SSF6602. Main Product Characteristics. Features and Benefits. Description. Absolute Maximum Ratings (T A =25 C unless otherwise specified)

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1 Main Product Characteristics D2 S1 V (BR)DSS 30V -30V D1 58mΩ@10V 100mΩ@-10V G2 R DS(on)MAX 95mΩ@4.5V 150mΩ@-4.5V G1 S2 I D 3.5A -2.7A SOT-23-6L Schematic Diagram Features and Benefits Advanced MOSFET process technology Ideal for battery operated systems, load switching, power converters and other general purpose applications Low on-resistance with low gate charge Fast switching and reverse body recovery Description The utilizes the latest techniques to achieve high cell density and low on-resistance. These features make this device extremely efficient and reliable for use in high efficiency switch mode power supply and a wide variety of other applications. Absolute Maximum Ratings (T A =25 C unless otherwise specified) Parameter Symbol N-Channel P-Channel Unit Drain-Source Voltage V DS V Gate-Source Voltage V GS ±20 ±20 V Continuous Drain Current T A =25 C T A =70 C I D Pulsed Drain Current 1 I DM A Maximum Power Dissipation T A =25 C P D 1.2 W Operating Junction and Storage Temperature Range T J,T STG -55 To To +150 C Thermal Characteristics Thermal Resistance, Junction-to-Ambient 2 R θja N-Ch 104 C/W Thermal Resistance, Junction-to-Ambient 2 R θja P-Ch 104 C/W A 1/10

2 N-Channel Electrical Characteristics (T A =25 C unless otherwise specified) Off Characteristics Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS VGS=0V I D =250μA V Zero Gate Voltage Drain Current I DSS V DS = 30V,V GS =0V μa Gate-Body Leakage Current I GSS V GS =± 20V,V DS =0V - - ±100 On Characteristics 3 Gate Threshold Voltage V GS(th) V DS =VGS,I D =250μA V Drain-Source On-State Resistance R DS(ON) V GS =10V, I D =3.5A mω V GS =4.5V, I D =2A mω Forward Transconductance g FS V DS =5V,I D =3.1A S Dynamic Characteristics Input Capacitance C lss PF V DS =15V,V GS =0V, Output Capacitance C oss PF F=1.0MHz Reverse Transfer Capacitance PF Switching Characteristics C rss Turn-on Delay Time t d(on) ns Turn-on Rise Time t r V DD =15V, R L =3Ω ns Turn-Off Delay Time t d(off) V GS =10V,R GEN =6Ω ns Turn-Off Fall Time t f ns Total Gate Charge Q g V DS =15V,I D =3.5A, nc Gate-Source Charge Q gs V GS =10V nc Gate-Drain Charge nc Drain-Source Diode Characteristics Diode Forward Voltage 3 Diode Forward Current 2 Q gd VSD VGS=0V,I S =3.5A V IS A na Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 2/10

3 P-Channel Electrical Characteristics (T A =25 C unless otherwise specified) Off Characteristics Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS VGS=0V I D =-250μA V Zero Gate Voltage Drain Current I DSS V DS =-30V,V GS =0V μa Gate-Body Leakage Current I GSS V GS =± 20V,V DS =0V - - ±100 na On Characteristics 3 Gate Threshold Voltage V GS(th) VDS=VGS,I D =-250μA V Drain-Source On-State Resistance R DS(ON) V GS =-10V, I D =-2.7A mω V GS =-4.5V, I D =-2A mω Forward Transconductance g FS V DS =-10V,I D =-2.7A 2 - S Dynamic Characteristics Input Capacitance C lss PF V DS =-15V,V GS =0V, Output Capacitance C oss PF F=1.0MHz Reverse Transfer Capacitance PF Switching Characteristics C rss Turn-on Delay Time t d(on) ns Turn-on Rise Time t r V DD =-15V,R L =15Ω ns Turn-Off Delay Time t d(off) V GS =-10V,R GEN =6Ω ns Turn-Off Fall Time t f ns Total Gate Charge Q g nc Gate-Source Charge Q gs V DS =-15V,I D =-2.7A,V GS =-10V nc Gate-Drain Charge Drain-Source Diode Characteristics Diode Forward Voltage 3 Q gd VSD nc VGS=0V,I S =-2.7A V Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 3/10

4 N-Channel Typical Electrical and Thermal Characteristic Curves Vgs Rgen Vin G D Vdd Rl Vout t d(on) V OUT t on t r INVERTED t off t t d(off) f) f S V IN 50% 50% PULSE WIDTH Figure 1 Switching Test Circuit Figure 2 Switching Waveforms ID- Drain Current (A) ID- Drain Current (A) V DS Drain-Source Voltage (V) Figure 3 Safe Operation Area ID- Drain Current (A) RDS(ON) On-Resistance(Ω) T J -Junction Temperature( C) Figure 4 Drain Current V DS Drain-Source Voltage (V) Figure 5 Output Characteristics I D - Drain Current (A) Figure 6 Drain-Source On-Resistance 4/10

5 N-Channel Typical Electrical and Thermal Characteristic Curves V GS Gate-Source Voltage (V) Figure 7 Transfer Characteristics T J -Junction Temperature( C) Figure 8 Drain-Source On-Resistance V GS Gate-Source Voltage (V) Figure 9 R DS(ON) vs V GS V DS Drain-Source Voltage (V) Figure 10 Capacitance vs V DS VGS Gate-Source Voltage (V) Is- Reverse Drain Current (A) RDS(ON) On-Resistance(Ω) C Capacitance (pf) ID- Drain Current (A) Normalized On-Resistance Q g Gate Charge (nc) Figure 11 Gate Charge 5/10 V SD Source-Drain Voltage (V) Figure 12 Source- Drain Diode Forward

6 N-Channel Typical Electrical and Thermal Characteristic Curves r(t),normalized Effective Transient Thermal Impedance Square Wave Pluse Duration(sec) Figure 13 Normalized Maximum Transient Thermal Impedance 6/10

7 P-Channel Typical Electrical and Thermal Characteristic Curves Normalized On-Resistance t d(on) V OUT V IN t on t r INVERTED 50% 50% PULSE WIDTH t off t t d(off) f) f Figure 1 Switching Test Circuit Figure 2 Switching Waveforms -V DS Drain-Source Voltage (V) Figure 3 Safe Operation Area T J -Junction Temperature( C) Figure 4 Drain Current -ID- Drain Current (A) RDS(ON) On-Resistance(Ω) -ID- Drain Current (A) -ID- Drain Current (A) -V DS Drain-Source Voltage (V) Figure 5 Output Characteristics -I D - Drain Current (A) Figure 6 Drain-Source On-Resistance 7/10

8 P-Channel Typical Electrical and Thermal Characteristic Curves -V GS Gate-Source Voltage (V) Figure 7 Transfer Characteristics T J -Junction Temperature( C) Figure 8 Drain-Source On-Resistance -V GS Gate-Source Voltage (V) Figure 9 R DS(ON) vs V GS -V DS Drain-Source Voltage (V) Figure 10 Capacitance vs V DS -VGS Gate-Source Voltage (V) Is- Reverse Drain Current (A) RDS(ON) On-Resistance(mΩ) C Capacitance (pf) -ID- Drain Current (A) Normalized On-Resistance Q g Gate Charge (nc) Figure 11 Gate Charge 8/10 V SD Source-Drain Voltage (V) Figure 12 Source- Drain Diode Forward

9 P-Channel Typical Electrical and Thermal Characteristic Curves r(t),normalized Effective Transient Thermal Impedance Square Wave Pluse Duration(sec) Figure 13 Normalized Maximum Transient Thermal Impedance 9/10

10 Package Outline Dimensions SOT-23-6L Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max. A A A b c D E E e 0.950(BSC) 0.037(BSC) e L Suggested Pad Layout 10/10 Doc.UxSN3.0 Dec.2018