT 29 : Development of novel materials and systems for OLED lighting Martyn Chamberlain Photonics Unit DG CONNECT - European Commission 14 February 2014 Photonics PPP: Overview of Calls 2014-15 (28 M

More information

EU Research project proposals (call for Finnish companies)

EU Research project proposals (call for Finnish companies) EU Research project proposals (call for Finnish companies) 11th EEMELI Workshop 29 th August 2012 Jukka Hast Research Professor VTT Technical Research Centre of Finland 04/10/2012 2 General ICT theme work

More information

inemi Roadmap 2017 Alan Rae

inemi Roadmap 2017 Alan Rae inemi Roadmap 2017 Alan Rae Topics What s changing in Electronics? The inemi roadmap process The 2017 Roadmap Internet of Things Chapter How can I get involved? Roadmaps Lewis Carroll If you don t know

More information

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration

More information

Flexible Electronics: Revolutionary Products and Career Opportunities for Creative Engineers

Flexible Electronics: Revolutionary Products and Career Opportunities for Creative Engineers Flexible Electronics: Revolutionary Products and Career Opportunities for Creative Engineers TAPPI - PIMA Student Summit 2011 Michael Ciesinski President January 15, 2011 Microelectronics changed the world

More information

OLAE in Horizon 2020 LEIT ICT WP DG CONNECT - European Commission

OLAE in Horizon 2020 LEIT ICT WP DG CONNECT - European Commission OLAE in Horizon 2020 LEIT ICT WP 2014-15 DG CONNECT - European Commission 11 December 2013 Horizon 2020, Industrial Leadership (LEIT) Priority An Overview of Calls related to OLAE LEIT ICT 3 2014 Advanced

More information

IMI Labs Semiconductor Applications. June 20, 2016

IMI Labs Semiconductor Applications. June 20, 2016 IMI Labs Semiconductor Applications June 20, 2016 Materials Are At the Core of Innovation in the 21st Century Weight Space Flexibility Heat Management Lightweight Energy Efficient Temperature Energy Efficient

More information

UNCLASSIFIED FISCAL YEAR (FY) 2009 BUDGET ESTIMATES

UNCLASSIFIED FISCAL YEAR (FY) 2009 BUDGET ESTIMATES Exhibit R-2, RDT&E Budget Item Justification Date: February 2008 R-1 Item Nomenclature: PROGRAM: Small Business Innovation Research PROGRAM ELEMENT: 0605502S Cost ($ in millions) FY 2007 FY 2008 FY 2009

More information

The Future for Printed Electronics

The Future for Printed Electronics The Future for Printed Electronics Jon Helliwell National Centre for Printable Electronics 24 October, 2013 Copyright CPI 2013. All rights reserved What is Printed Electronics? Organic and printed electronics

More information

Electronic Material Systems

Electronic Material Systems Electronic Material Systems Barry Russell Operating Vice President 1 Safe Harbor Statement Today s presentations may contain forward-looking statements within the meaning of the Private Securities Litigation

More information

Saxony the Organic Electronics State

Saxony the Organic Electronics State Saxony the Organic Electronics State Page 1 Agenda 1. History 2. The situation today: a major cluster in Europe 3. Saxony a dynamic place to be 4. OES at your service 5. Why to join Page 2 Downtown Dresden

More information

Henkel solutions enabling printed electronics. Dr. Crystal Yang

Henkel solutions enabling printed electronics. Dr. Crystal Yang Henkel solutions enabling printed electronics Dr. Crystal Yang Agenda 1. Introduction Henkel 2. Trends in Printed Electronics 3. Novel materials enabling Printed Electronics New high speed printable silver

More information

Consortium Capabilities

Consortium Capabilities Consortium Capabilities The driver in advanced materials development is to create products with competitive advantages. Products must continuously become faster, lighter and cheaper and must provide additional

More information

Flexible Hybrid Electronics (FHE) Overview

Flexible Hybrid Electronics (FHE) Overview Flexible Hybrid Electronics (FHE) Overview in cooperation with NextFlex Manufacturing Institute Date: 12 March 2018 By: John Kornitsky CMTC-FHE Practice Lead @ NextFlex Mfg USA Institute Imagine... If

More information

Reverse-offset Printing Process and Equipment for Fine Patterning and Precision Overlay

Reverse-offset Printing Process and Equipment for Fine Patterning and Precision Overlay Reverse-offset Printing Process and Equipment for Fine Patterning and Precision Overlay Dongwoo Kang (Ph.D) June 22, 2017 (Monterey) Korea Institute of Machinery & Materials (KIMM) Demand on FPE What is

More information

WP Topic LEIT ICT 3 Advanced TOLAE technologies

WP Topic LEIT ICT 3 Advanced TOLAE technologies Brussels, 14 February 2014 Information and Networking Day WP 2014-15 Topic LEIT ICT 3 Advanced TOLAE technologies Philippe Reynaert and Andreas Lymberis Project Officer, Unit A1 and A4, DG CONNECT European

More information

Printed Electronics Product Types & Markets. Vince Cahill, VCE Solutions

Printed Electronics Product Types & Markets. Vince Cahill, VCE Solutions Printed Electronics Product Types & Markets Vince Cahill, VCE Solutions Printed Electronic Product Types Printed circuits boards Printed logic / memory Printed batteries Membrane switches Photovoltaics

More information

IC1301 -WiPE. Wireless Power Transmission for Sustainable Electronics. SWG4.1: Space Applications. 25 March 2014

IC1301 -WiPE. Wireless Power Transmission for Sustainable Electronics. SWG4.1: Space Applications. 25 March 2014 IC1301 -WiPE Wireless Power Transmission for Sustainable Electronics SWG4.1: Space Applications 25 March 2014 Alexandru Takacs CNRS LAAS, Toulouse, France University of Toulouse III Paul Sabatier, France

More information

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Pooran Joshi, Stephen Killough, and Teja Kuruganti Oak Ridge National Laboratory FIIW 2015 Displays and PV

More information

CRC turns to printable electronics to shape Canada s 5G future A Smart Building Use Case

CRC turns to printable electronics to shape Canada s 5G future A Smart Building Use Case CRC turns to printable electronics to shape Canada s 5G future A Smart Building Use Case Communication Research Centre Canada Find us on intelliflex.org 613.505.4775 caba.org 613.686.1814 Copyright intelliflex

More information

Overview of Auburn University

Overview of Auburn University Overview of Auburn University David M. Bevly Associate Professor Director of the GPS and Vehicle Dynamics Lab dmbevly@eng.auburn.edu (334) 844-3446 Auburn RESEARCH Peaks of Excellence Seven University

More information

EMERGING SUBSTRATE TECHNOLOGIES FOR PACKAGING

EMERGING SUBSTRATE TECHNOLOGIES FOR PACKAGING EMERGING SUBSTRATE TECHNOLOGIES FOR PACKAGING Henry H. Utsunomiya Interconnection Technologies, Inc. Suwa City, Nagano Prefecture, Japan henryutsunomiya@mac.com ABSTRACT This presentation will outline

More information

Economic Analysis of Technology Infrastructure Needs for Advanced Manufacturing Roll-to-Roll Manufacturing

Economic Analysis of Technology Infrastructure Needs for Advanced Manufacturing Roll-to-Roll Manufacturing NIST GCR 16-008 Economic Analysis of Technology Infrastructure Needs for Advanced Manufacturing Roll-to-Roll Manufacturing August 2016 Prepared for Prepared by Economic Analysis Office National Institute

More information

National Instruments Accelerating Innovation and Discovery

National Instruments Accelerating Innovation and Discovery National Instruments Accelerating Innovation and Discovery There s a way to do it better. Find it. Thomas Edison Engineers and scientists have the power to help meet the biggest challenges our planet faces

More information

ITRS Update (and the European situation) Mart Graef Delft University of Technology

ITRS Update (and the European situation) Mart Graef Delft University of Technology ITRS Update (and the European situation) Mart Graef Delft University of Technology Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2

More information

The 3D silicon leader. March 2012

The 3D silicon leader. March 2012 The 3D silicon leader March 2012 IPDiA overview Company located in Caen, Normandy, France Dedicated to manufacturing of integrated passive devices Employing 100 people and operating own wafer fab Strong

More information

A Presentation to the National Academies July 29, Larry W. Sumney President/CEO Semiconductor Research Corporation1

A Presentation to the National Academies July 29, Larry W. Sumney President/CEO Semiconductor Research Corporation1 A Presentation to the National Academies July 29, 2009 Larry W. Sumney President/CEO Semiconductor Research Corporation1 What is SRC? World s leading consortium funding collaborative university research

More information

PERSPECTIVES FOR DISRUPTIVE 200MM/8-INCH GAN POWER DEVICE AND GAN-IC TECHNOLOGY DR. DENIS MARCON SR. BUSINESS DEVELOPMENT MANAGER

PERSPECTIVES FOR DISRUPTIVE 200MM/8-INCH GAN POWER DEVICE AND GAN-IC TECHNOLOGY DR. DENIS MARCON SR. BUSINESS DEVELOPMENT MANAGER PERSPECTIVES FOR DISRUPTIVE 200MM/8-INCH GAN POWER DEVICE AND GAN-IC TECHNOLOGY DR. DENIS MARCON SR. BUSINESS DEVELOPMENT MANAGER What I will show you today 200mm/8-inch GaN-on-Si e-mode/normally-off technology

More information

Work package 4: Towards a virtual foundry

Work package 4: Towards a virtual foundry D4.5 WP4 September 2014 COLAE: Commercialization Clusters of OLAE Work package 4: Towards a virtual foundry Public Final Report COLAE 2013 Project name: Commercialization Clusters of OLAE Acronym: COLAE

More information

Overview of USP s Research and Innovation Activities. Michael Ambrose Ph.D. Director, Research and Innovation

Overview of USP s Research and Innovation Activities. Michael Ambrose Ph.D. Director, Research and Innovation Overview of USP s Research and Innovation Activities Michael Ambrose Ph.D. Director, Research and Innovation USP is committed to Tailoring programs to address stakeholder priorities Fostering next generation

More information

Printed Electronics: success stories and future commercial applications

Printed Electronics: success stories and future commercial applications Printed Electronics: success stories and future commercial applications Dr Guillaume Chansin @gchansin June 2017 Helping you profit from emerging technologies Advantages of printed electronics Mass production

More information

EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS

EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS AVM091B November 2014 Andrew McWilliams Project Analyst ISBN: 1-56965-999-0 BCC Research 49 Walnut Park, Building 2 Wellesley, MA

More information

The Centre for Process Innovation

The Centre for Process Innovation The Centre for Process Innovation The Centre for Process Innovation From innovation to commercialisation The future inspired... The High Value Manufacturing Catapult is a partnership between industry and

More information

Industrial Innovation Information Days Brussels 3-4 October 2017

Industrial Innovation Information Days Brussels 3-4 October 2017 Industrial Innovation Information Days Brussels 3-4 October 2017 NMBP Programme Parallel Sessions OPEN INNOVATION TEST BEDS Calls 2018/2019 Helene CHRAYE, HoU Unit D3 DG Research & Innovation A joint presentation

More information

Smart Cities. Smart Cities Indicator Survey Highlights

Smart Cities. Smart Cities Indicator Survey Highlights Smart Cities Smart Cities Indicator Survey Highlights 2017 Executive Summary 150 Leaders 12 Countries Smart City Program Offices shaping smart city initiatives Key drivers Economic development Public safety

More information

OE-A Highlights. LOPEC 2017 Main Press Conference. March 29, 2017 ICM, Messe München. Dr. Jeremy Burroughes

OE-A Highlights. LOPEC 2017 Main Press Conference. March 29, 2017 ICM, Messe München. Dr. Jeremy Burroughes Image source: Holst Centre OE-A Highlights LOPEC 2017 Main Press Conference March 29, 2017 ICM, Messe München Dr. Jeremy Burroughes Chair OE-A Board CTO Cambridge Display Technology A working group within

More information

Accelerating Collective Innovation: Investing in the Innovation Landscape

Accelerating Collective Innovation: Investing in the Innovation Landscape PCB Executive Forum Accelerating Collective Innovation: Investing in the Innovation Landscape How a Major Player Uses Internal Venture Program to Accelerate Small Players with Big Ideas Dr. Joan K. Vrtis

More information

Focus Group on Smart Sustainable Cities

Focus Group on Smart Sustainable Cities Focus Group on Smart Sustainable Cities Cristina Bueti Adviser & ITU-T Focal Point for Latin America Some city facts Cities account for about two-thirds of global energy demand. Buildings produce a fifth

More information

Company Profile. Cool Laser Machining.

Company Profile. Cool Laser Machining. Company Profile Cool Laser Machining www.synova.ch Innovative Laser Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the-art cutting and

More information

SEMI Connects: An Overview of SEMI Worldwide. Theresia Fasinski - Manager Membership Relations, SEMI Europe

SEMI Connects: An Overview of SEMI Worldwide. Theresia Fasinski - Manager Membership Relations, SEMI Europe SEMI Connects: An Overview of SEMI Worldwide Theresia Fasinski - Manager Membership Relations, SEMI Europe SEMI Connects to Advance a Global Industry Mission SEMI provides industry stewardship and engages

More information

Clusters in EUREKA > 2

Clusters in EUREKA > 2 Clusters in EUREKA > 2 Source: EUREKA 25 year overview (2011) EUREKA clusters, status end 2011: 120 running projects with a total effort of more than 15000 PY and a total budget of more than 2 B Labelled

More information

International Cooperation for Small Satellite Development

International Cooperation for Small Satellite Development International Cooperation for Small Satellite Development Milind Pimprikar, Rick Earles CANEUS International Andrew Quintero The Aerospace Corporation Fredrik Bruhn Angstrom Aerospace CANEUS Background

More information

EU's contribution to research and innovation in Electronics

EU's contribution to research and innovation in Electronics EU's contribution to research and innovation in Electronics Henri.RAJBENBACH@ec.europa.eu Nikolaos.KYRLOGLOU@ec.europa.eu European Commission DG CONNECT (not legally binding presentation) SEMICON Europa-Flex

More information

Low-power carbon nanotube-based integrated circuits that can be transferred to biological surfaces

Low-power carbon nanotube-based integrated circuits that can be transferred to biological surfaces SUPPLEMENTARY INFORMATION Articles https://doi.org/10.1038/s41928-018-0056-6 In the format provided by the authors and unedited. Low-power carbon nanotube-based integrated circuits that can be transferred

More information

shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS

shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS WHO ARE WE? XTPL S.A. is a company operating in the nanotechnology segment. The interdisciplinary team of XTPL develops on a global scale

More information

Follow the Yellow Brick Road

Follow the Yellow Brick Road NDCEE National Defense Center for Environmental Excellence National Defense Center for Environmental Excellence TRANSFERRING TECHNOLOGY SOLUTIONS Supporting Readiness, Sustainability, and Transformation

More information

Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems

Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems Herzlich willkommen Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium Sören Fricke Section Head Large Area & Flexible Systems Agroscope Tänikon, 05.09.2017 Motivation Printed Sensors can be

More information

Position Paper on Horizon ESFRI Biological and Medical Research Infrastructures

Position Paper on Horizon ESFRI Biological and Medical Research Infrastructures Position Paper on Horizon 2020 ESFRI Biological and Medical Research Infrastructures Executive summary The Biological and Medical Research Infrastructures welcome the European Commission proposal on Horizon

More information

RIT. Printing. Project Goals. Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Metal Nanoparticles

RIT. Printing. Project Goals. Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Metal Nanoparticles Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Metal Nanoparticles Bruce E. Kahn Rochester Institute of Technology bkahn@mail.rit.edu http://www.rit.edu/~bekpph/ RIT

More information

NASA TA-12 Roadmap Review: Manufacturing and Cross Cutting

NASA TA-12 Roadmap Review: Manufacturing and Cross Cutting NASA TA-12 Roadmap Review: Manufacturing and Cross Cutting Dr. Ming C. Leu Keith and Pat Bailey Missouri Distinguished Professor Director, Center for Aerospace Manufacturing Technologies Director, Intelligent

More information

Organic Packaging Substrate Workshop Overview

Organic Packaging Substrate Workshop Overview Organic Packaging Substrate Workshop Overview Organized by: International Electronics Manufacturing Initiative (inemi) Mario A. Bolanos November 17-18, 2009 1 Organic Packaging Substrate Workshop Work

More information

Supplementary Information

Supplementary Information Supplementary Information Wireless thin film transistor based on micro magnetic induction coupling antenna Byoung Ok Jun 1, Gwang Jun Lee 1, Jong Gu Kang 1,2, Seung Uk Kim 1, Ji Woong Choi 1, Seung Nam

More information

UNIVERSITY OF UTAH ELECTRICAL ENGINEERING DEPARTMENT LABORATORY PROJECT NO. 3 DESIGN OF A MICROMOTOR DRIVER CIRCUIT

UNIVERSITY OF UTAH ELECTRICAL ENGINEERING DEPARTMENT LABORATORY PROJECT NO. 3 DESIGN OF A MICROMOTOR DRIVER CIRCUIT UNIVERSITY OF UTAH ELECTRICAL ENGINEERING DEPARTMENT EE 1000 LABORATORY PROJECT NO. 3 DESIGN OF A MICROMOTOR DRIVER CIRCUIT 1. INTRODUCTION The following quote from the IEEE Spectrum (July, 1990, p. 29)

More information

The Cornell NanoScale Facility: NNCI Overview

The Cornell NanoScale Facility: NNCI Overview The Cornell NanoScale Facility: NNCI Overview Prof. Christopher Ober Lester B. Knight Director CNF: founded 1977 CNF Highlights 2017 is CNF s 40 th Anniversary as an NSF funded User Facility Using NNCI

More information

Infineon at a glance

Infineon at a glance Infineon at a glance 2017 www.infineon.com We make life easier, safer and greener with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the

More information

Printed Electronics - Quo Vadis? What is Printed Electronics et Quo Vadis?

Printed Electronics - Quo Vadis? What is Printed Electronics et Quo Vadis? Printed Electronics - Quo Vadis? Emil J.W. List Institute of Solid State Physics Graz University of Technology NanoTecCenter Weiz Forschungsgesellschaft mbh Agenda Introduction Motivation What is Printed

More information

More specifically, I would like to talk about Gallium Nitride and related wide bandgap compound semiconductors.

More specifically, I would like to talk about Gallium Nitride and related wide bandgap compound semiconductors. Good morning everyone, I am Edgar Martinez, Program Manager for the Microsystems Technology Office. Today, it is my pleasure to dedicate the next few minutes talking to you about transformations in future

More information

Bayer MaterialScience Functional Films: Printed Polymer Electronics

Bayer MaterialScience Functional Films: Printed Polymer Electronics Bayer MaterialScience Functional Films: Printed Polymer Electronics Dr. Karsten Dierksen Bayer MaterialScience Head of Functional Films Printed Electronics & Functional Materials D-51368 Leverkusen, Tel.

More information

GEAR 2030 WORKING GROUP 2 Roadmap on automated and connected vehicles

GEAR 2030 WORKING GROUP 2 Roadmap on automated and connected vehicles GEAR 2030 WORKING GROUP 2 Roadmap on automated and connected vehicles Europe has a very strong industrial basis on automotive technologies and systems. The sector provides jobs for 12 million people and

More information

Company Profile.

Company Profile. Company Profile www.synova.ch Innovative Micro-Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-theart cutting and dicing solutions as well

More information

Power Matters Microsemi SiC Products

Power Matters Microsemi SiC Products Microsemi SiC Products James Kerr Director of Marketing Power Discrete Products Microsemi Power Products MOSFETs (100V-1200V) Highest Performance SiC MOSFETs 1200V MOSFETs FREDFETs (MOSFET with fast body

More information

Medical Electronics Packaging Challenges/ Solutions inemi Medical Electronics Workshop May 5, Revised Page 1

Medical Electronics Packaging Challenges/ Solutions inemi Medical Electronics Workshop May 5, Revised Page 1 Medical Electronics Packaging Challenges/ Solutions inemi Medical Electronics Workshop May 5, 2011 Santa Clara, CA Susan Bagen Page 1 Medical Electronics Industry Gradual production growth. Healthy growth

More information

Printing versus coating technology Which way Printed Electronics with solution coating will go?

Printing versus coating technology Which way Printed Electronics with solution coating will go? Printing versus coating technology Which way Printed Electronics with solution coating will go? Frank Schäfer, Andrea Glawe, Dr. Daniel Eggerath, KROENERT GmbH& Co KG, Schuetzenstrasse 105, 22761 Hamburg

More information