inemi 2011 Roadmap, Medical/Auto PEG European Webinar - Introduction Chuck Richardson March 19, 2010

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1 inemi 2011 Roadmap, Medical/Auto PEG European Webinar - Introduction Chuck Richardson March 19, 2010

2 Some Definitions TWG - Technology Working Group Develops the roadmap technology chapters Presently 21 groups PEG Product Emulator Group Virtual Product : future product attributes plus key cost and density drivers Portable / Consumer Office / Large Business Systems Netcom Systems Medical Products Automotive Aerospace & Defense 1

3 Methodology Available to Market Place Competitive Solutions Technology Evolution Government Roadmap Research Product Needs Disruptive Technology Academia Global Industry Participation GAP Analysis No Work Required inemi Members Collaborate Projects Industry Solution Needed 2

4 2009/11Product Emulator Groups Product Emulator Chair(s) 2009 Chair(s) 2011 Automotive Products Jim Spall, Delphi Jim Spall Medical Products Anthony Primavera, Boston Scientific Anthony Primavera, Micro Systems Eng. Bill Burdick, GE Research Consumer / Portable Products Susan Noe, 3M Shahrokh Shahidzadeh, Intel Office/Large Business System Products David Lober, Intel David Copeland, Sun David Lober, Intel Network, Data, Telecom John Duffy, Cisco Need Chair Aerospace/Defense William Murphy, Lockheed Martin Mradul Mahrotra, Raytheon 3

5 Portable / Consumer Office / Large Systems Defense and Aerospace Medical Products Automotive Netcom Roadmap Development Product Sector Needs Vs. Technology Evolution TWGs Product Emulator Groups Semiconductor Technology Business Processes Prod Lifecycle Information Mgmt. Design Technologies Modeling, Thermal, etc. Manufacturing Technologies Board Assy, Test, etc. Comp./Subsyst. Technologies Packaging, Substrates, Displays, etc. 4

6 2011 Technology Working Groups (TWGs) Modeling, Simulation, and Design Connectors RF Components & Subsystems Test, Inspection & Measurement Solid State Illumination Large Area, Flexible Electronics Semiconductor Technology Photovoltaics MEMS/ Sensors Packaging & Component Substrates Passive Components Optoelectronics Thermal Management Mass Storage (Magnetic & Optical) Ceramic Substrates Energy Storage & Conversion Systems Organic PCB Board Assembly Final Assembly Customer Information Management Environmentally Conscious Electronics Red=Business Green=Engineering Blue=Manufacturing Blue=Component & Subsystem 5

7 2011 Preliminary Roadmap Schedule 3Q2009: Recruit Product Sector Champions, teams and refine data charts/begin 2011 Roadmap Newsletter & send 2009 PEG chapters 8/1/09 3/4Q09: Product Sector Champions Develop Emulators September 9, 2009 Teleconference with P.E. Group Chairs September 17, 2009 Web based meeting TWG/PEG Chairs (key attributes) October 9, Roadmap PEG Kick-off with PEG/TWG/TC at SMTAI January 8, 2010 Web based Teleconference with TC on PEG Emulator review 2009 Word chapter, format, Exec. Summary ed to each TWG chair (Word) 1/4/2010 Organizing Teleconference with TWG Chairs 1/11/2010: February 23-24, 2010 PEG Workshop/TWG Kick-off CA: Product Sector Tables Complete PEG Chapter rough drafts written Cross cut issues are initially addressed March 19, 2010 European Webinar on Auto, Medical PEG Review 6

8 2011 Preliminary Roadmap Schedule - Continued April 9, 2010 TC/PEG/TWG face to face chapter status review meeting at APEX May 6, 2010 Telecon With TWG Chairs, Preliminary PEG Chapters Due June 1, 2010 N.A. Roadmap Workshop at ECTC, Las Vegas, NV June 16, 2010 European Roadmap Workshop IMEC, Leuven, Belgium June 8, 2010 Asian Roadmap Workshop TPCA, Taiwan July 1, 2010 TWG Drafts Due for TC Review August 4, 2010 TC Face-to-Face Review with TWG Chairs at TBD September 22, 2010 Final Chapters of Roadmap Due October, 2010 Council of Members Briefing SMTAI October 31, 2010 Edit, Prepare Appendix A-D, Executive Summary November 20, 2010 Go To Press December 5, 2010 Ship to Members April, 2011 Industry presentation at APEX 7

9 Ten Contributing Organizations Semiconductors inemi / ITRS / MIG Packaging TWG inemi / MIG / ITRS MEMS TWG inemi / IPC / EIPC Organic PWB TWG Organic Printed Circuit Boards Interconnect Substrates Ceramic inemi Board Assembly TWG inemi Roadmap inemi Information Management TWG Supply Chain Management inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage 8

10 inemi 2011 Roadmap, Automotive PEG European Webinar Jim Spall, Delphi March 19, 2010

11 Automotive Product Emulator Situation Analysis Business Issues Reduced North American volume in 2009 (worst year in 30 years) Over capacity in North America resulted in the bankruptcy of GM and Chrysler Many assembly plants were closed to adjust to the lower volume in North America Permanent shift away from trucks and large SUV s» Reduced content because these vehicles carried high option content 200 U.S. suppliers permanently closed in U.S. suppliers went bankrupt in

12 Automotive Product Emulator Business Issues Western Europe sales tracking at a full-year rate near 14.7 million units for volume could be reduced to 13.7 million units» Western Europe s patchwork of 12 scrappage programs are ending» Germany and Italy have ended their versions» France and Britain are phasing out theirs» Spain s remains in place, but economy is too weak for that to make much of a difference 2008 volume was 15.4 million units Japan sales declined to the lowest level in 38 years (2.9 million units) China exceeding the U.S. in auto output in 2009 (12 million units) Up 34 percent from a year earlier

13 Automotive Product Emulator Increased Corporate Average Fuel Economy to 35.5 mpg by 2016 Downsizing of engines and increased use of Gas Direct injection Increased use of turbo-charging Researchers project 14 million electrified vehicles annually by 2020» 1.5 million full Electric Vehicles (EV)» 1.5 million Plug-in Hybrid Electric Vehicles (PHEV)» 11 million Hybrid Electric Vehicles (HEV)» Volume will based on operating cost, carbon benefits, range limitations, cost of fuel and government incentives for EV sales

14 Automotive Product Emulator Technical Issues Shift to Hybrid Electric Vehicles (HEV), Plug-in Hybrid Electric Vehicles (PHEV), and Electric Vehicles (EV) Invention required to reach the battery cost target of $250/kWh» Today s cost $1,000 -$1,200/kWh Key components that are in need include: power devices, bulk capacitors, inductors and transformers, cooling structures, motor drive microprocessors, high current connectors, current sensors, gate driver ICs, battery management ICs, busbars, and enclosures. Increased use of MEMS in automotive Accelerometers Gyroscopes Pressure Air Flow 13

15 Automotive Product Emulator 12.3 inch reconfigurable displays for the instrument panel LED lighting used internal and external lighting Connected Vehicle Key Drivers: cost, reliability, size Cost is still the main key driver for automotive Competitive cost will get you an opportunity to win a program Reliability is a given in the automotive sector Failure to deliver will result in no future business Toyota situation will test its loyal customer base Size is a benefit because some vehicles having 100 electronic controllers and space is limited

16 Automotive Product Emulator Chart 2009 vs forecast differences Circuit board use of 8 layer with blind vias Lower memory prices in 2011 version Increased use of MEMS sensors (Identified the types being used in the emulator) The use of 0201 components in the future Higher resolution and larger displays being used (12.3 displays for the instrument cluster) Nand Flash used for Hard Drive emulation Increased use of Built In Self Test (BIST) and Boundry Scan Quicker conversion to lead free solder Greater thermal demands due to the electrified vehicle

17 Automotive Product Emulator Critical (Infrastructure) Issues Identify Paradigm Shifts The shift to electrified vehicles The connected vehicle The use of reconfigurable displays Provide Vision of Final Assembly Process Varied - dependent on the type of product (sealed underhood versus unsealed passenger compartment) Discuss System Test More in depth to eliminate problems in the field Example Toyota Prius brake issue Discuss Environmental Issues Lead free conversion occurring sooner than expected

18 Automotive Product Emulator Prioritized Technology Requirements and Trends: Research, Development, Implementation Components related to the Electrified Vehicle Lower cost batteries ($250/kWh) Improved thermal interface materials Improved power devices, capacitors, inductors, tranformers, battery management ICs, gate drive ICs Infrastructure for Electrified Vehicles Limits to energy storage Long recharging times Updated electrical grid Contributors Many engineers at Delphi

19 inemi 2011 Roadmap, Automotive PEG European Webinar Q & A Jim Spall, Delphi March 19, 2010

20 inemi 2011 Roadmap, Medical PEG European Webinar Anthony Primavera, Biotronik March 19, 2010

21 Medical Market United States 65+ year old population = 40M (2009) Global 65+ year old population will triple by from 516M (2009) to 1.53B (2050) 80+ year old population will increase from 40M (2009) to 219M (2050) Currently, the U.S. spends 1.75 Trillion dollars 15% of 2009 GDP 25% of GDP 2015 It is estimated that current annual spending on medical devices / electronics is 70 to 100 Billion dollars 20

22 Variation in Sector Since the product types within the sector are varied, medical products were grouped into three general categories. 1) Implanted products (devices implanted in a human body) Strict regulatory procedures Driven by battery life (low power loss) this limits the use of certain components such as DRAM due to high energy consumption Validation and traceability Long term reliability paramount Long development cycles, primary assembly and design by OEMs 2) Portable products (devices that are easily transported) Cost parity with consumer / portables Dynamic market, needs fast response 9 to 24 month product cycle time Mixed regulatory environment Mostly outsourced assembly and design (SEA) Diagnostic Ultrasound in PDA size.. and smaller.. form factors 3) Diagnostic imaging devices and large scale equipment, e.g., MR, CT Larger scale (often similar to servers or telecom equipment) Often requires thermal management and heat sinking Utilizes commercial off-the-shelf components, when available Development cycle is shorter than implantables Application and design well suited to EMS environment Often does not require clean room or sterile assembly floor 21

23 Areas of Opportunity in Medical Market IMPLANTABLE PRODUCTS PERSONAL HEALTHCARE ENDO- VASCULAR SOLUTIONS EQUIPMENT CARDIAC FOR SURGERY SURGERY DIAGNOSTIC AND MONITORING Pacemakers Pacemakers AICDs AICDs Leads Cochlear Ablation devices Pin Catheters and drug Stents Diagnostics PTCA Systems Glucose Intravascular Brachytherapy Thermometers Atherectomy Telemedicine Home Health Care AAA Systems Peripheral AAA Stents Systems Peripheral Stents Neurovascular Neurovascular Beating Heart Bypass Surgery Surgery Minimally- - Invasive Vein Vein Harvesting Beating Heart Bypass MRI Sonogram Surgery EKG, Minimally- EMG - Invasive Blood Vein Analyzer Harvesting DATA TRANSFER AND ANALYSIS 22

24 Medical PEG: 2011 Chapter Focus Market Environment and Economics Of Medical Electronics Market Emerging markets expected to have double digit growth. Focus on lower cost diagnostic equipment for developing nations and rural areas. Regional assembly, design and distribution expected to increase in India and China. High Growth of Tele-Medicine using multi functional portable devices. Continued migration from prescriptive to preventive medicine will drive increase in portable/wearable medical monitoring devices. Unknown business implications and potentially increased regulatory changes could materialize if health care reform legislation is enacted

25 Abbot Laboratories Agilent Life Science GE Healthcare Hoffman-La Roche Ltd Philips Medical Systems Siemens Medical Solutions Toshiba Medical Systems Varian Medical Systems Revenue in Billions $ Medical Market Market Size, Electronics Revenue 2006: 62.5 B$, 2007: 69.1B$, 2008: 75.6B$ 9.4% Change Medical Electronics Revenue Company Source: G Dan Hutcheson wesrch.com 24

26 Another Estimate of Market Size Overall market is approximately 70B$ (Non-IT), growing at a predicted 4.1% per year $100 $Bn ls mw-med rev Prismark $80 4.1% CAAGR $84Bn $66Bn $60 $40 $20 $0 $60Bn $66Bn 5% of Electronics Industry 2007 Prismark 70% 60% 50% 40% 30% 20% 10% 0% GEOGRAPHIC DISTRIBUTION 54% Americas 8% Japan 25% Europe 1 3% Asia/ROW Note: Tony s opinion is this is still too low a predicted growth rate. 25

27 Market Observations Many market size predictions include mostly large scale diagnostic and system equipment suppliers. INEMI Medical PEG is not sufficiently represented in market size. Revenue from the other market sectors within medical not well estimated, e.g., implantables Medtronic St Jude Medical Boston Scientific Biotronik ELA Group 20+ B$ / year Cochlear Med-el Advanced Bionics Others 26

28 Sector Overview PEG: missing items, suggested changes, et al. PCBs: one layer flex is missing, e.g., glucose strips PCBS: suggest changing from FR4 and state-of-the-art in technology column to input of actual substrate used. Reliability: pressure environment missing (hyperbaric chamber and scuba testing) implantables Reliability: MRI safe, compatibility Reliability: bends/folds mechanical robustness Business: how to capture regional design / manufacturing for point of use applications. Business: capture supply chain leaders in component / PCB area. Maybe a survey of players in each respective market, e.g., who makes Volt caps? Or, which companies make HDI flex? can be part of PEG, TIG or TWG? 27

29 Trends and Market Drivers in Medical Increased health awareness and preventive care leading to an increased demand for diagnostic and imaging systems. Healthcare demands of 78M US baby boomers, et al. clinician shortage, global aging, technology expectations Development of higher power systems capable of higher patient throughput, higher resolution, and a greater ability to discriminating individual tissue types, et al. Medical video imaging for specific applications 28

30 Current Market Drivers in Medical Implantable therapy devices continue to be a growing market area and have expanded beyond pacemakers and implantable cardioverter defibrillators (ICDs). The average YoY growth rate for implantable products has been between 15-18% for the last 10 years. A shift towards remote monitoring has increased demand for external wireless telemetry Example: An estimated 200,000 patients are currently enrolled in home / remote monitoring system. These systems are communication devices that interact with the implanted device and a host network system. 29

31 Digital Health In the past 10 years, growth, innovation and miniaturization have lead to major advances in medical electronics manufacturing and the therapies they deliver. Patient care enhancement - New and Unique Medical Products - Monitor Systems - Sensor Technology - Improved Diagnostics Wireless technology for data transfer - Instant and remote monitoring - Power transfer by RF - Off-load computing and data storage to remote host system, outside the device. 30

32 Diagnostic Imaging Patient-centric, clinician-centric environment Comfort Workflow Demands for higher resolution maybe abating Demands for greater imaging volumes not abating Anatomy defines package volumes More bits per cubic inch translates to higher functional densities Portable systems for baseline diagnostics 31

33 Medical PEG Roadmap Highlights Example of Differences: Dominant US regions: MA, MN, CA, AZ Dominant EU regions: Ireland and Germany Dominant SEA regions: Malaysia, Singapore Supply Chain Locations System Design N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia) System Fabrication N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia) Processor Design/Fab N.America/Europe N.America/Europe N.America/Europe Asia Asia Implantable, (portable and externals mostly Asia) Display Design/Fab Asia Asia Asia Asia Asia externals Memory Subsystems Asia Asia Asia Asia Asia externals Component Design N.America/Europe N.America/Europe Asia Asia Asia Implantable, (portable and externals mostly Asia) Board Assembly N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia) PCB Fabrication Europe/Asia Europe/Asia Europe/Asia Asia Asia All Component Procurement N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia) Final Product Assembly N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia) Future Dominant Regions: China, India 32

34 Medical PEG Roadmap Highlights Example of differences Consumer portables are weeks to years; implantables are years Heavily influenced by regulatory Product qualification time lengthy Long production times (Geography Dependant) Cycle Time Typical Product/Best Case Time to add EMS Elapsed time for qualified, production product delivery once a supplier is chosen. Includes qualified documentation system. Weeks 12 (104) 8 (104) 6 (78) 6 (78) 4 (78) Elapsed time from alpha proto release to production release w/ long lead & all alpha parts available Weeks 16 (104) 14 (104) 12 (78) 10 (78) 6 (78) NPI Cycle Time Product Production Life Length of time a product is produced Years Externals, (Implantables in brackets) Consumer and portable, (implantable and Class 3 externals in brackets) 7 year minimum in some geographic locations 33

35 Estimated PCB Needs/Costs PCB Technology (FR4 baseline) Cost Comments 2 layer flexible $ per cm Implantable materials, Connectors, sub-assemblies, 0.2 components, etc. 2 layer Rigid $ per cm layer flex $ per cm Portables, Sensors, sub assemblies, components 4 layer flexible $ per cm implantables 3d packaging, subassemblies, implantables Implantables 6 layer flex (with micro vias) $ per cm implantables - High Power 4 layer conventional $ per cm External / Consumer products 4 layer - embedded capacitor / resistor $ per cm implantables 6 layer conventional $ per cm layer w/ microvia $ per cm externals, patient monitoring, wearables implantables, patient monitoring, wearables Wearables 6layer rigid (with micro vias) $ per cm implantables - low power 6 layer, blind/buried $ per cm implantables - low power 6 layer - embedded capacitor / resistor $ per cm Implantables Large Scale 14 layer, no blind/buried $ per cm Diagnostic, telecom 28 layer, blind & buried vias $ per cm High end imaging, high speed telecom, data storage 34

36 Estimated Assembly Costs Implantables have very special assembly needs Traceability Hermetically Sealed Clean Room Assembly Assembly Costs Cost Comments Board Assembly Cost per I/O Implantable costs are several X cost due to process and equipment validation, traceability requirements and clean room 0.19 assembly Final Product Assembly Cost $/unit Can be 10 to 20X cost for implantables, due to welding and hermetic container assembly, clean room requirements and 5 traceability, Packaging Cost Comments IC Package Cost per I/O Externals / Imaging products Package Cost (High Density Ceramic/w/ Area Connector) per I/O Externals / Imaging products Package Cost (High Density µvia Laminate w/ Area Connector) per I/O Externals / Imaging products Connector Cost per I/O Externals / Imaging products Energy Cost $/Wh Externals / Imaging products Memory Cost (Flash) $/MB Externals / Imaging products Memory Cost (SRAM) $/MB Externals / Imaging products Cost of Test as a ratio to assembly ratio Externals / Imaging products Driven by Diagnostic and Externals 35

37 Product Needs Size constraints on implantables will drive M0402, 1005 and embedded passives in next few years. Parameter Descriptions Metric Passive Components - Implantables Passive Devices: State of the Art (productio Type/Size 0201 case 0201 case M0402 M case Embedded Passives Passives fabricated into th# per sq. cm Max. Ohms State of the Art (productio ohms / sq M 1.2M Max. Capacitance State of the Art (productio μf / sq Min. % tolerance State of the Art (productio % Passive Components - Externals Passive Devices: State of the Art (productio Type/Size 0201 case 0201 case 0201 case 0201 case 0201 case Embedded Passives Passives fabricated into th# per sq. cm NA NA NA NA NA Max. Ohms State of the Art (productio ohms / sq M Max. Capacitance State of the Art (productio μf / sq Min. % tolerance State of the Art (productio % Major Focus currently on Medical Grade Capacitors. inemi Medical Component Project Currently underway. Goal: determine Reliability test requirements for Medical Grade classifications 36

38 Reliability Needs are Driven by Implantables Product Needs Reliability - Implantable Metric Temperature Range Deg C - Deg C "-40 to 80 "-40 to 80 "-40 to 80 "-40 to 80 "-40 to 80 Product Screening Test Temperature Range Deg C - Deg C "-55 to 150 "-55 to 150 "-55 to 150 "-55 to 150 "-55 to 150 Qual.Test Temperature Range Deg C - Deg C "0 to 100 "0 to 100 "0 to 100 "0 to 100 "0 to 100 Ship / Shock Test Mechanical Flex Test Number of Cycles Cycles to Pass 250,000 1M+ 2M+ 2M+ 2M+ Simulate Sub-pectoral implant movement Vibrational Environment (PWB level) G²/Hz Random Vibration Use Shock Environment Gs & ms to Pass 500G 3 axis 500G 3 axis 1000G 1000G 1000G Impact Resistance Altitude Feet 40,000 40,000 40,000 45,000 45,000 Must be Gamma Emmision Safe for Shipping Medical often uses Harsh Condition Testing for reliability 1000G drop / shock 3 Axis 2,000,000 plus bend / deflection cycles -55 to + 150C thermal cycle testing Scuba and hyper baric chamber 37

39 Input For/From Others External Systems rely heavily on other system components Displays, mass storage, wireless and hard-wire data transfer systems, telecom, network systems. Implantables Auto & Military Input to harsh environment reliability. Especially in shock, impact and long term low level fatigue Portables wireless medical device systems now becoming standard. Personal data device transmits implanted or worn device output to medical monitoring facility and physician. SiP Need to better correlate with medical product needs. Connector group need to help drive header / wire attachment process away from manual soldered wires to connector attachment. 38

40 Medical Market: Example Technology Shock Delivered Tachy Arrhythmia Therapy Extending the lives of people whose hearts beat too fast Implantable Defibrillators US Annual 350,000 people newly indicated for this therapy 100,000 + defibrillator implants per year 39

41 Medical Market: Example Technology Pacemakers Currently the largest medical device market US Annual 750,000 patients diagnosed with this condition annually 500,000 implants annually Heart Failure Therapy 5 year mortality rates as high as 50% Affects > 14M people (US, Europe & Japan) STEROID COLLAR TINES ELECTRODE GUIDE WIRE Lead Technology 40

42 Digital Health: New Horizons Miniaturization / Nano - MEMS - Self or bio powered systems - Localized measurement ex lab on a chip - Gaseous and biological sensors military and homeland security applications. MEM s and Implantable Devices are a rapidly growing market segment. New Research / Growth Areas - Bio-chemical sensors - Alternative power and rechargeable Batteries - Wearable, patient monitoring systems - RF telemetry, offloading diagnostics from primary device - Nano-scale materials, coatings and conductors - New High Density Batteries MnO2, may lead to 10+ year life. - Very small scale systems: Battery for artificial retina (Sandia) Technology advancements are predicated on resolving complex challenges including materials management, energy constraints, data security, reliability and above all, patient safety. 41

43 Attribute Needs ( ) Medical PEG Summary Major differences from Last Roadmap - Focus on implantable devices other than Life Critical Products These products still require high reliability due to the implanted nature of their applications. - Miniaturization of large diagnostic equipment for low cost target markets. Much larger focus on cost. - Portable equipment and wearable electronics have similar needs to many mobile computing and hand held commercial equipment. Huge potential market for Home Medical Electronics Status of Completion % spreadsheet completion. - Bill Burdick (GE Research) co-chair PEG / TIG - Celeste Fralick (Intel) and Vivian Zhu (TI) have been helping! - Targeting spreadsheet completion and 75% of chapter by March End. 42

44 inemi 2011 Roadmap, Medical PEG European Webinar Q & A Anthony Primavera, Biotronik March 19, 2010

45 inemi 2011 Roadmap, Medical/Auto PEG European Webinar - Summary Grace O Malley, inemi Manager Europe March 19, 2010

46 2010 inemi Roadmap European Workshop 2011 inemi Roadmap European Workshop Wednesday, 16 June, :00-16:30 IMEC Headquarters Leuven, Belgium REGISTRATION DEADLINE: June 12 (earlier if meeting reaches capacity) To register, go to Objectives The purpose of this meeting is to: Discuss drafts of roadmap chapters covering primary technology and infrastructure areas. Obtain European input to these draft chapters. Ensure inclusion of key European issues in the 2011 Roadmap. 45

47 2010 inemi Roadmap European Workshop Preliminary Agenda 08:30 09:00 Continental Breakfast 09:00 09:20 Welcome 09:20 09:40 IMEC Welcome/Overview 09:40 10:00 Roadmap Process Overview 10:00-15:00 Technology Reports (20 minutes each) Product Emulator Group Reports: 10:00 10:20 Medical PEG Report 10:20 10:40 Portable / Consumer PEG Report 10:40 11:00 Discussion/Break Technical Working Group Reports: 11:00 11:20 Environmentally Conscious Electronics 11:20 11:40 Solid State Illumination / Photovoltaics 11:40 12:00 Large Area, Flexible Electronics 12:00 13:00 Lunch/Discussion 13:00 13:20 Board Assembly 13:20 13:40 Final Assembly 13:40 14:00 Interconnect Substrates Ceramic 14:00 14:20 Discussion/Break 14:20 14:40 Packaging & Component Substrates 14:40 15:00 Interconnect PCB - Organic 15:00 15:15 Discuss Interest in TWG/PEG Participation 15:15 15:30 Summary / Next Steps 15:30 16:30 Social Gathering 46