Operating Junction and 55 to +175 C Storage Temperature Range

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1 Feathers: dvanced trench process technology avalanche energy, 100% test Fully characterized avalanche voltage and current ID =60 BV=60V Rdson=14mΩ(max.) Description: The is a new generation of middle voltage and high current N Channel enhancement mode trench power MOSFET. This new technology increases the device reliability and electrical parameter repeatability. is assembled in high reliability and qualified assembly house. pplication: Power switching application TOP View (TO220) bsolute Maximum Ratings Parameter Max. Units I c =25 C Continuous drain current,vgs@10v 60 I c =100 C Continuous drain current,vgs@10v 42 I DM Pulsed drain current P C =25 C Power dissipation 115 W Linear derating factor 0.74 W/ C V GS Gate-to-Source voltage ±20 V E S Single pulse avalanche energy mj E R Repetitive avalanche energy TBD T J T STG Operating Junction and 55 to +175 C Storage Temperature Range Thermal Resistance Parameter Min. Typ. Max. Units R θjc Junction-to-case 1.31 C/W R θj Junction-to-ambient 62 Electrical C (unless otherwise specified) Parameter Min. Typ. Max. Units Test Conditions BV DSS Drain-to-Source breakdown voltage 60 V V GS =0V,I D =250μ R DS(on) Static Drain-to-Source on-resistance mω V GS =10V,I D =30 V GS(th) Gate threshold voltage V V DS =V GS,I D =250μ g fs Forward transconductance 60 S V DS =5V,I D =30 I DSS I GSS 2 V DS =60V,V GS =0V Drain-to-Source leakage current μ V DS =60V, 10 V GS =0V,T J =150 C Gate-to-Source forward leakage 100 V GS =20V n Gate-to-Source reverse leakage -100 V GS =-20V Silikron Semiconductor Corporation Version: 2.3 page 1of5

2 Q g Total gate charge 45 Q gs Gate-to-Source charge 4 Q gd Gate-to-Drain("Miller") charge 15 t d(on) Turn-on delay time 14.6 t r Rise time 14.2 t d(off) Turn-Off delay time 40 t f Fall time 7.3 C iss Input capacitance 1480 C oss Output capacitance 190 C rss Reverse transfer capacitance 135 nc ns pf I D =30 V DD =30V V GS =10V V DD =30V I D =2,R L =15Ω R G =2.5Ω V GS =10V V GS =0V V DS =25V f=1.0mhz Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units Test Conditions I S I SM Continuous Source Current MOSFET symbol 60 (Body Diode) showing the Pulsed Source Current integral reverse 240 (Body Diode) 1 p-n junction diode. V SD Diode Forward Voltage 1.3 V T J =25 C,I S =40,V GS =0V 3 t rr Reverse Recovery Time 33 ns T J =25 C,I F =60 Q rr Reverse Recovery Charge 61 nc di/dt=100/μs 3 t on Forward Turn-on Time Intrinsic turn-on time is negligible (turn-on is dominated by Ls + LD) Notes: 1 Repetitive rating; pulse width limited by max junction temperature. 2 Test condition: L =0.3mH, VDD = 30V,Id=37 3 Pulse width 300μS, duty cycle 1.5% ; RG = 25Ω Starting TJ = 25 C ES test circuit: Gate charge test circuit: BVdss L Vgs Vdd RL R G VDD 1m RG Silikron Semiconductor Corporation Version: 2.3 page 2of5

3 Switch Time Test Circuit: Switch Waveforms: Transfer Characteristic Capacitance On Resistance vs. Junction Temperature Breakdown Voltage vs. Junction Temperature Silikron Semiconductor Corporation Version: 2.3 page 3of5

4 Gate Charge Source-Drain Diode Forward Voltage Safe Operation rea Max Drain Current vs. Junction Temperature Transient Thermal Impedance Curve Silikron Semiconductor Corporation Version: 2.3 page 4of5

5 MECHNICL DT: TO220 PCKGE OUTLINE DIMENSION_GN E ФP ϴ1 D ФP1 D2 D1 b b1 ϴ2 ϴ3 1 ϴ4 L e c E1 Symbol Dimension In Millimeters Dimension In Inches Min Nom Max Min Nom Max b b c D D D E E ФP ФP e 2.54BSC 0.1BSC L ϴ ϴ ϴ ϴ Silikron Semiconductor Corporation Version: 2.3 page 5of5

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